6results about How to "Reliable interconnection" patented technology

The invention discloses a broadband multi-level three-dimensional vertical interconnection structure based on an HTCC technology, and belongs to the field of radio frequency front-end system integration. The structure comprises a PCB mother board, a ball grid array and an SiP module which are sequentially arranged from bottom to top, in the SiP module, the chips are distributed among different levels, and a connection mode of the chips among the different levels is set; a radio frequency signal is transmitted upwards through the PCB mother board, and after flowing through the lower-layer bare chip, the radio frequency signal is orderly transmitted upwards through the strip line and the signal via hole in the HTCC and finally transmitted to the surface-layer chip, so that a complete and efficient vertical interconnection signal transmission system is formed. According to the invention, the layout flexibility of interconnection lines among the chips is improved, the wiring crosstalk among the chips is reduced, the three-dimensional integration scene of bare chips in the HTCC is greatly widened, high-density SiP packaging is realized, and the strict technical requirements on radio frequency signal transmission, processing and chip interconnection under a complex circuit architecture can be met.

The invention discloses a high-integration blade type three-dimensional laminated subarray skeleton structure, which comprises a rear-end cold plate assembly and a front-end cold plate assembly, and is characterized in that the rear-end cold plate assembly is internally provided with a first cooling flow channel, and the front-end cold plate assembly is internally provided with a second cooling flow channel communicated with the first cooling flow channel, and the invention relates to the technical field of phased array radars. According to the high-integration blade type three-dimensional laminated sub-array framework structure, the assembling grooves are reserved in the rear-end cold plate assembly, convenience is provided for installation of the sensing modules, meanwhile, a reliable guarantee is provided for heat dissipation and cooling of the sensing modules through the first cooling flow channels, the front-end cold plate assembly and a plurality of wedge block pressing assemblies are arranged in a matched mode, and the assembly efficiency is improved. The second cooling flow channel is constructed and communicated with the first cooling flow channel while convenient conditions are provided for assembly and disassembly of the TR assembly, the requirements for high-precision positioning, convenient installation, reliable interconnection and efficient heat dissipation of all modules are met, and the TR module has the advantage of being high in integration degree.

A non-ferrous metal C-shaped plate connecting device belongs to the technical field of metal plate connection and comprises two rotating mechanisms, a driving cutter is arranged at the end I of a rotating shaft, and a protruding cutting portion is arranged on the periphery of the driving cutter; a flattening cutter is arranged at the end II of the rotating shaft, a concave extrusion portion is arranged on the periphery of the flattening cutter, and a left driven cutter and a right driven cutter with larger radiuses are coaxially installed on the two sides of the flattening cutter to form a double-cutting-edge structure. And a double-layer side panel of the non-ferrous metal C-shaped plate is arranged between the driving cutter and the double cutting edges. During working, the driving cutter and the flattening cutter rotate in opposite directions, and the cutting part and the double cutting edges are matched to cut a plate to form a narrow strip riveting part with a notch; the cutting part and the extruding part are embedded, the riveting part is extruded to expand outwards to form a riveting head, the riveting head is clamped to the notch of the C-shaped plate, and rivet-free connection is achieved. The non-ferrous metal plate cutting, extruding and riveting device does not need rivets, completes cutting, extruding and riveting at a time, saves cost, is suitable for being used in a narrow space which cannot be operated by a common blanking and riveting technology, is reliable in connection, and does not cause damage to the appearance of a non-ferrous metal plate.

The invention discloses a vertical interconnection circuit board assembly based on a tenon-and-mortise structure, relates to a microcircuit structure, and provides the scheme for solving the problem of large loss in the prior art. Comprising a first circuit board and a second circuit board, the edge of the first circuit board close to the second circuit board is provided with an insertion block; one side of the first circuit board is provided with a first insertion metal layer, and the other side is provided with a second insertion metal layer. The first insertion metal layer extends to the free end of the insertion block, and the second insertion metal layer extends to the fixed end of the insertion block; the second circuit board is provided with matched jacks at positions corresponding to the insertion blocks; one side of the second circuit board is provided with a first connection metal layer, and the other side is provided with a second connection metal layer; after the insertion block is inserted into the insertion hole, the first insertion metal layer is electrically connected with the first connection metal layer, and the second insertion metal layer is electrically connected with the second connection metal layer. And the antenna has the characteristics of simple processing, low cost, small insertion loss, large working bandwidth and the like.

The invention discloses a satellite-borne distributed double-lamination structure based on flexible PCB connection and an installation method thereof. The satellite-borne distributed double-lamination structure comprises the steps that a top heat dissipation layer is connected with a distributed PCB layer, a bottom PCB layer is connected with a bottom heat dissipation layer, and the distributed PCB layer is connected with the bottom PCB layer through a flexible connection PCB. According to the invention, flexible PCB connection is utilized, the problem of simple and reliable connection of different types of signals between layers of a satellite-borne double-laminated structure is solved, the problem of complex design of a heat dissipation structure caused by inconsistent heights of modules under a distributed double-layer design is also solved, and the method has the advantages of simplifying design, improving safe and reliable connection between layers, and improving the reliability of the heat dissipation structure. And the heat dissipation effect of each layer is optimized. The design has universality for the design of a double-laminated structure in the current satellite field, can solve the problems of inter-plate connection and heat dissipation in a narrow space in the design of a satellite system, provides effective support for improving the functional density of a satellite single machine / a subsystem / a whole satellite, and has important engineering application value.

This invention discloses a three-layer or higher inter-board connector based on snap-fit ​​buttons, belonging to the field of electrical connector technology. The connector includes a housing and a base assembly. The housing has a base mounting cavity and at least three mounting surfaces at different distances from the bottom surface for mounting printed circuit boards (PCBs). The base assembly is disposed within the base mounting cavity and contains several first snap-fit ​​electrical connection mechanisms and several second snap-fit ​​electrical connection mechanisms. PCBs mounted on the housing are electrically connected in pairs via either the first or second snap-fit ​​electrical connection mechanisms. By connecting at least three PCBs mounted on the housing in pairs via either the first or second snap-fit ​​electrical connection mechanisms, vertical interconnection between three-layer or higher PCBs is achieved.