84results about How to "Reliable interconnection" patented technology

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes a support element in contact with the microelectronic element and the compliant layer, whereby the support element overlies the outer region of the flexible substrate.

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.

A torsional vibration damper mountable to a rotatable shaft. The torsional vibration damper is a composite structure including a body formed of a polymer, such as a glass-reinforced polyamide, that surrounds an insert formed of a structurally-rigid material, such as a metal. The insert includes one or more support flanges that extend radially outward into the polymer body. When the torsional vibration damper is removed from the rotatable shaft, axial forces applied to the damper are transferred by the support flanges to the insert such that the polymer body remains substantially stress-free. In addition to, or instead of, the support flanges, the insert may include torque-locking structure that locks the polymer annular body with the insert to prevent relative rotation therebetween.

The invention discloses a personal mobile information terminal function multiplexing method by a vehicle-mounted navigator. Server side software is added into a personal mobile information terminal, client side software matched with the server side software of the personal mobile information terminal is added into vehicle-mounted navigator system software, the vehicle-mounted navigator and the personal mobile information terminal are connected through wireless fidelity (WIFI) or a universal serial bus (USB) data line or wireless Bluetooth, multiplexing of all functions of the personal mobile information terminal by the vehicle-mounted navigator can be achieved under coordination work of the server side software and the client side software, audio and video images of the personal mobile information terminal are transmitted to the vehicle-mounted navigator in real time, control commands transmitted from the vehicle-mounted navigator are received and executed by the personal mobile information terminal, and therefore the purpose that all the functions of the personal mobile information terminal can be operated and shared on a touch display screen of the vehicle-mounted navigator is achieved, that is, the vehicle-mounted navigator owns all the functions of the personal mobile information terminal.

To provide a lens barrel and an imaging apparatus for securely connecting imaging element with imaging circuit and advantageous in terms of downsizing of devices. A plurality of first connecting terminals is provided to a bottom face of an imaging element package. A flexible circuit board is constituted by an imaging element mounting section, an extending section and a connecting section. The imaging element mounting section includes a flexible circuit board and a plurality of second connecting terminals provided on a surface of the flexible circuit board so that each of the second connecting terminals match with a corresponding first connecting terminal. A metal plate is mounted at a position where the outline of the metal plate matches the outline of the package or the outline of the package is placed in the outline of the metal plate as viewed from the thicknesswise direction of the package, on the rear face of the imaging-element mounting section.

A head gimbal assembly (HGA) has an improved interconnection between a head slider and a suspension of the HGA. The interconnection is achieved by using a reverse surface of an air bearing surface of the head slider as bonding surface to provide more space for arranging more slider electrical bonding pads thereon. The head slider is mechanically and electrically connected to the suspension at the bonding surface to have good performance on shocking conditions. The suspension further has an attitude control layer located between the head slider and the suspension. The attitude control layer serves as a datum plate for the head slider lying thereon and supporting the head slider so as to ensure the head slider a good attitude and reduce variation of slider flying height. The present invention also discloses a magnetic disk drive with the improved HGA and a fabricating method for the HGA.

Circuit board assembly including an electrical connector having a connector body having a mounting side and an array of signal contacts disposed along the mounting side. The array of signal contacts has gaps formed between adjacent signal contacts of the array. The circuit board assembly also includes a circuit board having an engagement side. The circuit board includes signal vias and ground vias that are exposed along the engagement side. The circuit board assembly also includes a grounding matrix that is positioned between the engagement side and the mounting side. The grounding matrix includes a plurality of ground contacts that are interconnected in a web-like manner to define a plurality of openings, wherein the signal contacts of the electrical connector extend through the openings to engage the signal vias. The ground contacts electrically couple the ground vias of the circuit board to a ground pathway through the electrical connector.

The invention relates to the technical field of adopting an IEC61850 detection platform of a power quality monitoring terminal and a detection method thereof, in particular to a rapid detection platform conforming to the IEC61850 communication protocol of a power quality monitoring terminal and a detection method thereof. The power quality monitoring terminal is connected with a standard source FLUKE6100 and connected with an industrial tablet computer of a detection client through Ethernet or serial communication. The power quality monitoring terminal detected by the detection platform provided by the invention can completely obtain an IEC61850 communication function, and the reliable communication between the power quality monitoring terminal and a power energy quality master station is guaranteed. The platform performing IEC61850 communication detection on multiple power quality monitoring terminals at the same time is different from the traditional communication test, and performs static / dynamic consistency detection, file transfer detection, log message service detection and time synchronizing service detection on a model of the monitoring terminal.

The present invention discloses an inner reliable interconnected communication apparatus. The present invention adopts port binding technology to realize communication apparatus reliable interconnecting, through port binding two mutual backed physical network board communications to form one logical network board. In-frame service boards are all bound with tow physical network boards for realizing in-frame communication, logical network among different frames are all interconnected; physical network board in same frame also is bound; on this basic, service board or network board capable of select port communication to realize service load equipartition in port; in port fault automatically abandoning said link to realize link level protection reversion.

The invention discloses a communication equipment whose inside parts are reliably connected with each other, relating to the communication equipment, which can realize the reliable interconnection communication among frames and among veneers inside the equipment, based on the present hardware configuration and on the premise that the bandwidth utilization is assured. Wherein, a port binding technology is adopted to realize the reliable interconnection of the parts inside the communication equipment; through the port binding, two physical otter boards, which are backups for each other, are bound and communicated to form a logic otter board; service boards inside the frames are all port bound with the two physical otter boards to realize the communication inside the frames, and the logic otter boards among different frames are all interconnected; the physical otter boards inside one frame are also bound and interconnected; on such basis, the service boards or the otter boards can select ports to communicate to realize the average distribution of the traffic load at the ports, and automatically give up the link when the ports are in fault to realize the protection switching of the link grade.

The invention relates to a centrifugal force pendulum, specifically to a centrifugal force pendulum in a torsional vibration absorber of a motor vehicle power train. The centrifugal force pendulum comprises a pendulum flange and a pendulum weight. The pendulum weight comprises two weight elements which are disposed on the different axial sides of the pendulum flange and are connected with each other via a pin. The pin extends after passing through an opening in the pendulum flange and forms a chute guide device together with the opening for limiting pendulosity of the pendulum weight relative to the pendulum flange. Elastic elements are arranged between the radial surface of the pin and the weight elements for vibration damping of the weight elements when the pin is stopped at the edge of the opening.

The present invention belongs to the technical field of solar cells, and particularly relates to an interconnection structure between solar laminated cells and a solar laminated cell. The interconnection structure is used for sequentially bonding at least two cells and forming a good electrical connection. A front electrode and / or a back electrode of the cell are / is of a hollow structure. The back electrode of the previous cell is connected with the front electrode of the next adjacent cell by using conductive glue, so that a lot of front and back electrode paste is saved, and the cost of the laminated cell is lowered. For a back fragmented hollow design, the interconnection structure also can help reduce the amount of the used conductive glue and the cost of the laminated cell.

The invention provides an isolated-type DC-DC converter based on MMCs and a control method of the isolated-type DC-DC converter. The isolated-type DC-DC converter comprises a high-frequency transformer, the first MMC and the second MMC; one side of the high-frequency transformer is connected with a high-voltage flexible direct-current transmission network VSC-HVDC based on a voltage source type converter through the first MMC; the other side of the high-frequency transformer is connected with a high-voltage direct-current transmission network LCC-HVDC based on a line commutated converter through the second MMC; sub-modules of all bridge arms in the first MMC are each of a half-bridge structure; and sub-modules of all bridge arms in the second MMC are each of a full-bridge structure. The topological structure combining the full-bridge MMC and the half-bridge MMC is adopted to realize reliable interconnection of LCC-HVDC and VSC-HVDC, safe and stable operation of a hybrid direct-currentinterconnection system is supported, and a foundation is laid for the situation that new energy sources adopt the hybrid direct-current interconnection system for outgoing on large scale.

A technique for interconnecting chips by using an interconnection substrate is disclosed. The interconnection substrate includes a base substrate, a first group of electrodes on the base substrate for a first chip to be mounted, and a second group of electrodes on the base substrate for a second chip to be mounted. The interconnection substrate further includes an interconnection layer that includes a first set of pads for the first chip, a second set of pads for the second chip, traces and an organic insulating material. The interconnection layer is disposed on the base substrate and located within a defined area on the base substrate between the first group of electrodes and the second group of the electrodes.

A tool for chip removing machining, including a primary tool part and a secondary tool part. The primary tool part includes a primary connecting surface, an opposite surface, a recess that extends from the primary connecting surface toward the opposite surface, and a wall section between a bottom surface of the recess and the opposite surface. The secondary tool part includes a secondary connecting surface, a protuberance that extends from the secondary connecting surface and, in a mounted state, into the recess, the protuberance having an end surface that, in the mounted state, faces the bottom surface of the recess. A shaft part is for fixing in a machine tool. A fastening element, which, by a contractive force in the mounted state, connects the wall section with the protuberance. A center axis extends in a longitudinal direction of the tool through the primary tool part, the recess, the secondary tool part, the protuberance, and the shaft part. An insert seat is formed in at least one of the primary tool part and the secondary tool part for receiving a cutting insert. The wall section is elastically flexible and, in the mounted state, bent toward the end surface of the protuberance by the contractive force of the fastening element.

A crawler belt including a first assembly (22A) and a second assembly (22B). The first assembly (22A) has a pair of first links (25) parallel with each other, and a second assembly (22B) has a pair of second links (28) parallel with each other. The sleeves (30) at both ends of the second assembly (22B) are fitted onto the support shafts (27) at both ends of the first assembly (22A). When the total number of the assemblies is odd, a third assembly (22C) is interposed between the first and second assemblies (22A), (22B). The sleeves (30) of the second assembly (22B) are fitted onto the support shafts (27) of the third assembly (22C), and the sleeves (30) of the third assembly (22C) are fitted onto the support shafts (27) of the first assembly (22A). Consequently, even when the total number of the crawler belt assemblies is odd, the crawler belt can adopt a parallel link type.

The method adopts encoding and decoding information that can configure endpoint ID in all kind media gateway in media gateway controller. When the media gateway controller needs to analyze and identify the endpoint ID in the received instruction or to generate the endpoint ID in outgoing instruction, the relevant process is made according to the configured encoding and decoding information.

The present invention relates to a semiconductor device packaged at the wafer level such that an entire packaged device is formed prior to separation of individual devices. The semiconductor device package includes a semiconductor chip having one or more bonding pads associated with the chip and a protective layer bonded over the semiconductor chip. An insulation layer is positioned on at least side edges and a lower surface of the semiconductor chip. Interconnection / bump metallization is positioned adjacent one or more side edges of the semiconductor chip and is electrically connected to at least one bonding pad. A compact image sensor package can be formed that is vertically integrated with a digital signal processor and memory chip along with lenses and a protective cover.

Provided is a cable assembly comprises an insulative housing having a plurality of contact terminals disposed therein. A plurality of conductive wires each is terminated with the plurality of contact terminals. And a hold-down arrangement is securely attached to the housing, and includes a metallic base portion substantially covering interconnection between the contact terminals and the conductive wires. The arrangement includes a first anchors interlocked to the housing, and a second anchors extending beyond a mating interface of the housing.

A rainproof fireproof socket comprises an outer shell, an upper sealing layer, a lower layer sealing layer, a conversion layer, an O-shaped ring and a tail accessory. The conversion layer is evenly provided with a plurality of separation springs and separation sleeves in the circumferential direction. A fixing rod is arranged in the outer shell. An upper base seat and a lower base seat are fixed though a nut and a gasket. The front end is provided with a jack assembly, a guide sleeve A, a jack, a sealing sleeve, the O-shaped ring, and the guide sleeve A and the upper base seat. The O-shaped ring is arranged in the groove of the sealing sleeve and is sealed with a locking sleeve. Contact pins A and B and sealant are arranged in the upper base seat and the lower base seat and are fixed through the nut and the gasket. The tail part of the outer shell is provided with the tail accessory. The invention realizes the sealing of the socket under 10 atmospheric pressures, meets the use requirements of preventing rain and fire and sealing and has the advantages of compact structure, reliable connection, good electric property and strong practicality.

A technique for interconnecting chips by using an interconnection substrate is disclosed. The interconnection substrate includes a base substrate, a first group of electrodes on the base substrate for a first chip to be mounted, and a second group of electrodes on the base substrate for a second chip to be mounted. The interconnection substrate further includes an interconnection layer that includes a first set of pads for the first chip, a second set of pads for the second chip, traces and an organic insulating material. The interconnection layer is disposed on the base substrate and located within a defined area on the base substrate between the first group of electrodes and the second group of the electrodes.

A filter media is disclosed for removing particles from an air stream. The filter media, in an embodiment, includes a porous membrane layer and a pre-filter layer including a downstream surface and an upstream surface. The pre-filter layer is arranged with the downstream surface adjacent an upstream side of the porous membrane layer. The pre-filter layer includes a wet laid composite media having a mixture of glass fibers and synthetic fibers. A method for using the filter media in a gas turbine is also disclosed.