2results about How to "Reliable interconnection" patented technology

A non-ferrous metal C-shaped plate connecting device belongs to the technical field of metal plate connection and comprises two rotating mechanisms, a driving cutter is arranged at the end I of a rotating shaft, and a protruding cutting portion is arranged on the periphery of the driving cutter; a flattening cutter is arranged at the end II of the rotating shaft, a concave extrusion portion is arranged on the periphery of the flattening cutter, and a left driven cutter and a right driven cutter with larger radiuses are coaxially installed on the two sides of the flattening cutter to form a double-cutting-edge structure. And a double-layer side panel of the non-ferrous metal C-shaped plate is arranged between the driving cutter and the double cutting edges. During working, the driving cutter and the flattening cutter rotate in opposite directions, and the cutting part and the double cutting edges are matched to cut a plate to form a narrow strip riveting part with a notch; the cutting part and the extruding part are embedded, the riveting part is extruded to expand outwards to form a riveting head, the riveting head is clamped to the notch of the C-shaped plate, and rivet-free connection is achieved. The non-ferrous metal plate cutting, extruding and riveting device does not need rivets, completes cutting, extruding and riveting at a time, saves cost, is suitable for being used in a narrow space which cannot be operated by a common blanking and riveting technology, is reliable in connection, and does not cause damage to the appearance of a non-ferrous metal plate.

This invention discloses a three-layer or higher inter-board connector based on snap-fit ​​buttons, belonging to the field of electrical connector technology. The connector includes a housing and a base assembly. The housing has a base mounting cavity and at least three mounting surfaces at different distances from the bottom surface for mounting printed circuit boards (PCBs). The base assembly is disposed within the base mounting cavity and contains several first snap-fit ​​electrical connection mechanisms and several second snap-fit ​​electrical connection mechanisms. PCBs mounted on the housing are electrically connected in pairs via either the first or second snap-fit ​​electrical connection mechanisms. By connecting at least three PCBs mounted on the housing in pairs via either the first or second snap-fit ​​electrical connection mechanisms, vertical interconnection between three-layer or higher PCBs is achieved.