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11302 results about "Wire rod" patented technology

Adjustable width product display system

An adjustable width product display system which includes spaced-apart front and back display supports formed of an engineering plastic material, suitable for food freezer environments. Formed wire side elements, provided with transversely extending mounting portions, are slideably received in transversely disposed recesses in the plastic display supports. Each display support includes a pair of closely adjacent, parallel recesses for receiving the mounting portions in overlapping relation, providing a wide range of width adjustment to accommodate packages of different size. A wire frame, comprising a pair of elongated wire elements extending from front to back of the display system joins the two display supports in spaced relation. These wire elements also function as an underneath support for product packages confined between the side elements. Laterally adjacent elements can be connected in series by intermediate wire side supports provided with transverse mounting elements extending in opposite directions and engagable in plastic display supports on both sides. Product pusher means are easily incorporated into the product display system either in the form of a preassembled pusher device, or the use of a spring-driven pusher sled mounted on the wire elements connecting the front and back display supports. The system, is ideally suited for food freezer environment, because plastic materials are minimally present in the structure and thus can be of a suitable engineering grade material. Additionally, the open wire structure accommodates free circulation of air in a freezer compartment to help maintain the desired environment throughout the compartment.
Owner:TRION IND

Interface device and method for interfacing instruments to medical procedure simulation systems

An interface device and method for interfacing instruments to a medical procedure simulation system serve to interface peripherals in the form of mock medical instruments to the medical procedure simulation system computer to enable simulation of medical procedures. The interface device includes a housing having a mock bodily region of interest to facilitate insertion of a mock instrument, such as an endoscope tube, into the interface device. The mock bodily region of interest may be pivotable to simulate various patient orientations. The instrument is engaged by a capture mechanism in order to measure rotational and translational motion of the instrument. An actuator is disposed within the interface device to provide force feedback to the instrument. The measured motion is provided to the computer system to reflect instrument motion on the display during the simulation. Alternatively, the interface device may be configured to accommodate instrument assemblies having a plurality of nested instruments (e.g., sheath, catheter and wire), whereby the interface device individually grasps, measures manipulation of and provides force feedback to the nested instruments. In addition, the interface device may be configured to simultaneously accommodate a plurality of independently inserted instruments.
Owner:IMMERSION MEDICAL

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20050062492A1High performance functional testingHigh-temperature burnElectrical measurement instrument detailsManufacture of electrical instrumentsConvertersContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC

Embolic filter frame having looped support strut elements

An improved embolic filter frame having looped support struts. The frame configuration provides enhanced longitudinal compliance, improved sealing against a vessel wall, low profile delivery, and a short deployed length. The looped support struts have a high degree of “radial” stiffness with a low degree of “longitudinal” stiffness. In the deployed state, the frame exerts a relatively high stress onto a vessel wall to maintain an effective seal, yet remains compliant in the longitudinal direction. Minor displacements of the support wire or catheter are therefore not translated to the filter. The looped support struts elongate when tensioned and assume a compressed and essentially linear form. While constrained in this linear state by a delivery catheter, the support struts exert minimal stress onto the delivery system. The overall delivery profile and stiffness are therefore reduced. When the delivery catheter constraint is removed during deployment, the struts “snap open” and assume a looped configuration which exert a high degree of force onto the vessel wall, creating an enhanced filter to vessel wall seal. In addition, the looped struts and the central collar connecting the support struts to the support wire, are positioned essentially within the plane of the filter opening. The overall deployed length of the embolic filter is therefore reduced.
Owner:WL GORE & ASSOC INC

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20080048697A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsManufacture of electrical instrumentsElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20080047741A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsElectrical testingElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20080048690A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsManufacture of electrical instrumentsElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20080048691A1High performance functional testingHigh temperature burn in applicationsElectrical measurement instrument detailsElectrical testingElastomerContact pad
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
Owner:GLOBALFOUNDRIES INC
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