Washing-free high temperature dip soldering flux

A flux, no-clean technology, used in welding equipment, welding media, welding/cutting media/materials, etc., can solve the problems of large smoke, incomplete paint stripping, small working temperature window, etc., and achieve less residue after welding , The effect of good tinning and easy operation
CN102029488AActive Publication Date: 2011-04-27SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
Publication Date
2011-04-27
Patent Text Reader

Abstract

The invention discloses a washing-free high temperature dip soldering flux, and belongs to the technical field of fluxes. The invention aims to solve the problems in the prior art, and provides a flux which has better depainting property and welding assistance property and wider operating temperature window and meets the requirement of environmental protection. The washing-free high temperature dip soldering flux comprises the following components in percentage by weight: 1.0 to 2.0 percent of active substance, 1.0 to 3.0 percent of resin, 0.05 to 0.10 percent of surfactant, 0.2 to 1.0 percent of high boiling solvent and the balance of solvent. The flux is particularly suitable for a high temperature dip soldering process for coating tin on enameled wires with the diameter of less than 0.5mm. The dip soldering process is simple, and convenient to operate; the operating temperature window is as wide as 290-480 DEG C; the flux is clean in depainting and better in coating the tin, has little residue after welding and does not require cleaning; and during operation, the smog generated by the flux is small so as to influence the body of the operators little.
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Description

technical field

[0001] The invention relates to the technical field of flux, in particular to a high-temperature dip-soldering flux suitable for tin on enameled wires with a diameter less than 0.5 mm. Background technique

[0002] Compared with traditional Sn-Pb solder, lead-free solder has the most obvious performance difference, which is poor wetting ability of lead-free solder and high applicable soldering temperature. Therefore, with the promotion of lead-free solder, the flux used before can no longer meet the requirements, and it is necessary to develop a flux with strong wetting ability and high temperature resistance. Moreover, with the rapid development of no-cleaning flux in recent years, because it can better solve the environmental pollution caused by CFC cleaning agents and the cleaning difficulties and complex cleaning processes caused by high-density component assembly, its application range will continue to expand. getting bigger.

[0003] The flux of the p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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