Washing-free high temperature dip soldering flux

A flux, no-clean technology, used in welding equipment, welding media, welding/cutting media/materials, etc., can solve the problems of large smoke, incomplete paint stripping, small working temperature window, etc., and achieve less residue after welding , The effect of good tinning and easy operation

Active Publication Date: 2011-04-27
SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The high-temperature immersion soldering flux currently on the market has shortcomings such as incomplete paint removal, small working temperature window, and large smoke. The flux of the present invention can overcome the above shortcomings

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Hydrogenated rosin 0.80%;

[0028] Rosin 0.60%;

[0029] Adipic acid 0.50%;

[0030] Sebacic Acid 1.00%;

[0031] Dibromosuccinic acid 0.20%;

[0032] Cetyltrimethylammonium Bromide 0.02%;

[0033] FSN-100 0.05%;

[0034] PEG-600 0.40%;

[0035] Diethylene glycol ether 0.20%;

[0036] Ethanol 96.23%,

[0037] The preparation method is as follows:

[0038] Add hydrogenated rosin, maleic rosin and an appropriate amount of ethanol to a stirred reactor, and completely dissolve the rosin resin at room temperature; then add adipic acid, sebacic acid, dibromosuccinic acid, cetyltrimethyl bromide Ammonium, FSN-100, PEG-600 and diethylene glycol ethyl ether, stirred to dissolve evenly; finally add ethanol to the required amount, stir evenly, and filter to obtain the no-clean high-temperature dip soldering flux.

Embodiment 2

[0040] Disproportionated rosin 1.00%;

[0041] Rosin 0.80%;

[0042] Glutaric acid 0.60%;

[0043] Suberic Acid 0.50%;

[0044] Hydrazine hydrochloride 0.003%;

[0045] Bromosuccinic acid 0.15%;

[0046] TX-10 0.08%;

[0047] Diethylene glycol methyl ether 1.00%;

[0048] Isopropanol 95.867%

[0049] The preparation method is as follows:

[0050] Add disproportionated rosin, maleic rosin and an appropriate amount of isopropanol to a stirred reactor, and completely dissolve the rosin resin at room temperature; then add glutaric acid, suberic acid, hydrazine hydrochloride, bromosuccinic acid, TX -10 and diethylene glycol methyl ether, stir to dissolve it evenly; finally add isopropanol to the required amount, stir evenly, and filter to obtain the no-clean high-temperature dip soldering flux.

Embodiment 3

[0052] Polymerized rosin 0.50%;

[0053] Rosin ester 0.50%;

[0054] Phthalic acid 0.50%;

[0055] Azelaic acid 0.50%;

[0056] Dibromobutenediol 0.50%;

[0057] Diethylamine hydrochloride 0.005%;

[0058] AEO-3 0.06%;

[0059] PEG-800 0.50%;

[0060] Ethanol 96.935%,

[0061] The preparation method is as follows:

[0062]Add polymerized rosin, rosin ester and appropriate amount of ethanol to the reactor with stirring, and completely dissolve the rosin resin at room temperature; then add phthalic acid, azelaic acid, dibromobutenediol, diethylamine hydrochloride , AEO-3, and PEG-800, stirred to dissolve them evenly; finally add ethanol to the required amount and stir evenly, and filter to obtain the no-clean high-temperature dip soldering flux.

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Abstract

The invention discloses a washing-free high temperature dip soldering flux, and belongs to the technical field of fluxes. The invention aims to solve the problems in the prior art, and provides a flux which has better depainting property and welding assistance property and wider operating temperature window and meets the requirement of environmental protection. The washing-free high temperature dip soldering flux comprises the following components in percentage by weight: 1.0 to 2.0 percent of active substance, 1.0 to 3.0 percent of resin, 0.05 to 0.10 percent of surfactant, 0.2 to 1.0 percent of high boiling solvent and the balance of solvent. The flux is particularly suitable for a high temperature dip soldering process for coating tin on enameled wires with the diameter of less than 0.5mm. The dip soldering process is simple, and convenient to operate; the operating temperature window is as wide as 290-480 DEG C; the flux is clean in depainting and better in coating the tin, has little residue after welding and does not require cleaning; and during operation, the smog generated by the flux is small so as to influence the body of the operators little.

Description

technical field [0001] The invention relates to the technical field of flux, in particular to a high-temperature dip-soldering flux suitable for tin on enameled wires with a diameter less than 0.5 mm. Background technique [0002] Compared with traditional Sn-Pb solder, lead-free solder has the most obvious performance difference, which is poor wetting ability of lead-free solder and high applicable soldering temperature. Therefore, with the promotion of lead-free solder, the flux used before can no longer meet the requirements, and it is necessary to develop a flux with strong wetting ability and high temperature resistance. Moreover, with the rapid development of no-cleaning flux in recent years, because it can better solve the environmental pollution caused by CFC cleaning agents and the cleaning difficulties and complex cleaning processes caused by high-density component assembly, its application range will continue to expand. getting bigger. [0003] The flux of the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362
Inventor 叶富华陈明汉邓延韩华陆雁
Owner SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
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