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Fully-automatic tin soldering machine

A soldering machine, fully automatic technology, applied in the direction of tin feeding device, welding equipment, metal processing, etc., can solve the problem of low welding efficiency, and achieve the effect of improving production efficiency, high reliability, and reliable welding quality.

Active Publication Date: 2011-11-23
SHENZHEN KEANDA ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the shortcomings of the automatic welding machine in the prior art mentioned above that only one temperature can be set and the welding efficiency is low, the present invention provides a new fully automatic welding machine. The soldering machine is equipped with two inner tin baths and outer tin baths A tin bath, the heating device heats the outer tin bath, the inner tin bath is set in the outer tin bath, the inner tin bath is heated through the outer tin bath, and the relative height between the inner tin bath and the outer tin bath can be adjusted, by adjusting The relative height between the inner tin bath and the outer tin bath can adjust the temperature in the inner tin bath to achieve the purpose of soldering different temperature-resistant components on the same PCB at the same time at different temperatures

Method used

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Embodiment Construction

[0023] This embodiment is a preferred implementation mode of the present invention, and other principles and basic structures that are the same or similar to this embodiment are within the protection scope of the present invention.

[0024] Please see attached figure 1 And attached figure 2 , in this embodiment, an outer tin bath 2 is fixedly installed on the frame 1, and an inner tin bath 3 is arranged inside the outer tin bath 2. In this embodiment, a heating device 12 is fixedly installed below the outer tin bath 2, and the heating device 12 The tin in the outer tin bath 2 can be heated, and the tin in the inner tin bath can be heated through the tin in the outer tin bath 2 . In this embodiment, the inner tin bath 3 is connected to the outer tin bath 2 through a height adjusting device 23, and the temperature of the tin in the inner tin bath 3 can be adjusted by adjusting the relative height between the inner tin bath 3 and the outer tin bath 2 , when the inner tin bath ...

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Abstract

The invention discloses a fully-automatic tin soldering machine capable of performing dip soldering on an electronic component on a printed circuit board (PCB). The tin soldering machine comprises a machine frame, an outer tin groove and an inner tin groove, wherein the outer tin groove is arranged on the machine frame; a heating device for heating tin in the outer tin groove is arranged at the position of the outer tin groove; the inner tin groove is arranged in the outer tin groove; tin in the inner tin groove is heated by the tin in the outer tin groove; a height adjusting device for adjusting the relative height of the inner tin groove and the outer tin groove is arranged between the inner tin groove and the outer tin groove; a first tin cup is arranged in the inner tin groove and is connected with a first lifting device; and the first lifting device can drive the first tin cup to ascend and descend, so that the first tin cup extends above the inner tin groove or is accommodated in the inner tin groove.

Description

technical field [0001] The invention discloses a soldering machine, in particular to a full-automatic soldering machine capable of performing dip soldering on electronic components on a PCB. Background technique [0002] With the development of science and technology, the level of automation in people's daily life is getting higher and higher. Automated soldering machines have long been common in people's lives. Wave soldering and reflow soldering are common automated soldering machines. However, there is a common shortcoming in current automated soldering machines, that is, soldering machines usually have only one tin tank. When working, the solder tank The temperature can only be set to one. However, in many current electronic products, there are many components that cannot withstand high temperatures during soldering. When high-temperature resistant and non-high-temperature resistant components are on the same PCB, one solder bath cannot take care of both. In this way, T...

Claims

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Application Information

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IPC IPC(8): B23K3/00B23K3/06H05K3/34
Inventor 唐斌郭丰明张帆
Owner SHENZHEN KEANDA ELECTRONICS TECH
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