Fully-automatic tin soldering machine

A soldering machine, fully automatic technology, applied in the direction of tin feeding device, welding equipment, metal processing, etc., can solve the problem of low welding efficiency, achieve the effect of improving production efficiency, high reliability, and reliable welding quality

Active Publication Date: 2013-01-16
SHENZHEN KEANDA ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the shortcomings of the automatic welding machine in the prior art mentioned above that only one temperature can be set and the welding efficiency is low, the present invention provides a new fully automatic welding machine. The soldering machine is equipped with two inner tin baths and outer tin baths A tin bath, the heating device heats the outer tin bath, the inner tin bath is set in the outer tin bath, the inner tin bath is heated through the outer tin bath, and the relative height between the inner tin bath and the outer tin bath can be adjusted, by adjusting The relative height between the inner tin bath and the outer tin bath can adjust the temperature in the inner tin bath to achieve the purpose of soldering different temperature-resistant components on the same PCB at the same time at different temperatures

Method used

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Embodiment Construction

[0023] This embodiment is a preferred implementation mode of the present invention, and other principles and basic structures that are the same or similar to this embodiment are within the protection scope of the present invention.

[0024] Please see attached figure 1 And attached figure 2 , in this embodiment, an outer tin bath 2 is fixedly installed on the frame 1, and an inner tin bath 3 is arranged inside the outer tin bath 2. In this embodiment, a heating device 12 is fixedly installed below the outer tin bath 2, and the heating device 12 The tin in the outer tin bath 2 can be heated, and the tin in the inner tin bath can be heated through the tin in the outer tin bath 2 . In this embodiment, the inner tin bath 3 is connected to the outer tin bath 2 through a height adjusting device 23, and the temperature of the tin in the inner tin bath 3 can be adjusted by adjusting the relative height between the inner tin bath 3 and the outer tin bath 2 , when the inner tin bath ...

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Abstract

The invention discloses a fully automatic soldering machine capable of performing dip soldering on electronic components on a PCB. The soldering machine includes a frame, an outer tin bath and an inner tin bath, the outer tin bath is arranged on the frame, and the outer tin bath is There is a heating device for heating the tin in the outer tin bath, the inner tin bath is set in the outer tin bath, and the tin in the inner tin bath is heated by the tin in the outer tin bath, and there is a A height adjustment device that can be used to adjust the relative height of the inner tin bath and the outer tin bath. There is a first tin cup in the inner tin bath. The first tin cup is connected with the first lifting device, and the first tin cup can be driven by the first lifting device. Lifting, so that the first tin cup protrudes above the inner tin tank or is received in the inner tin tank.

Description

technical field [0001] The invention discloses a soldering machine, in particular to a full-automatic soldering machine capable of performing dip soldering on electronic components on a PCB. Background technique [0002] With the development of science and technology, the level of automation in people's daily life is getting higher and higher. Automated soldering machines have long been common in people's lives. Wave soldering and reflow soldering are common automated soldering machines. However, there is a common shortcoming in current automated soldering machines, that is, soldering machines usually have only one tin tank. When working, the solder tank The temperature can only be set to one. However, in many current electronic products, there are many components that cannot withstand high temperatures during soldering. When high-temperature resistant and non-high-temperature resistant components are on the same PCB, one solder bath cannot take care of both. In this way, T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/00B23K3/06H05K3/34
Inventor 唐斌郭丰明张帆
Owner SHENZHEN KEANDA ELECTRONICS TECH
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