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Thermoplastic polyimide material and method for preparing flexible copper clad laminate through using material

A technology of polyimide and polyimide powder, which is applied in the direction of circuit substrate materials, chemical instruments and methods, lamination, etc., and can solve problems such as difficult to achieve double-sided panel manufacturing

Inactive Publication Date: 2012-07-18
南通今朝机床有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to manufacture double-sided panels for this type of coating type 2L-FCCL. This problem can be solved by using thermoplastic polyimide film to prepare 2L-FCCL by lamination method.

Method used

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  • Thermoplastic polyimide material and method for preparing flexible copper clad laminate through using material
  • Thermoplastic polyimide material and method for preparing flexible copper clad laminate through using material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] In a reactor with reflux and nitrogen gas, 0.40mol of 4-ethoxybiphenol-3,5-diaminobenzoate, 0.20mol of 2,2-bis(4-aminophenyl)hexa Fluoropropane, 0.40mol of 1,3-bis(4-aminophenoxy)benzene was stirred at 40°C and dissolved in N-methylpyrrolidone. After complete dissolution, the reaction temperature was lowered to 0°C, and then 1.03 mol of 3,3,4,4-benzophenone tetracarboxylic dianhydride was added in 5 portions within 1 hour. After the addition of the dianhydride monomer, the reaction was carried out at a constant temperature for 12 hours to obtain a polyamic acid copolymer solution. Heat this solution to 50°C, add 1.5L of a mixture of 2,2-bipyridine and acetic anhydride with a volume ratio of 1:3, stir for 20 hours, then pour this solution into deionized water to precipitate, filter, and then use ethanol After washing, the obtained product was vacuum-dried at 100° C. for 12 hours to finally obtain TPI powder.

[0013] Dissolve this TPI powder in a mixed solvent of aceto...

Embodiment 2

[0015] In a reactor with reflux and nitrogen gas, 0.50mol of 4-ethoxybiphenol-3,5-diaminobenzoate, 0.25mol of 2,2-bis(4-aminophenyl)hexa Fluoropropane, 0.25mol of 1,3-bis(4-aminophenoxy)benzene was stirred at a constant temperature of 40°C, dissolved in N,N-dimethylacetamide, and after complete dissolution, the reaction temperature was lowered to 0 0.62 mol of 3,3,4,4-benzophenone tetracarboxylic dianhydride and 0.40 mol of pyromellitic dianhydride were added in 5 portions within 1 hour. After the dianhydride monomer was added, the reaction was carried out at a constant temperature for 14 hours to obtain a polyamic acid copolymer solution. Heat this solution to 50°C, add 1.5L of a mixture of 2,2-bipyridine and acetic anhydride with a volume ratio of 1:3, stir for 20 hours, then pour this solution into deionized water to precipitate, filter, and then use ethanol After washing, the obtained product was vacuum-dried at 100° C. for 12 hours to finally obtain TPI powder.

[0016]...

Embodiment 3

[0018]In a reactor with reflux and nitrogen gas, 0.40mol of 4-ethoxybiphenol-3,5-diaminobenzoate, 0.20mol of 2,2-bis(4-aminophenyl)hexa Fluoropropane, 0.20mol of 1,3-bis(4-aminophenoxy)benzene and 0.20mol of 4,4'-diaminodiphenyl ether were stirred at 40°C and dissolved in acetone with a volume ratio of 1:3 and N-methylpyrrolidone in a mixed solvent, after completely dissolving, lower the reaction temperature to 0°C, and then add 0.50mol of 3,3,4,4-benzophenone tetracarboxylic acid in 5 times within 1 hour dianhydride and 0.52 mol of triphenyl ether tetracarboxylic dianhydride of tribenzoic acid. After the addition of the dianhydride monomer, react at a constant temperature for 15 hours to obtain a polyamic acid copolymer solution. Heat this solution to 50°C, add 1.5L of a mixture of 2,2-bipyridine and acetic anhydride with a volume ratio of 1:3, stir for 20 hours, then pour this solution into deionized water to precipitate, filter, and then use ethanol After washing, the obt...

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Abstract

The invention relates to a thermoplastic polyimide (TPI) material used for preparing a two-layer flexible copper clad laminate (2L-FCCL). The excellent dissolvability TPI material is obtained through generating a polyamide acid copolymer by using main reaction components 4-ethoxydiphenol-3,5-diaminobenzoate and 2,2-bis(4-aminophenyl)hexafluoropropane according to a specific molar ratio, a corresponding diamine and a corresponding acid anhydride, and processing the copolymer by utilizing a chemical imidization process. The 2L-FCCL with good comprehensive performances of dimensional stability, dip soldering resistance, peeling performance and the like can be obtained through dissolving powder of the TPI material and compositing the TPI material with a thermosetting polyimide film and copper foil.

Description

technical field [0001] The invention relates to the field of preparing thermoplastic polyimide materials with dissolvable and hot-melt processing properties, and a method for preparing polyimide flexible copper-clad boards by using thermoplastic polyimide materials. technical background [0002] Polyimide material is a high-strength and high-heat-resistant polymer material that can withstand high temperatures of 500°C in a short period of time and can be used for a long time below 300°C. While the rigid structure of polyimide endows it with excellent performance, it also causes it to be refractory and insoluble, so its molding performance is poor. Improving the processing performance of polyimide and reducing its price have become the main direction of its development. There are two main ways to improve the processing performance of polyimide. One is to improve the solubility. Researchers such as Harris and Lanier have successfully synthesized some polyimides that can be di...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J3/14C08J5/18B32B15/08B32B27/08B32B37/06B32B37/10H05K1/03
Inventor 徐勇
Owner 南通今朝机床有限公司
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