Lead-free welding flux alloy
A lead-free solder alloy, weight percentage technology, applied in the field of alloys, can solve the problems of poor solderability, silver corrosion of silver-plated parts, and high melting point, and achieve the effects of improving connection strength, reducing costs, and improving product market competitiveness.
Inactive Publication Date: 2007-08-01
YUNNAN TIN GROUP HLDG
View PDF0 Cites 10 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the SnCu solder that does not contain Ag, in addition to its high melting point, also has d
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreExamples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0010] Example 1: SnAgCuSb lead-free solder, the composition of each component by weight percentage is: silver 0.3%, copper 0.7%, antimony 0.1%, and the rest is tin.
Embodiment 2
[0011] Example 2: SnAgCuSb lead-free solder, the composition of each component by weight percentage is: silver 0.5%, copper 0.5%, antimony 0.005%, and the rest is tin.
Embodiment 3
[0012] Example 3: SnAgCuSb lead-free solder, the composition of each component by weight percentage is: silver 0.7%, copper 0.5%, antimony 0.1%, and the rest is tin.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more PUM
Login to view more
Abstract
Lead-free solder alloy. The invention involves an alloy, particularly a lead-free solder alloy. The components weight percentages of the solder alloy are: Silver 0.1%~4.0%, copper 0.1% ~ 2%, Sb 0.002% ~ 0.2% and the rest is tin. The formula of said solder alloy in the invention is reasonable, has characteristics of unleaded, low prices, excellent weldability, it can prevent lead damage the human body when welding; it can replace the solder containing lead and can the prevent the welding silver plate eroded by silver; it is suitable to wave soldering, dip-soldering and reflow soldering,etc.
Description
technical field [0001] The invention relates to an alloy, especially a lead-free solder alloy. Background technique [0002] In the development process of solder, tin-lead alloy has always been the best quality and cheap soldering material, both in terms of soldering quality and reliability after soldering can meet the requirements of use; however, with the strengthening of human environmental protection awareness, "lead" Human beings have paid more and more attention to the harm of lead-containing compounds and their compounds to the human body and the pollution to the environment. Lead-containing compounds have been considered to be one of the most harmful chemicals to humans and the environment. The demand for new environmentally friendly materials that can replace lead-containing solder is increasing day by day in electronic product manufacturing and other related industries. Therefore, the development of lead-free solders to replace lead-tin solders has received more a...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more Application Information
Patent Timeline
Login to view more
IPC IPC(8): B23K35/26
Inventor 刘宝权路林吴建勋
Owner YUNNAN TIN GROUP HLDG
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Try Eureka
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap