Modified epoxy resin adhesive used for polyimide flexible copper-clad plate

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, novolac epoxy resin adhesive, adhesive, etc., can solve the problems of poor processability, miscibility, bismaleimide homopolymer It is difficult to dissolve and other problems, and achieve the effect of improving the heat resistance of the system

Inactive Publication Date: 2011-09-28
ZHOUSHAN WEITE NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are several problems in the actual application in the field of copper clad laminates: one is that bismaleimide is brittle, and the adhesive obtained by directly using it is difficult to apply to flexible copper clad laminates; the other is bismaleimide homopolymer It is difficult to dissolve in low-boiling point solvents such as acetone, resulting in poor manufacturability after blending with epoxy resin; third, there are also problems with its miscibility with epoxy, and it is easy to precipitate from the adhesive macroscopically

Method used

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  • Modified epoxy resin adhesive used for polyimide flexible copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Composition and mass parts of modified epoxy resin adhesive:

[0027] 5 copies of BDME;

[0028] EC 20 copies;

[0029] 75 parts of bisphenol A type epoxy resin;

[0030] 5 parts of talcum powder;

[0031] 30 copies of DDE;

[0032] 5 parts of 704 curing agent.

[0033] The detailed composition (mass fraction) of BDME in this example: PBMI 12%; BMI12%; DDE 20%; Bisphenol A type epoxy resin 56%; The detailed composition (mass fraction) of EC: CTBN (acrylonitrile mass content in CTBN 25%) 30%; bisphenol A type epoxy resin 70%.

[0034] The solid components are dissolved in an organic solvent, the organic solvent is a mixed solvent obtained by mixing acetone and methyl ethyl ketone at a ratio of 3:2 by mass, and the solid content of the whole system is 30%.

[0035] The preparation method of the adhesive is:

[0036] 1) PBMI, BMI, DDE and bisphenol A type epoxy resin were stirred and reacted at a constant temperature at 70° C. for 2 hours in a reactor with reflux an...

Embodiment 2

[0041] Composition and mass parts of modified epoxy resin adhesive:

[0042] 20 copies of BDME;

[0043] EC 20 copies;

[0044] 60 parts of bisphenol A type epoxy resin;

[0045] 5 parts of talcum powder;

[0046] DDE 27.5 parts;

[0047] 7 parts of 704 curing agent;

[0048] In this example, the composition of BDME and EC is the same as in Example 1.

[0049] The solid components are dissolved in an organic solvent, the organic solvent is a mixed solvent obtained by mixing acetone and methyl ethyl ketone at a ratio of 3:2 by mass, and the solid content of the whole system is 30%.

[0050]The preparation method of the adhesive and the method of preparing the polyimide flexible copper-clad laminate are the same as the first embodiment. When using the adhesive prepared in this example to prepare a flexible copper-clad laminate, the thickness of the polyimide film used is 0.025mm, the thickness of the copper foil is 0.018mm, and the thickness of the glue is 0.020mm.

Embodiment 3

[0052] Composition and mass parts of modified epoxy resin adhesive:

[0053] 20 copies of BDME;

[0054] EC 20 copies;

[0055] 60 parts of bisphenol A type epoxy resin;

[0056] 5 parts of talcum powder;

[0057] 30 copies of DDE;

[0058] 5 parts of 781 curing agent;

[0059] The composition of BDME in this example is (mass fraction): PBMI 24%; DDM 20%; bisphenol A type epoxy resin 56%. And the composition of EC is identical with embodiment one.

[0060] The solid components are dissolved in an organic solvent, the organic solvent is a mixed solvent obtained by mixing acetone and methyl ethyl ketone at a ratio of 3:2 by mass, and the solid content of the whole system is 30%.

[0061] The preparation method of the adhesive is:

[0062] 1) PBMI, DDM and bisphenol A type epoxy resin were stirred and reacted at a constant temperature of 80° C. for 3.5 hours in a reactor with reflux and filled with nitrogen, and then cooled to room temperature to obtain a bismaleimide copo...

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Abstract

The invention relates to an epoxy resin adhesive modified by bismaleimide and liquid butadiene nitrile rubber, and a method for manufacturing a polyimide flexible copper-clad plate using the adhesive. The adhesive is composed of a bismaleimide copolymer, liquid rubber-modified epoxy resin, unmodified epoxy resin, filler, a curing agent and an organic solvent. The adhesive can be used for manufacturing a three-layer flexible copper-clad plate composed of a polyimide thin film, the adhesive and a copper foil, and the dip-soldering resisting temperature of the obtained copper-clad plate can reach 365 DEG C.

Description

technical field [0001] The invention relates to the field of adhesives for preparing polyimide flexible copper-clad laminates, in particular to the components and processes of adhesives required for high-temperature-resistant polyimide flexible copper-clad laminates. Background technique [0002] Flexible Copper Clad Laminate (FCCL) is the basic material for the production of printed circuit boards, usually made of polyimide (PI) film, adhesive and copper foil hot-pressed composite. FCCL is divided into two types: three-layer board and two-layer board. At present, the amount of three-layer board is the largest. It is generally made of polyimide film or polyester film and copper foil through adhesive bonding, hot pressing and post-curing. Adhesive is one of the main factors that determine the performance of flexible copper clad laminates. Adhesives used to bond PI films and copper foils generally fall into two categories: acrylate and epoxy resins. In recent years, the prin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C08G59/56B32B15/20B32B15/092C08G81/02C09J163/02B32B7/12C09J163/04
Inventor 徐勇
Owner ZHOUSHAN WEITE NEW MATERIAL TECH
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