High-performance thermally-conductive and insulating film for aluminum-based copper-clad laminate, and preparation method thereof

Abstract

The invention relates to a high-performance thermally-conductive and insulating film for an aluminum-based copper-clad laminate, and a preparation method thereof. The high-performance thermally-conductive and insulating film for the aluminum-based copper-clad laminate comprises 5 to 30% of solid epoxy resin, 1 to 30% of a boron-modified phenolic resin curing agent, 1 to 20% of thermoplastic resin,1 to 10% of a flexibilizer, 0.01 to 3% of a coupling agent, 0.1 to 5% of a thixotropic agent, 20 to 40% of a solvent and 30 to 70% of a heat-conducting filling material. According to the invention, the boron-modified phenolic resin curing agent is employed, so the heat resistance and anti-stripping strength of the film are substantially improved, and the storage life and the operating period of the film are greatly prolonged; and the thermoplastic resin is used so as to effectively regulate the rheological performance of the film at high temperature and overcome the problem of glue flowing inthe preparation process of conventional aluminum substrates. The novel high-performance thermally-conductive and insulating film provided by the invention has the characteristics of good heat resistance, high heat conductivity, strong caking properties, dip soldering resistance, reflow soldering resistance, etc., is extensively applicable to solid-state relays, high-power transistors, pulse motordrivers, LEDs and other fields, and shows important value to improvement of the reliability of power devices and products.

Description

technical field [0001] The invention relates to the preparation of a high-performance heat-conducting and insulating adhesive film, in particular to a preparation method of a high-performance heat-conducting and insulating adhesive film for an aluminum-based copper clad board. Background technique [0002] With the development of electronic products towards miniaturization, thinning, high density and high performance, the assembly density and integration of components on the printed circuit board (PCB) are getting higher and higher, and the power consumption is increasing. The heat dissipation of the PCB substrate Performance requirements are becoming more and more urgent. If the heat dissipation of the substrate is not good, it will cause the components on the PCB to overheat, thereby reducing the reliability of the whole machine. In order to ensure the life and reliability of components, the generated heat must be dissipated in time. However, the thermal conductivity of t...

AI Technical Summary

Problems solved by technology

However, due to the constraints of various factors such as their own technology, equipment, materials and funds, many domestic aluminum substrate manufacturers use commercialized FR-4 prepreg (the thermal conductivity is only 0.2W / (m· K)), this type of insulating layer is all made of epoxy resin, although this type of insulating layer has good bonding performance, no thermal conductive filler is added to the insulating layer, so the thermal conductivity of this aluminum substrate is very poor , can only be used in some low-end market

Although domestic metal-based CCL manufacturers have carried out a lot of research and development work in this area in recent years and made certain technological progress, there is still a large gap in performance and stability compared with similar products of well-known foreign companies, such as thermal conductivity. Low (<1.7W / (m K)), limited dielectric strength (breakdown voltage) (120μm, <4.0kV), poor matching of coefficient of thermal expansion (CTE) and bonding performance, and problems such as warping and cracking

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