High-performance thermally-conductive and insulating film for aluminum-based copper-clad laminate, and preparation method thereof

A technology of aluminum-based copper clad and insulating adhesive film, which is applied in the direction of adhesives, epoxy resin adhesives, polymer adhesive additives, etc., can solve the problem of poor thermal expansion coefficient matching and bonding performance, poor thermal conductivity of aluminum substrates, and thermal conductivity. Low-level problems, to achieve the effect of improving heat resistance and anti-peel strength, high peel strength, and solving the problem of glue flow

Inactive Publication Date: 2018-07-27
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the constraints of various factors such as their own technology, equipment, materials and funds, many domestic aluminum substrate manufacturers use commercialized FR-4 prepreg (the thermal conductivity is only 0.2W/(m· K)), this type of insulating layer is all made of epoxy resin, although this type of insulating layer has good bonding performance, no thermal conductive filler is added to the insulating layer, so the thermal conductivity of this aluminum substrate is very poor , can only be used in some low-end m

Method used

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  • High-performance thermally-conductive and insulating film for aluminum-based copper-clad laminate, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A, take by weighing 6 parts of solid epoxy resin E12, 3 parts of styrene-bismaleic anhydride graft copolymers (Mn=2000), 30 parts of mixed solvents (toluene, methyl ethyl ketone, butanol volume ratio are 4:4 : 1); put into the reaction kettle and heat to 60°C, and stir to make it dissolve completely to obtain the first glue solution.

[0023] B. Add 1.8 parts of carboxy-modified liquid nitrile rubber, 6 parts of boron-modified phenolic resin curing agent (boric acid / hydroquinone / formaldehyde co-reaction product, Mn=2400), 1.5 parts of KH in the first glue solution -560 parts of silane coupling agent, 1.2 parts of fumed silica (R792), 80 parts of spherical alumina (5 μm), 40 parts of quartz powder (2 μm); stir well to obtain the second glue.

[0024] C. Use the coating machine to coat the prepared second glue solution on the copper foil, and dry and roll it to obtain a high thermal conductivity insulating glue film (film thickness: 200 μm, thermal conductivity: 1.79W / ( ...

Embodiment 2

[0026] A, take by weighing 10 parts of solid epoxy resin E12, 3 parts of epoxy modified acrylate (Mn=80000), 50 parts of mixed solvent (toluene, methyl ethyl ketone, butanol volume ratio is 4:4:1); add Heat the reaction kettle to 60° C. and stir to dissolve completely to obtain the first glue solution for use.

[0027] B. Add 2.0 parts of polybutadiene rubber, 5 parts of boron-modified phenolic resin curing agent (boric acid / resorcinol / formaldehyde co-reaction product, Mn=1600), 1.0 parts of KH-550 to the first glue solution Silane coupling agent, 2.0 parts of fumed silica (R792), 73 parts of spherical alumina (5 μm), 23 parts of spherical alumina (500 nm); stir evenly to obtain the second glue.

[0028] C. Use the coating machine to coat the prepared second glue solution on the copper foil, and dry and roll it to obtain a high thermal conductivity insulating film (film thickness: 200 μm, thermal conductivity: 2.01W / ( m K), peel strength: 1.58N / mm, breakdown voltage: 6.1kV, t...

Embodiment 3

[0030] A, take by weighing 5 parts of solid epoxy resin E20, 3.2 parts of phenoxy resin (Mn=50000), 50 parts of mixed solvent (N, N-dimethylformamide, butanone, ethyl acetate volume ratio is 4: 4:2); put it into the reaction kettle and heat it to 60°C, and stir to dissolve it completely to obtain the first glue.

[0031] B. Add 1.8 parts of core-shell structure organosilicon / acrylate toughening agent and 7 parts of boron-modified phenolic resin curing agent (co-reaction product of phenylboronic acid / hydroquinone / formaldehyde, Mn=1800) in the first glue solution ), 1.0 parts of KH-672 silane coupling agent, 2.0 parts of fumed silica (R792, 80 parts of spherical alumina (10 μm), 20 parts of boron nitride (300 nm); stir evenly to obtain the second glue.

[0032] C. Use the coating machine to coat the prepared second glue solution on the copper foil, and dry and roll it to obtain a high thermal conductivity insulating glue film (film thickness: 200 μm, thermal conductivity: 2.52W / ...

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Abstract

The invention relates to a high-performance thermally-conductive and insulating film for an aluminum-based copper-clad laminate, and a preparation method thereof. The high-performance thermally-conductive and insulating film for the aluminum-based copper-clad laminate comprises 5 to 30% of solid epoxy resin, 1 to 30% of a boron-modified phenolic resin curing agent, 1 to 20% of thermoplastic resin,1 to 10% of a flexibilizer, 0.01 to 3% of a coupling agent, 0.1 to 5% of a thixotropic agent, 20 to 40% of a solvent and 30 to 70% of a heat-conducting filling material. According to the invention, the boron-modified phenolic resin curing agent is employed, so the heat resistance and anti-stripping strength of the film are substantially improved, and the storage life and the operating period of the film are greatly prolonged; and the thermoplastic resin is used so as to effectively regulate the rheological performance of the film at high temperature and overcome the problem of glue flowing inthe preparation process of conventional aluminum substrates. The novel high-performance thermally-conductive and insulating film provided by the invention has the characteristics of good heat resistance, high heat conductivity, strong caking properties, dip soldering resistance, reflow soldering resistance, etc., is extensively applicable to solid-state relays, high-power transistors, pulse motordrivers, LEDs and other fields, and shows important value to improvement of the reliability of power devices and products.

Description

technical field [0001] The invention relates to the preparation of a high-performance heat-conducting and insulating adhesive film, in particular to a preparation method of a high-performance heat-conducting and insulating adhesive film for an aluminum-based copper clad board. Background technique [0002] With the development of electronic products towards miniaturization, thinning, high density and high performance, the assembly density and integration of components on the printed circuit board (PCB) are getting higher and higher, and the power consumption is increasing. The heat dissipation of the PCB substrate Performance requirements are becoming more and more urgent. If the heat dissipation of the substrate is not good, it will cause the components on the PCB to overheat, thereby reducing the reliability of the whole machine. In order to ensure the life and reliability of components, the generated heat must be dissipated in time. However, the thermal conductivity of t...

Claims

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Application Information

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IPC IPC(8): C09J7/10C09J7/28C09J7/30C09J163/00C09J151/00C09J171/00C09J163/10C09J11/04C09J11/06C09J11/08
CPCC08K2003/385C08L2205/035C09J7/00C09J11/04C09J11/06C09J11/08C09J163/00C08L51/003C08L13/00C08L61/14C08K13/04C08K3/36C08K7/18C08L63/10C08L9/00C08L71/00C08L43/04C08K3/38C08L51/06C08L9/02C08L77/00
Inventor 孙蓉张保坦常浩朱朋莉
Owner SHENZHEN INST OF ADVANCED TECH
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