538results about "Polyether adhesives" patented technology

The invention discloses an electrolytic adhesive, an electrolytic cotton adhesive tape and a preparation method of the electrolytic adhesive. The electrolytic cotton adhesive tape comprises the following components in parts by weight: 5-10 parts of 1, 1 '-ferrocene diformyl chloride, 10-15 parts of acrylic acid beta-cyclodextrin ester, 3-8 parts of polyethylene glycol diglycidyl ether, 10-20 parts of ionic liquid, 1.5-3 parts of a cross-linking agent, 10-15 parts of tackifying resin and 0.5-1.5 parts of an initiator, and a polymer matrix comprises an acrylic acid-hydroxypropyl acrylate copolymer and acrylic acid-2-ethylhexyl ester. Comprising an adhesive layer and an adhesive tape base layer, the adhesive layer is prepared from the electrolytic adhesive, and the adhesive tape base layer is prepared from acrylic foam; the obtained electrolytic cotton adhesive tape has high initial adhesion and viscosity strength after power-on and power-off re-adhesion.

The invention provides a single-component modified silane adhesive as well as a preparation method and application thereof. The adhesive is prepared by mixing the following components: silane modified polyether resin, silane modified polymer resin, a plasticizer, a composite light stabilizer, a filler, a rheological additive, a water removal agent, a coupling agent and a catalyst, the silane modified polyether resin is silane-terminated resin prepared by a hydrosilylation method; the silane-modified polymer resin is a silane-terminated polymer resin containing a urethane bond. The adhesive is excellent in comprehensive performance, the tensile strength of a body is larger than 3 MPa, the elongation at break is larger than 450%, the adhesive is high in adhesion universality to metal base materials, PET films, ceramics, glass, wood floors, PVC, PC, ABS, wood-plastic composite materials and paint faces, the base materials do not need to be specially treated, the damage form is cohesive failure, and the adhesive has good adhesion strength, tear resistance and excellent temperature resistance and is suitable for being applied to the field of wood products. After aging at 120 DEG C for one week, the tensile strength of the body is greater than 3 MPa, the elongation at break is greater than 430%, and the surface layer can be coated after curing.

The invention relates to the technical field of adhesives, and provides a high-thermal-conductivity modified silane polyether adhesive and a preparation method thereof.The silane-terminated polyether sealant is prepared from silane modified polyether resin, modified filler, a flame retardant, a silane coupling agent, a catalyst, an antioxidant and a water removal agent; the modified filler is obtained by grafting a hydroxylated AlN filler or a hydroxylated BN filler or a hydroxylated AlN and hydroxylated BN compound filler with silane under the catalysis of a weak acid to form a Si-O-Al or / and Si-O-B covalent bond network, and then mixing the Si-O-Al or / and Si-O-B covalent bond network with nano silicon dioxide particles of which the surfaces are coated with polydopamine. Through a multi-dimensional filler modification technology and reasonable matching of other auxiliaries, the problem of synergism of heat conduction, flame retardance and mechanical properties of the MS adhesive under a high filling system is solved, and the material is suitable for a new energy power battery module.

The invention provides bio-based MS base resin, bio-based MS glue and a preparation method of the bio-based MS base resin and the bio-based MS glue, and belongs to the technical field of high polymer materials. The MS base resin is isocyanate group silane terminated bio-based polyether polyol or polyether polyol subjected to chain extension. The polyether polyol is selected from one or more of bio-based polyethylene glycol, bio-based polypropylene glycol, bio-based poly (trimethylene ether glycol) and bio-based polytetrahydrofuran ether glycol. And mixing the bio-based MS base resin, the plasticizer, the filler, the catalyst III, the coupling agent and the auxiliary agent, and stirring under a vacuum condition to obtain the bio-based MS adhesive. The bio-based MS adhesive prepared by the invention is high in bio-based material content, uncomplicated in preparation process and low in energy consumption, and meanwhile, an adhesive body is good in mechanical property, high in stability and good in high temperature resistance and humidity and heat resistance.

The invention relates to the technical field of resin composite materials, in particular to a layer-adding adhesive film for an FC-BGA packaging carrier plate, a preparation method of the layer-adding adhesive film and an adhesive-coated copper foil. The layer-adding adhesive film is prepared from the following raw materials in parts by mass: 50 to 60 parts of epoxy resin, 180 to 200 parts of inorganic filler, 30 to 36 parts of curing agent, 4 to 6 parts of modified phenoxy resin, 3 to 5 parts of carbodiimide resin and 0.2 to 0.4 part of 4-dimethylaminopyridine. Modified phenoxy resin and carbodiimide resin are added on the basis of main components such as epoxy resin, inorganic filler and a curing agent, meanwhile, 4-dimethylaminopyridine is used as a curing accelerator, and through the synergistic effect of all the components, the dielectric loss angle tangent of a layer-adding adhesive film can be effectively reduced, the glass-transition temperature of a layer-adding adhesive layer is increased, and the bonding strength of the layer-adding adhesive film is improved. Good flame retardance of the layer-adding adhesive film is ensured, and the layer-adding adhesive film is applied to the adhesive-coated copper foil.

A curable thermally conductive adhesive comprising a curable binder and a thermally conductive filler, wherein a cured product of the curable thermally conductive adhesive has a tensile storage elastic modulus of 2.0×108 Pa or less and a tanδ of 0.05 or more and 0.6 or less measured by dynamic viscoelasticity measurement at 10 Hz at 25°C.

The invention discloses a ceramic fire-resistant sealant for a bridge, a fireproof structure, a preparation device and a preparation method, and relates to the technical field of sealants for the bridge. The ceramic fire-resistant sealant for the bridge comprises the following specific components in parts by weight: 100 parts of an MS polymer; 0 to 100 parts of a plasticizer; 80 to 150 parts of aluminum hydroxide; 80 to 150 parts of modified wollastonite; 50 to 100 parts of calcium carbonate; 10 to 20 parts of zinc borate; 10 to 20 parts of melamine polyphosphate; 5 to 10 parts of dipentaerythritol; 5 to 10 parts of a dewatering agent; 5 to 10 parts of an adhesion promoter; and 0.5-2 parts of a catalyst. According to the ceramic fire-resistant sealant for the bridge, a rubber body formed after vulcanization is converted into a self-supporting ceramic body under the condition of high temperature or open fire, flame is prevented from diffusing into a material, so that the purposes of flame retardance and fire prevention are achieved, meanwhile, the mechanical property is not obviously attenuated before and after thermal aging, and good elasticity is still kept; and the vulcanized paint has excellent adhesive force to the paint, so that the use effect of the paint is guaranteed.

The invention relates to the technical field of semiconductor packaging adhesive films, and provides a resin composition, an adhesive film and application thereof. The resin composition disclosed by the invention is prepared from the following components in parts by weight: 5 to 20 parts of maleimide, 5 to 20 parts of alicyclic epoxy resin, 25 to 40 parts of thermoplastic high-molecular compound, 10 to 20 parts of bisphenol epoxy resin, 10 to 30 parts of benzoxazine resin and 30 to 300 parts of inorganic filler, wherein the degree of functionality of the alicyclic epoxy resin is not less than 3. The packaging adhesive film prepared from the resin composition provided by the invention has low thermal expansion coefficient and excellent heat resistance, can still keep stable adhesive force in a high-temperature and high-humidity environment, and is suitable for packaging semiconductors.

This easily dismantlable adhesive sheet (100) comprises an adhesive layer (10) containing a moisture-cured product of a silyl group-containing resin and a terpene phenolic tackifying resin, wherein the silyl group-containing resin has a polyoxyalkylene structure in a main chain, has, in a portion of the main chain or a side chain, both bonds among a urethane bond and a urea bond or one bond among the urethane bond and the urea bond, and has hydrolyzable silyl groups represented by formula (1) at both ends of the main chain. (In formula (1), X1 and X2 are each independently a hydroxy group or an alkoxy group, R is a C1-C20 alkyl group, and * is a bonding position.)

The invention provides an automobile elastic adhesive and a preparation method thereof, the automobile elastic adhesive comprises a component A and a component B, the component A comprises 35-50 parts of a silane modified polyether polymer 1, 5-10 parts of a silane modified polyether polymer 2, 5-10 parts of a first plasticizer, 0.5-2 parts of an antioxidant, 30-45 parts of a first filler, 0.2-0.5 part of a moisture scavenger and 2-4 parts of a cross-linking agent; the component A is prepared from epoxy resin, the component B is prepared from 60-80 parts of epoxy resin, 5-15 parts of a second plasticizer, 10-20 parts of a second filler, 4-6 parts of an accelerant and 1-2 parts of a catalyst, the moisture scavenger is hydrolyzed vinyl trimethoxy silane, the cross-linking agent comprises polyamino trimethoxy silane, and the volume ratio of the component A to the component B is (4-6): 1. According to the invention, the technical problems of dark fringes, cracking, odor, VOC (Volatile Organic Compounds) and the like of the existing acrylate and organic silicon adhesive can be solved.

The invention discloses a silane modified polyether sealant and a preparation method thereof, and belongs to the technical field of sealants. The sealant is prepared from the following raw materials in parts by mass: 80 to 100 parts of MS prepolymer, 1 to 3 parts of silane coupling agent, 10 to 20 parts of plasticizer, 10 to 30 parts of polydopamine modified boron nitride, 40 to 60 parts of nano calcium carbonate, 0.3 to 0.5 part of dibutyltin dilaurate, 0.1 to 0.4 part of light stabilizer and 0.5 to 1 part of ultraviolet absorbent. Wherein the MS prepolymer is obtained by carrying out hydrosilylation reaction on modified allyl-terminated polyether and hydrogen-containing silane, and a side chain of a molecular chain of the modified allyl-terminated polyether contains a benzoic acid structure. A rigid unit with an aromatic ring structure and polar carboxyl are introduced into a polyether long-chain side chain of silane modified polyether to form an MS prepolymer, and the MS prepolymer and polydopamine modified boron nitride have a synergistic effect, so that the sealant is endowed with high hardness and good flexibility.

The invention discloses a single-component low-viscosity glue-overflow-free epoxy resin electronic glue which is characterized by comprising the following components in parts by weight: 25-40 parts of epoxy resin, 0.5-2.5 parts of thermoplastic resin, 20-35 parts of a curing agent, 1-10 parts of an auxiliary agent, 15-40 parts of filler and 0.5-5 parts of an accelerant. According to the single-component low-viscosity glue-overflow-free epoxy resin electronic glue and the preparation method thereof provided by the invention, the thermoplastic resin is added into a system, so that the problems that a chip is polluted due to glue overflow in glue dispensing, wire drawing and heating curing processes, and the periphery of the chip is cracked due to large shrinkage rate after the overflowing glue is cured in a severe case can be effectively solved. Meanwhile, the system does not contain an organic solvent, volatile organic compounds are hardly released in the dispensing and curing processes, the problem of solvent residue is avoided, and the content of ion impurities is extremely low. The prepared epoxy resin electronic glue system has the advantages of low viscosity, no glue overflow after curing, no solvent addition and no VOC (volatile organic compound) addition.

The invention relates to the technical field of adhesives, in particular to a two-component hybrid adhesive and a preparation method thereof, and the two-component hybrid adhesive comprises a component A and a component B, the component A is prepared from the following raw materials in parts by weight: 50 to 70 parts of silane modified polymer, 10 to 30 parts of reinforcing filler, 2 to 6 parts of silane coupling agent and 3 to 7 parts of curing agent; the component B is prepared from the following raw materials in parts by weight: 40 to 60 parts of modified epoxy resin, 10 to 30 parts of reinforcing filler, 0.5 to 3 parts of catalyst and 0.5 to 2 parts of curing accelerator; the silane modified polymer is selected from a silane modified polyether polymer or a silane modified polyurethane polymer; according to the invention, the combination of the silane modified polymer and the modified epoxy resin is optimized, and the compatibility of the silane modified polymer and the modified epoxy resin is improved, so that the tensile modulus of the two-component hybrid adhesive is improved, and the problems that the compatibility between components of the existing two-component hybrid battery adhesive is poor, so that the prepared material is relatively soft, and the service life of the material is prolonged are solved. The tensile modulus is relatively low, and the use requirement and the safety requirement of the battery glue cannot be met.

The present invention relates to the technical field of adhesive materials, and specifically relates to a reusable high shear strength electrical debonding tape, and a preparation method. The tape is prepared using acrylate or olefin monomers, a methoxy polyethylene glycol-containing ester, acrylic acid, salts, functional monomers, an organic solvent, and a tackifying resin. In the electrical debonding tape of the present invention, most electrolytes are bonded to a main adhesive molecular chain through chemical bonds, and some electrolytes are dissociated and complexed by the strong ether-oxygen bonds of methoxy polyethylene glycol, rather than simple physical mixing as in the prior art, thus effectively preventing large-scale precipitation of electrolytes under electrified conditions, and enabling reuse.

To provide a thermosetting adhesive composition which has, after thermally cured, a low dielectric constant, a low dielectric loss tangent, a low temperature change rate of the dielectric loss tangent, and good bending resistance.SOLUTION: A thermosetting adhesive composition for bonding between substrates is provided, containing with respect to 100 pts.mass of the total of the thermosetting adhesive composition, 65 to 90 pts.mass of a styrenic elastomer, as crosslinking components, 5 to 20 pts.mass of (A) a modified polyphenylene ether resin having a radical polymerizable group at a molecular terminal, 4 to 10 pts.mass of (B) polybutadiene and / or polyisoprene having a weight average molecular weight of 10,000 to 50,000, a radical polymerization initiator, and an epoxy resin, wherein the total of the contents of the radical polymerization initiator, the epoxy resin and the epoxy resin curing agent is 10 pts.mass or less, a styrenic elastomer having a styrene ratio of less than 67% is contained as the styrenic elastomer, and the total of the content of the component (A) and the content of the component (B) is 25 pts.mass or less.SELECTED DRAWING: Figure 1

To provide an adhesive composition which gives a cured product excellent in low dielectric characteristics and heat resistance and also excellent in adhesiveness to a resin and a metal.SOLUTION: As a result of intensive studies, the inventors have found that the problem can be solved by an adhesive composition which contains a component (A): a resin obtained by converting terminals of a bifunctional polyphenylene ether resin to vinyl groups, a component (B): a maleimide compound having two or more maleimide groups in one molecule, a component (C): an acid-modified styrenic elastomer, and a component (D): an isocyanate compound having two or more isocyanate groups in one molecule in a specific ratio.SELECTED DRAWING: None

This invention provides an adhesive sheet for filling adhesive and its application. The adhesive sheet is formed by rolling and laminating a PET film, a first adhesive layer, a prepreg, a second adhesive layer, and a PET film in sequence. The prepreg has a minimum melt viscosity of 3000-10000 Pa·s between 60 and 160°C. The first and second adhesive layers each have a minimum melt viscosity of 300-2000 Pa·s independently between 60 and 160°C. This invention, by setting highly fluid adhesive layers on both sides of the prepreg with low fluidity, enables the adhesive sheet to have excellent filling capacity in the Z-axis direction, while maintaining low fluidity in the X / Y directions. This results in good uniformity of board thickness after filling and pressing. Furthermore, when applied to thick copper fillers, the adhesive sheet can solve the cracking problem in the inter-line area after multiple reflow soldering processes. The filled and pressed board is also less prone to warping, resulting in high reliability of the printed circuit board when carrying high currents.

This invention provides a phosphorus-containing flame retardant, its preparation method and application, and a resin composition and its application, specifically relating to the field of polymer materials technology. The phosphorus-containing flame retardant provided by this invention achieves an integrated design of the flame-retardant unit and the elastic matrix at the molecular scale by directionally and controllably grafting phosphorus-containing groups M onto the active sites of the polybutadiene soft segments in a styrene-butadiene-styrene block copolymer via covalent bonds. This structure retains the inherent high flexibility, impact resistance, and processing rheological properties of the styrene-butadiene-styrene block copolymer while imparting intrinsic, durable, and uniformly distributed flame-retardant capabilities to the material. Simultaneously, because the phosphorus element is anchored to the polymer backbone / side chain, no small molecule polar impurities are introduced, significantly suppressing dielectric polarization loss and hygroscopicity increases. This provides a structural basis and performance guarantee for the subsequent construction of a high-end thermosetting resin system for copper-clad laminates with low Dk / Df, high Tg, and low CTE.

The present invention pertains to a curable perfluoropolyether adhesive composition that contains: (A) 100 parts by mass of a straight-chain perfluoropolyether compound that has at least two alkenyl groups in one molecule, and that has, in the main chain, a perfluoropolyether structure including a repeating unit represented by —CaF2aO— (where a is an integer from 1-6); (B) in an amount effective for curing, a fluorine-containing organohydrogenpolysiloxane having, in one molecule, at least two hydrogen atoms to which a silicon atom is bonded; and (C) a catalyzing quantity of a hydrosilylation reaction catalyst. The composition does not contain an organic solvent. This configuration makes it possible to provide: a curable perfluoropolyether adhesive composition with which can be achieved a cured product that has excellent heat resistance, weather resistance, water repellency, oil repellency, chemical resistance, solvent resistance, etc., and that is characterized in particular in that voids are not generated on the surface of a coating film in a heating step; and an adhesive and adhesive tape that include said cured product.

The curable adhesive composition for a battery of the present invention is a curable adhesive composition for a battery comprising a hydrolyzable silyl group-containing organic polymer and a thermally conductive filler, wherein a cured product of the curable adhesive composition for a battery has a Shore A hardness of 90 or less and a shear strength of 0.5 to 5 MPa. The present invention is capable of providing a curable adhesive composition for a battery, the composition having good reworkability while having suitable adhesion.

The invention discloses an expansion insulating sheet which comprises a base material and two expansion bonding layers arranged on the two sides of the base material respectively. The expansion bonding layer comprises epoxy resin with the softening point being 40 DEG C or above, a temperature-sensitive foaming agent, a curing agent, an accelerant, cellulose resin and thermoplastic resin. According to the prepared expansion insulating sheet, the bending resistance of the expansion bonding layer can be remarkably improved, and breakage caused by bending of the expansion bonding layer is avoided; in addition, the adhesiveness of the expansion bonding layers to the base material can be remarkably improved, floating of the bonding layers is avoided in the cutting process, and meanwhile stripping of the expansion bonding layers and the base material caused by mutual bonding of the expansion bonding layers in the storage process is avoided.

This invention belongs to the field of polymer materials, specifically relating to a low-heat-shrinkage polymeric film for laser drilling and its preparation method. The film comprises modified polyphenylene ether resin, vinyl-containing benzoxazine resin, a specific cationic initiator, a toughening agent, and inorganic modified fillers: gadolinium lanthanum zirconate core-shell nanocrystals and lithium aluminum borosilicate nanowires. The preparation method includes: first, surface-treating the two inorganic fillers with a silane coupling agent and then dispersing them in a solvent to obtain a slurry; then, mixing this slurry with the modified polyphenylene ether resin, vinyl-containing benzoxazine resin, cationic initiator, and toughening agent to form a homogeneous adhesive; finally, coating the adhesive onto a carrier film and drying and curing it at three temperature stages from low to high to obtain the finished film. The film prepared by this method exhibits extremely low heat shrinkage during laser drilling, effectively controlling resin protrusion or indentation defects on the hole wall, and significantly improving the quality and reliability of micropore processing.

According to the high-electric-conductivity heat-conduction anti-corrosion multifunctional sealant and the preparation method thereof, silane modified polyether serves as matrix resin, and composite aluminum oxide and zinc oxide serve as heat conduction filler to improve the heat dissipation performance; in the conductive system, poly (3, 4-ethylenedioxythiophene) coats the surface of crystalline flake graphite through in-situ polymerization so as to reduce the interface contact resistance. A three-dimensional conductive network is constructed by carboxylated carbon nanotubes and a poly (3, 4-ethylenedioxythiophene)-graphite complex, and electric conduction and heat conduction paths are synergistically enhanced through directional arrangement of a graphite layered structure; a cross-linking agent, a catalyst and a dispersing agent are matched to optimize the curing process and the dispersity of the filler, and a toluene / ethyl acetate mixed solvent is adopted to adjust the construction viscosity, so that the novel composite colloid with high electric conductivity, high heat conductivity and environmental corrosion resistance is finally formed.

To provide a temporary fixing adhesive that has conformability to uneven structures (step conformability), high heat resistance (reflow resistance), and laser peelability, can suppress substrate warping after support peeling, has excellent solvent removal properties, and provides good solderability of component electrodes after removal of the temporary fixing adhesive, and to provide a method for temporarily fixing components and processing methods using the same. [Solution] A temporary fixing adhesive composition comprising a resin (A) and an organometallic compound (B), wherein the resin (A) contains an alcoholic hydroxyl group or a phenolic hydroxyl group, and is a resin whose mass loss rate relative to the mass before heating is 5% at a rate of 10°C / min in an atmospheric atmosphere using thermogravimetric differential thermal analysis, and the film thickness reduction rate (R) after immersion in toluene, cyclohexanone, or N-methylpyrrolidone is 95% or more.

The present invention relates to a modified silane adhesive and a preparation method thereof. The raw material composition of the modified silane adhesive includes, by weight, 45-75 parts of silane-modified polyether, 10-20 parts of silane derivatives, 0.3-2 parts of water scavengers, 1-3 parts of catalysts, 0.5-3 parts of coupling agents, 10-15 parts of plasticizers, and 5-15 parts of modified graphene oxide. The present invention uses silane derivatives for modified silane adhesive systems, wherein the silane derivatives provide excellent flame retardant effects for the adhesives on the one hand; on the other hand, by enhancing the intermolecular forces and cohesive strength of the adhesives, the mechanical properties of the modified adhesives are improved. Modified graphene oxide is also introduced into the modified silane adhesive system of the present invention as a functional component to impart excellent waterproof and antifouling properties to the adhesives.

A purpose of the present invention is to provide an adhesive composition capable of giving cured objects having excellent mechanical properties. The adhesive composition according to one aspect of the present invention comprises a polyoxypropylene-based polymer (A) having a number-average molecular weight of 5000 or higher and having, at ends, 0.6 or more (meth)acryloyl groups on average, a methacrylate compound (B), a homopolymer of which has a glass transition temperature exceeding 60°C, an organic peroxide (C), and a reducing agent (D).

To provide a pressure-sensitive adhesive tape which suppresses the surface contamination of an adherend with foreign matter and is excellent in antistatic performance.SOLUTION: An adhesive tape according to an embodiment of the present invention includes a base material; and an adhesive layer formed of an active energy ray-curable adhesive containing a (meth) acrylic polymer having a radiation-polymerizable carbon-carbon double bond, an ionic liquid, and a photopolymerization initiator.SELECTED DRAWING: Figure 1

The invention relates to a two-component foamable silane-modified polymer composition comprising: a component A comprising (a-1) at least one silane modified polymer, (a-2) at least one aminosilane or aminosilane oligomer, and (a-3) at least one foam stabilizer, (a-4) optionally at least one plasticizer, (a-5) optionally surface treated calcium carbonate, (a-6) optionally surfaced treated silica, (a-7) optionally at least one catalyst, (a-8) optionally at least one wax, a component B comprising (b-1) water, (b-2) at least one hydride organopolysiloxane, preferably at least one poly(methylhydrosiloxane), and (b-3) foam stabilizer, (b-4) optionally at least one plasticizer, (b-5) optionally surface treated calcium carbonate, (b-6) optionally surfaced treated silica, (b-7) optionally at least one phyllosilicate, (b-8) optionally at least one catalyst, (b-9) optionally at least one wax. The invention also relates to a method for preparing a silane-modified polymer foam attached to a part of assembly in situ, comprising the steps: I. preparing a two-component foamable silane-modified polymer composition according to any of claims 1 to 12; II. mixing the component A and component B at a reaction temperature from 15 to 100°C, preferably from 20 to 80°C, to form a reaction mixture; and III. applying the reaction mixture to at least one surface of part; to a silane-modified polymer foam obtained by said method, and to use of said two-component foamable silane-modified polymer composition or said silane-modified polymer foam in gasket, sealant or adhesive.

The invention relates to an assembly comprising a first part and a second part, each part comprising a polymer; and a film located between and adhered to the first part and the second part. The film comprises a blend of at least two poly(ether ketone ketone) (PEKK) polymers and optionally at least one nucleating agent. The assembly has improved fracture toughness and overall good mechanical properties.

The invention provides a weather-resistant high-strength acrylate structural adhesive with long operation time, which is obtained by mixing a component A and a component B, each of the component A and the component B comprises a fluorine-free acrylate monomer, a fluorine-containing acrylate monomer, an acrylate copolymer, an elastic polymer, an impact improver, a stabilizer, a compatibility aid, a filler and color paste, the component A further comprises an oxidizing agent, and the component B further comprises a reducing agent; the acrylate copolymer is a copolymer of a fluorine-free acrylate monomer, a fluorine-containing acrylate monomer and a conventional acrylate monomer, wherein the mole ratio of the fluorine-containing acrylate monomer is not more than 15%. The structural adhesive has the advantages of long operation time and excellent weather resistance, has the high strength performance of the conventional acrylate structural adhesive, and is suitable for various large-area adhesive application scenes and non-automatic adhesive application scenes.