776results about "Polyether adhesives" patented technology

The invention discloses an electrolytic adhesive, an electrolytic cotton adhesive tape and a preparation method of the electrolytic adhesive. The electrolytic cotton adhesive tape comprises the following components in parts by weight: 5-10 parts of 1, 1 '-ferrocene diformyl chloride, 10-15 parts of acrylic acid beta-cyclodextrin ester, 3-8 parts of polyethylene glycol diglycidyl ether, 10-20 parts of ionic liquid, 1.5-3 parts of a cross-linking agent, 10-15 parts of tackifying resin and 0.5-1.5 parts of an initiator, and a polymer matrix comprises an acrylic acid-hydroxypropyl acrylate copolymer and acrylic acid-2-ethylhexyl ester. Comprising an adhesive layer and an adhesive tape base layer, the adhesive layer is prepared from the electrolytic adhesive, and the adhesive tape base layer is prepared from acrylic foam; the obtained electrolytic cotton adhesive tape has high initial adhesion and viscosity strength after power-on and power-off re-adhesion.

The invention discloses a mobile phone narrow frame low-pressure injection molding sealing adhesive and a preparation method thereof, and belongs to the technical field of adhesives. According to the technical scheme, the adhesive is characterized by being prepared from, by weight, 35-46 parts of aliphatic epoxy resin, 10-20 parts of polyether polyol, 16-25 parts of reactive diluent, 15-20 parts of toughened resin, 1.4-2.0 parts of initiator, 0.8-1.2 parts of coupling agent and 1.5-2.0 parts of fumed silica, and an adhesive layer obtained after the adhesive is subjected to UV curing is low in shrinkage rate, high in modulus and good in adhesion property. The width of the mobile phone frame can be well controlled, compared with a plastic piece, the screen-to-body ratio of a mobile phone screen can be further improved, and meanwhile the requirements for bonding and reliability of a client side can be met.

The invention discloses a silane modified polyether flame-retardant adhesive and a preparation process thereof, and relates to the technical field of sealants, a phosphate plasticizer is selected as a plasticizer, a flame-retardant filler is selected from any one or two of aluminum hydroxide and magnesium hydroxide, and silane modified polyether resin is added as flame-retardant resin. All the components are compounded and mixed to obtain the modified flame-retardant adhesive, and the flame-retardant resin, the flame-retardant filler and the plasticizer have a good synergistic flame-retardant effect, so that the flame-retardant adhesive achieves a good flame-retardant effect. According to the invention, mercaptoacetic acid modified silicon resin microspheres are prepared, then the mercaptoacetic acid modified silicon resin microspheres react with lead acetate and zinc acetate by utilizing the adsorbability of sulfydryl to prepare modified silicon resin, and the silicon resin is an anti-dripping flame retardant and can form a stable and compact carbon layer structure after combustion; lead acetate and zinc acetate are beneficial to dehydrogenation and charring in the combustion process, so that the flame retardant property is further improved.

When considering the prior art, the objective of the present invention is to provide a curing catalyst which is highly safe and has a curing rate suitable for practical use. According to the present invention, provided is a curing catalyst [B] which is used for curing a polymer [A] having a reactive hydrolyzable silicon-containing group, the curing catalyst [B] containing a metal alkoxide [B1] and an ammonium hydroxide [B2], wherein: the metal alkoxide [B1] includes one or both of a titanium compound [B1a] represented by chemical formula (1) and another metal alkoxide [B1b]; the another metal alkoxide [B1b] is an alkoxide of a metal other than titanium; and the ammonium hydroxide [B2] is represented by chemical formula (2).

Provided are: a curable resin composition that obtains a cured product having excellent adhesiveness, flexibility and dismantling properties; a cured product thereof; and a disassemblable adhesive material. A curable resin composition according to the present embodiment contains: an epoxy resin (A) having a specific structure and having an epoxy equivalent weight of 500-10,000 g / eq, an epoxy resin (B) having an epoxy equivalent weight of 100-300 g / eq, a curable functional group-containing compound (C), and thermally expandable particles (D). The curable functional group-containing compound (C) has a specific structure having a reversible bond.

The invention provides a single-component modified silane adhesive as well as a preparation method and application thereof. The adhesive is prepared by mixing the following components: silane modified polyether resin, silane modified polymer resin, a plasticizer, a composite light stabilizer, a filler, a rheological additive, a water removal agent, a coupling agent and a catalyst, the silane modified polyether resin is silane-terminated resin prepared by a hydrosilylation method; the silane-modified polymer resin is a silane-terminated polymer resin containing a urethane bond. The adhesive is excellent in comprehensive performance, the tensile strength of a body is larger than 3 MPa, the elongation at break is larger than 450%, the adhesive is high in adhesion universality to metal base materials, PET films, ceramics, glass, wood floors, PVC, PC, ABS, wood-plastic composite materials and paint faces, the base materials do not need to be specially treated, the damage form is cohesive failure, and the adhesive has good adhesion strength, tear resistance and excellent temperature resistance and is suitable for being applied to the field of wood products. After aging at 120 DEG C for one week, the tensile strength of the body is greater than 3 MPa, the elongation at break is greater than 430%, and the surface layer can be coated after curing.

The present disclosure relates to a process of manufacturing curable precursor of a structural adhesive composition. According to another aspect, the present disclosure is directed to method of bonding two parts.

The invention relates to the technical field of adhesives, and provides a high-thermal-conductivity modified silane polyether adhesive and a preparation method thereof.The silane-terminated polyether sealant is prepared from silane modified polyether resin, modified filler, a flame retardant, a silane coupling agent, a catalyst, an antioxidant and a water removal agent; the modified filler is obtained by grafting a hydroxylated AlN filler or a hydroxylated BN filler or a hydroxylated AlN and hydroxylated BN compound filler with silane under the catalysis of a weak acid to form a Si-O-Al or / and Si-O-B covalent bond network, and then mixing the Si-O-Al or / and Si-O-B covalent bond network with nano silicon dioxide particles of which the surfaces are coated with polydopamine. Through a multi-dimensional filler modification technology and reasonable matching of other auxiliaries, the problem of synergism of heat conduction, flame retardance and mechanical properties of the MS adhesive under a high filling system is solved, and the material is suitable for a new energy power battery module.

This reactive silicon group-containing polyoxyalkylene derivative in which one or both terminals of a polyoxyalkylene chain are blocked with a group represented by structural formula (1) has good curability even if an amine-based compound is used as a curing catalyst, and gives a cured product having excellent yellowing resistance and heat resistance. (In the formula, R1 and R2 each independently represent a hydrogen atom, a C1-10 aliphatic saturated hydrocarbon group or a C6-10 aryl group, each R3 independently represents a C1-10 aliphatic saturated hydrocarbon group or a C6-10 aryl group, and n is an integer of 2-12. The wavy line represents a bond.)

The invention provides bio-based MS base resin, bio-based MS glue and a preparation method of the bio-based MS base resin and the bio-based MS glue, and belongs to the technical field of high polymer materials. The MS base resin is isocyanate group silane terminated bio-based polyether polyol or polyether polyol subjected to chain extension. The polyether polyol is selected from one or more of bio-based polyethylene glycol, bio-based polypropylene glycol, bio-based poly (trimethylene ether glycol) and bio-based polytetrahydrofuran ether glycol. And mixing the bio-based MS base resin, the plasticizer, the filler, the catalyst III, the coupling agent and the auxiliary agent, and stirring under a vacuum condition to obtain the bio-based MS adhesive. The bio-based MS adhesive prepared by the invention is high in bio-based material content, uncomplicated in preparation process and low in energy consumption, and meanwhile, an adhesive body is good in mechanical property, high in stability and good in high temperature resistance and humidity and heat resistance.

The invention discloses a dry-method electrode binder and a preparation method thereof. The dry-method electrode binder comprises polyethylene glycol-methacrylate. According to the invention, the limitation of the existing polytetrafluoroethylene as a dry-method electrode binder is overcome, so that the preparation process of the battery electrode and the performance of the battery are improved. According to the invention, the structure is optimized through copolymerization modification. Through copolymerization with a monomer with a functional group, the molecular structure of polyethylene glycol-methacrylate can be further adjusted, so that higher bonding strength, good thermal stability and better conductivity are realized. The copolymerization modification can also effectively improve the temperature resistance and corrosion resistance of the polyethylene glycol-methacrylate, so that the polyethylene glycol-methacrylate keeps better performance under different environmental conditions, thereby effectively improving the performance of the battery, reducing the production cost and promoting the innovation and optimization of the lithium battery manufacturing process.

The invention relates to the technical field of resin composite materials, in particular to a layer-adding adhesive film for an FC-BGA packaging carrier plate, a preparation method of the layer-adding adhesive film and an adhesive-coated copper foil. The layer-adding adhesive film is prepared from the following raw materials in parts by mass: 50 to 60 parts of epoxy resin, 180 to 200 parts of inorganic filler, 30 to 36 parts of curing agent, 4 to 6 parts of modified phenoxy resin, 3 to 5 parts of carbodiimide resin and 0.2 to 0.4 part of 4-dimethylaminopyridine. Modified phenoxy resin and carbodiimide resin are added on the basis of main components such as epoxy resin, inorganic filler and a curing agent, meanwhile, 4-dimethylaminopyridine is used as a curing accelerator, and through the synergistic effect of all the components, the dielectric loss angle tangent of a layer-adding adhesive film can be effectively reduced, the glass-transition temperature of a layer-adding adhesive layer is increased, and the bonding strength of the layer-adding adhesive film is improved. Good flame retardance of the layer-adding adhesive film is ensured, and the layer-adding adhesive film is applied to the adhesive-coated copper foil.

The invention relates to the technical field of new energy automobile power battery modules, in particular to a heat-conducting structural adhesive for a power battery and a preparation method thereof.The heat-conducting structural adhesive comprises a component A and a component B. The component A is prepared from 40-50 parts of siloxane-terminated polyether resin, 110-130 parts of heat-conducting filler, 0.4-0.6 part of a curing agent, 0.2-0.4 part of a coupling agent and 0.3-0.7 part of a water removal agent; the component B is prepared from the following components in parts by weight: 17 to 23 parts of epoxy resin, 45 to 55 parts of heat-conducting filler, 0.01 to 0.03 part of modified graphene oxide, 0.8 to 1.2 parts of water, 0.4 to 0.8 part of thixotropic agent, 0.3 to 0.7 part of adhesion promoter, 1 to 1.4 parts of coupling agent, 0.1 to 0.5 part of defoaming agent and 0.3 to 0.5 part of catalyst; the heat-conducting structural adhesive has the advantages that the heat-conducting property of the heat-conducting structural adhesive is improved, and the tensile strength is kept.

The invention relates to the technical field of adhesives, in particular to MS resin-epoxy resin two-component hybrid glue and a preparation method thereof.The MS resin-epoxy resin two-component hybrid glue comprises a component A and a component B. The component A comprises silane modified polyether resin, polysiloxane-polyether epoxy block copolymer, a silane coupling agent, an antioxidant, an epoxy resin curing accelerator, first filler and a first catalyst; the component B comprises epoxy resin, a silane coupling agent, a plasticizer, a silane modified polyether resin curing accelerator, a second filler and a second catalyst; and the silane coupling agent is a compound of KH-560 and KH-792. According to the MS resin-epoxy resin two-component hybrid glue, the polysiloxane-polyether epoxy block copolymer is added, and the bifunctional silane coupling agent is adopted, so that the compatibility of the MS resin-epoxy resin two-component hybrid glue is improved, effective chemical crosslinking is formed between the MS resin component and the epoxy resin component, and the performance of the two-component hybrid glue is improved.

The invention discloses an underwater sealing structural adhesive as well as a preparation method and application thereof. The underwater sealing structural adhesive is prepared from 20 to 30 parts of organic silicon modified epoxy resin, 10 to 20 parts of silane-terminated polyester, 10 to 15 parts of polyether polyol, 50.5 to 60.5 parts of filler, 15 to 25 parts of talcum powder, 1 part of fumed silica and 4.5 to 5.5 parts of titanium dioxide. The preparation method comprises the following steps: weighing the organic silicon modified epoxy resin, the silane-terminated polyester, the polyether polyol, the filler, the talcum powder, the fumed silica and the titanium dioxide in proportion, sequentially adding into a stirrer, stirring for 1-3 hours, uniformly stirring to obtain the underwater sealing structural adhesive, and packaging the discharged underwater sealing structural adhesive into a rubber tube. The application is to bond a joint in a water channel without cutting off water. According to the technical scheme provided by the invention, the technical problem that the bonding effect is poor when new and old geomembranes or concrete structures or the geomembranes and the concrete structures are bonded underwater is solved.

The invention belongs to the technical field of natural adhesives, and discloses a natural adhesive with coconut pectin biomass as a raw material and a preparation method thereof.The preparation method comprises the steps that coconut shell fibers, coconut meat residues and other coconut fruit waste are utilized, and active polysaccharide and vegetable protein are obtained through an oxidized saline water extraction technology; the composite adhesive is formed by self-assembly crosslinking of the modified starch, the polyvinyl alcohol, the modified starch and the epoxidized glyceryl polyether. The adhesive is high in bonding strength, the initial strength of 80% or above can still be kept after the adhesive is soaked in water, the content of VOCs is lower than 10 g / L, and the environment-friendly requirement is met. The problem of environmental pollution of a traditional petroleum-based adhesive is solved, meanwhile, the technical defects that an existing bio-based adhesive is insufficient in strength and poor in water resistance are overcome, a green and environment-friendly adhesive substitute is provided for the wood industry, and the production cost is remarkably reduced.

A curable thermally conductive adhesive comprising a curable binder and a thermally conductive filler, wherein a cured product of the curable thermally conductive adhesive has a tensile storage elastic modulus of 2.0×108 Pa or less and a tanδ of 0.05 or more and 0.6 or less measured by dynamic viscoelasticity measurement at 10 Hz at 25°C.

Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection comprises: a first adhesive layer that contains electroconductive particles, a cured product of a photocurable resin component, and a first heat-curable resin component; and a second adhesive layer that is provided on the first adhesive layer and that contains a second heat-curable resin component. The minimum melt viscosity of the adhesive film for circuit connection is 450-1600 Pa∙s.

The invention discloses a ceramic fire-resistant sealant for a bridge, a fireproof structure, a preparation device and a preparation method, and relates to the technical field of sealants for the bridge. The ceramic fire-resistant sealant for the bridge comprises the following specific components in parts by weight: 100 parts of an MS polymer; 0 to 100 parts of a plasticizer; 80 to 150 parts of aluminum hydroxide; 80 to 150 parts of modified wollastonite; 50 to 100 parts of calcium carbonate; 10 to 20 parts of zinc borate; 10 to 20 parts of melamine polyphosphate; 5 to 10 parts of dipentaerythritol; 5 to 10 parts of a dewatering agent; 5 to 10 parts of an adhesion promoter; and 0.5-2 parts of a catalyst. According to the ceramic fire-resistant sealant for the bridge, a rubber body formed after vulcanization is converted into a self-supporting ceramic body under the condition of high temperature or open fire, flame is prevented from diffusing into a material, so that the purposes of flame retardance and fire prevention are achieved, meanwhile, the mechanical property is not obviously attenuated before and after thermal aging, and good elasticity is still kept; and the vulcanized paint has excellent adhesive force to the paint, so that the use effect of the paint is guaranteed.

This two-component type room temperature rapid-curable resin composition comprises, at a specific ratio: a first agent containing, at a specific ratio, (A) an organic polymer in which the molecule chain terminals are blocked by a hydrolysable silyl group and / or a hydroxyl silyl group, and in which an organopolysiloxane structure is not included in the polymer main chain, (B) a hydrolyzable organosilane compound represented by formula (1) (in formula (1), R1 represents a monovalent hydrocarbon group, n represents 1-8, and m represents 3 or 4) and / or a partial hydrolysis condensate thereof, and (C) a curing catalyst; and a second agent containing (A') an organic polymer in which the molecule chain terminals are blocked by a hydrolysable silyl group and / or a hydroxyl silyl group, and in which an organopolysiloxane structure is not included in the polymer main chain. The two-component type room temperature rapid-curable resin composition has excellent rapid curability and deep curability, provides fine workability, and, when being cured, causes elimination / release of a cyclic ketone compound such as cyclobutanone and cyclopentanone as a leaving group (elimination compound). Thus, the composition solves problems regarding safety and hazardous properties with respect to human and the environment.

The invention relates to the technical field of semiconductor packaging adhesive films, and provides a resin composition, an adhesive film and application thereof. The resin composition disclosed by the invention is prepared from the following components in parts by weight: 5 to 20 parts of maleimide, 5 to 20 parts of alicyclic epoxy resin, 25 to 40 parts of thermoplastic high-molecular compound, 10 to 20 parts of bisphenol epoxy resin, 10 to 30 parts of benzoxazine resin and 30 to 300 parts of inorganic filler, wherein the degree of functionality of the alicyclic epoxy resin is not less than 3. The packaging adhesive film prepared from the resin composition provided by the invention has low thermal expansion coefficient and excellent heat resistance, can still keep stable adhesive force in a high-temperature and high-humidity environment, and is suitable for packaging semiconductors.

This easily dismantlable adhesive sheet (100) comprises an adhesive layer (10) containing a moisture-cured product of a silyl group-containing resin and a terpene phenolic tackifying resin, wherein the silyl group-containing resin has a polyoxyalkylene structure in a main chain, has, in a portion of the main chain or a side chain, both bonds among a urethane bond and a urea bond or one bond among the urethane bond and the urea bond, and has hydrolyzable silyl groups represented by formula (1) at both ends of the main chain. (In formula (1), X1 and X2 are each independently a hydroxy group or an alkoxy group, R is a C1-C20 alkyl group, and * is a bonding position.)

The invention provides an automobile elastic adhesive and a preparation method thereof, the automobile elastic adhesive comprises a component A and a component B, the component A comprises 35-50 parts of a silane modified polyether polymer 1, 5-10 parts of a silane modified polyether polymer 2, 5-10 parts of a first plasticizer, 0.5-2 parts of an antioxidant, 30-45 parts of a first filler, 0.2-0.5 part of a moisture scavenger and 2-4 parts of a cross-linking agent; the component A is prepared from epoxy resin, the component B is prepared from 60-80 parts of epoxy resin, 5-15 parts of a second plasticizer, 10-20 parts of a second filler, 4-6 parts of an accelerant and 1-2 parts of a catalyst, the moisture scavenger is hydrolyzed vinyl trimethoxy silane, the cross-linking agent comprises polyamino trimethoxy silane, and the volume ratio of the component A to the component B is (4-6): 1. According to the invention, the technical problems of dark fringes, cracking, odor, VOC (Volatile Organic Compounds) and the like of the existing acrylate and organic silicon adhesive can be solved.

The invention discloses a silane modified polyether sealant and a preparation method thereof, and belongs to the technical field of sealants. The sealant is prepared from the following raw materials in parts by mass: 80 to 100 parts of MS prepolymer, 1 to 3 parts of silane coupling agent, 10 to 20 parts of plasticizer, 10 to 30 parts of polydopamine modified boron nitride, 40 to 60 parts of nano calcium carbonate, 0.3 to 0.5 part of dibutyltin dilaurate, 0.1 to 0.4 part of light stabilizer and 0.5 to 1 part of ultraviolet absorbent. Wherein the MS prepolymer is obtained by carrying out hydrosilylation reaction on modified allyl-terminated polyether and hydrogen-containing silane, and a side chain of a molecular chain of the modified allyl-terminated polyether contains a benzoic acid structure. A rigid unit with an aromatic ring structure and polar carboxyl are introduced into a polyether long-chain side chain of silane modified polyether to form an MS prepolymer, and the MS prepolymer and polydopamine modified boron nitride have a synergistic effect, so that the sealant is endowed with high hardness and good flexibility.

The invention discloses a single-component low-viscosity glue-overflow-free epoxy resin electronic glue which is characterized by comprising the following components in parts by weight: 25-40 parts of epoxy resin, 0.5-2.5 parts of thermoplastic resin, 20-35 parts of a curing agent, 1-10 parts of an auxiliary agent, 15-40 parts of filler and 0.5-5 parts of an accelerant. According to the single-component low-viscosity glue-overflow-free epoxy resin electronic glue and the preparation method thereof provided by the invention, the thermoplastic resin is added into a system, so that the problems that a chip is polluted due to glue overflow in glue dispensing, wire drawing and heating curing processes, and the periphery of the chip is cracked due to large shrinkage rate after the overflowing glue is cured in a severe case can be effectively solved. Meanwhile, the system does not contain an organic solvent, volatile organic compounds are hardly released in the dispensing and curing processes, the problem of solvent residue is avoided, and the content of ion impurities is extremely low. The prepared epoxy resin electronic glue system has the advantages of low viscosity, no glue overflow after curing, no solvent addition and no VOC (volatile organic compound) addition.

The invention relates to the technical field of wall adhesives, in particular to a high-performance wall adhesive and a preparation method thereof. The high-performance wall adhesive is prepared from the following raw materials in parts by weight: 85 to 102 parts of emulsion A, 66 to 98 parts of emulsion B, 15 to 40 parts of cellulose, 8 to 25 parts of calcium powder, 32 to 51 parts of white sand, 21 to 35 parts of cement and 12 to 18 parts of bactericide, wherein the emulsion A is a chitosan modified cationic emulsion polymer, and the emulsion B is a nanoparticle modified acrylate emulsion. The prepared high-performance wall adhesive is good in bonding strength and has good waterproof and anti-corrosion performance.

The invention relates to the technical field of adhesives, in particular to a two-component hybrid adhesive and a preparation method thereof, and the two-component hybrid adhesive comprises a component A and a component B, the component A is prepared from the following raw materials in parts by weight: 50 to 70 parts of silane modified polymer, 10 to 30 parts of reinforcing filler, 2 to 6 parts of silane coupling agent and 3 to 7 parts of curing agent; the component B is prepared from the following raw materials in parts by weight: 40 to 60 parts of modified epoxy resin, 10 to 30 parts of reinforcing filler, 0.5 to 3 parts of catalyst and 0.5 to 2 parts of curing accelerator; the silane modified polymer is selected from a silane modified polyether polymer or a silane modified polyurethane polymer; according to the invention, the combination of the silane modified polymer and the modified epoxy resin is optimized, and the compatibility of the silane modified polymer and the modified epoxy resin is improved, so that the tensile modulus of the two-component hybrid adhesive is improved, and the problems that the compatibility between components of the existing two-component hybrid battery adhesive is poor, so that the prepared material is relatively soft, and the service life of the material is prolonged are solved. The tensile modulus is relatively low, and the use requirement and the safety requirement of the battery glue cannot be met.

The present invention relates to the technical field of adhesive materials, and specifically relates to a reusable high shear strength electrical debonding tape, and a preparation method. The tape is prepared using acrylate or olefin monomers, a methoxy polyethylene glycol-containing ester, acrylic acid, salts, functional monomers, an organic solvent, and a tackifying resin. In the electrical debonding tape of the present invention, most electrolytes are bonded to a main adhesive molecular chain through chemical bonds, and some electrolytes are dissociated and complexed by the strong ether-oxygen bonds of methoxy polyethylene glycol, rather than simple physical mixing as in the prior art, thus effectively preventing large-scale precipitation of electrolytes under electrified conditions, and enabling reuse.

To provide a resin composition which has high viscosity, and enables an optical fiber to be bonded to a groove of a silicon chip with a small exposure amount.SOLUTION: There is provided a resin composition for bonding an optical fiber to a groove of a silicon chip. The resin composition contains (A) a liquid aliphatic oxetane resin, (B) a solid aliphatic epoxy resin, (C) a liquid aliphatic epoxy resin, and (D) a photocationic polymerization initiator. The resin composition contains or does not contain (E) inorganic particles, and the amount of (E) the inorganic particles is 15 mass% or less with respect to 100 wt.% of the total amount of the resin composition.SELECTED DRAWING: Figure 1

The invention provides a single-component silane modified polyether adhesive with excellent heat resistance and a preparation method of the single-component silane modified polyether adhesive, and belongs to the technical field of adhesives. The adhesive comprises the following components in parts by mass: 30-50 parts of a silane modified polyether polymer, 10-20 parts of epoxy resin, 10-20 parts of a plasticizer, 0.5-1 part of an ultraviolet light absorber, 0.5-1 part of a light stabilizer, 0.5-1 part of an antioxidant, 40-60 parts of filler, 1-2 parts of a water removal agent, 3-6 parts of a silane coupling agent and 0.3-1 part of a catalyst. The adhesive has the characteristics of good heat resistance, good mechanical properties, high bonding strength, good ultraviolet resistance and good aging resistance, and can be used for heat-resistant electrophoresis requirements in the automobile manufacturing process and high-strength elastic bonding in equipment manufacturing.