176results about "Modified epoxy resin adhesives" patented technology

The invention belongs to the field of electronic display film materials, and discloses a UV optical film material and a manufacturing method and application thereof.The UV optical film material comprises a base material, a frosted layer, an inner protective film layer, an optical ink layer, a transparent adhesive layer and an outer protective film layer, and the inner surface of the base material is sequentially coated with the frosted layer and the inner protective film layer outwards; the outer surface of the base material is sequentially coated with an optical ink layer, a transparent adhesive layer and an outer protective film layer outwards; the coating process comprises the steps that the viscosity of UV optical ink is controlled to be 16 ''-18'', the outer surface of the base material is coated with the UV optical ink through a precise micro-concave ceramic coating roller, and then UV curing is conducted to form an optical ink layer; coating a transparent adhesive layer on the surface of the optical ink layer, and after curing, coating UV optical transfer adhesive on the inner surface of the base material to form a frosted layer; finally, the surface of the frosted layer and the surface of the transparent adhesive layer are coated with an inner protective film layer and an outer protective film layer respectively. The coating has the characteristics of high hardness and high adhesive force, the surface can be kept uniform, the edge sharpness is high, and discoloration can be effectively prevented.

The invention provides a multi-layer composite board and a manufacturing process thereof, a refrigerator door body and a household appliance shell, and relates to the technical field of composite materials. The invention provides a multi-layer composite board. The multi-layer composite board comprises a base board, a magnetic sheet and a bonding layer. And the substrate is made of a glass material. And the magnetic sheet is compounded on one side of the substrate and can be attracted with a metal material or a magnetic material. The bonding layer is arranged between the substrate and the magnetic sheet and is used for bonding the substrate and the magnetic sheet; the bonding layer comprises raw material components which can be formed through light curing. The multi-layer composite board provided by the invention has the characteristics of magnetic attraction and corrosion resistance, also has the characteristics of simple process, easiness in manufacturing and low energy consumption, and is relatively high in structural stability.

The invention relates to the technical field of UV adhesive production, in particular to a low-cost, low-viscosity, high-toughness and weather-resistant three-proofing UV adhesive and a preparation method thereof.The low-cost, low-viscosity, high-toughness and weather-resistant three-proofing UV adhesive is prepared from, by weight, 40%-60% of urethane acrylate oligomer, 20%-48% of reactive diluent, 2%-5% of photoinitiator, 0.05%-0.2% of polymerization inhibitor, 1%-5% of flexibilizer and 1%-3% of coupling agent. The invention provides an environment-friendly three-proofing UV (ultraviolet) adhesive with low cost, low viscosity, high toughness and high weather resistance. The defects that a traditional adhesive is high in cost, high in viscosity, difficult to construct and incapable of balancing toughness and adhesive strength are overcome by optimizing the addition of a polyurethane acrylate oligomer, a reactive diluent and an auxiliary agent.

The invention relates to a low-expansion moisture-resistant electronic component packaging resin adhesive and a preparation method thereof, and belongs to the technical field of high polymer materials. The resin adhesive comprises the following components: modified resin, phenyl methyl organic silicon resin, epoxy vinyl resin, a dynamic functional curing agent, a microencapsulated dicyandiamide curing agent, perfluorooctyltriethoxysilane, functional filler and the like; the modified resin is obtained by modifying hydrogenated bisphenol A epoxy resin with hydrogen-terminated polydimethylsiloxane and trimethylsiloxy silicate ester, adding a silane coupling agent and mixing; the dynamic function curing agent is obtained by reacting hexamethylenediamine and intermediate powder obtained by reacting 2, 3-dihydroxy benzaldehyde with pinacol borane; the functional filler comprises silicon dioxide and boron nitride which are subjected to surface treatment by a silane coupling agent. The low-expansion and high-moisture-resistance electronic component packaging resin adhesive is prepared from the components according to a specific ratio and a specific method, the components have a synergistic effect and play advantages, and the packaging reliability and the service life of an electronic component are guaranteed.

The present invention provides a modified polyolefin resin composition that exhibits excellent water resistance, excellent bending resistance, sufficient fluidity within a specific temperature range, and excellent adhesion to polyolefin substrates. Specifically, the present invention provides a modified polyolefin resin composition containing an acid-modified polyolefin resin (A) and a compound having a polymerizable unsaturated group (B), in which the compound having a polymerizable unsaturated group (B) contains a compound having a polymerizable unsaturated group with an elongation at break of 30% or more (B-1).

One purpose of the present invention is to provide a curable resin composition that has excellent fluid characteristics before being cured, excellent leach preventing ability when being semi-cured, and excellent heat resistance after being fully cured. Another purpose of the present invention is to provide: a cured product of said curable resin composition; and an adhesive agent and an adhesion film which are obtained by using said curable resin composition. This curable resin composition contains a curable resin, a photoinitiator, and a thermosetting agent. The thermosetting agent contains an imide oligomer.

Embodiments of the present application disclose an encapsulation material, a display panel, and an encapsulation method. By mass percentage, the encapsulation material includes a main resin, 20%-50%; a dilute monomer, 20%-50%; a stabilizer, 0.01%-2%; a microgel, 1%-10%; a chain transfer agent, 0.01%-5%; and an initiator in a remaining percentage balance. The encapsulation material can be cured under action of UV light to form an encapsulation layer, anti-aging performance of the encapsulation layer can be improved, and toughness can be enhanced to reduce warpage. The microgel structure can enhance the toughness of the encapsulation layer and make it have excellent corrosion resistance. Ester activated vinyl sulfonate is used as the chain transfer agent to make an average chain length in a polymer network shorter, reduce a risk of shrinkage cracks appearing during curing, and enhance the toughness of the encapsulation layer after the curing.

The invention relates to the field of UV adhesive materials, in particular to a free radical cation hybrid red UV adhesive for flat cable bonding and a preparation method thereof. The free radical cationic hybrid red UV adhesive is prepared from the following raw materials: a cationic UV curing resin monomer, free radical resin, a free radical monomer, a cationic photoinitiator, a free radical photoinitiator, a coupling agent, a thixotropic agent, a reinforcing combination agent, a red pigment and the like. The finally prepared red UV adhesive not only can combine the advantages of two UV curing systems to realize low energy and complete curing and rapid curing of an illumination shadow area and a thick layer, but also can maintain excellent storage stability, environmental aging resistance and other properties, greatly improves the comprehensive properties of the UV adhesive, and has wide application prospects. The application quality and the service life are improved.

The application discloses an optical diffuser, an optical system comprising the optical diffuser and an electronic device, and the optical diffuser comprises a substrate and microlenses prepared by optical glue and located on a first surface of the substrate, wherein the optical glue comprises modified acrylic resin with a rigid group and a dilution monomer; the optical diffuser satisfies at least two conditions: a FOV change rate is less than or equal to 3% under a 105 DEG C high-temperature 72h environment; the FOV change rate is less than or equal to 5% under a -40 DEG C low-temperature 72h environment; the FOV change rate is less than or equal to 8% under a 85 DEG C 72h environment; and the FOV change rate is less than or equal to 4% under a -40 DEG C to 105 DEG C thermal shock 72h environment. The optical diffuser disclosed by the application optimizes the glue material, and compared with the glue before adjustment, the FOV value of the application changes little under various reliability test environments, and meets the development of high-end applications such as AR / VR and vehicle-mounted HUD.

The invention belongs to the technical field of photocuring materials, and particularly relates to an infrared-resistant welding photocuring adhesive and a preparation method thereof. The infrared-resistant welding photocuring adhesive is prepared from the following components in parts by weight: 30 to 50 parts of urethane acrylate, 5 to 25 parts of epoxy acrylate, 20 to 40 parts of acrylate monomer, 1 to 4 parts of free radical photoinitiator and 3 to 5 parts of adhesion promoter. The photocuring adhesive provided by the invention can still keep good adhesive strength after undergoing an infrared welding process, has good yellowing resistance, and meets the packaging requirements of solar cells.

A method for producing a laminate that is obtained by bonding an adherend with a cured product having a high elastic modulus in a high-temperature environment even in a case where low-temperature curing is carried out, is provided. The method for producing a laminate includes the steps of applying a curable resin composition having a specific composition to a first adherend and bonding the first adherend with a second adherend, and subjecting the curable resin composition to low-temperature curing. The laminate has a ratio of a thickness of the cured product and an average thickness of those adherends in a specific range.

The invention discloses a water-based polymer cold-mixing crack pouring adhesive for road maintenance, which comprises a component A and a component B. The component A comprises unsaturated water-based epoxy resin, unsaturated rubber modified emulsified asphalt, a filler, an oxidant and an antioxidant, and the component B comprises a reducing agent, a water-based epoxy hardener, an accelerant and unsaturated rubber modified emulsified asphalt. The unsaturated water-borne epoxy resin and the unsaturated rubber modified emulsified asphalt can be cured at room temperature under the action of the oxidizing agent and the reducing agent, and the unsaturated water-borne epoxy resin and the water-borne epoxy curing agent can also be cured at room temperature, so that after the component A and the component B are mixed, a system can be subjected to dual-curing reaction, and the curing effect is good. And forming an interpenetrating network structure. Compared with the traditional crack pouring adhesive, the crack pouring adhesive does not need heating equipment, is low in consumption and can reduce the material cost; due to the excellent adhesion of an epoxy system, the crack pouring adhesive is firmly adhered to the wall surface of a crack, is not easy to debond and crack, and is durable.

The invention discloses a binder, a bonded permanent magnet and a preparation method and application of the bonded permanent magnet. The adhesive is prepared from the following raw materials in parts by weight: 35 to 60 parts of first cured resin, 10 to 40 parts of second cured resin, 2 to 5 parts of a photoinitiator, 0.1 to 0.5 part of a photosensitizer, 2 to 8 parts of a nitrogen-containing organic curing agent, 5 to 20 parts of a reactive diluent, 0.1 to 0.5 part of a defoaming agent, 0.02 to 0.1 part of a polymerization inhibitor and 0.2 to 0.5 part of an antioxidant. According to the binder disclosed by the invention, the raw materials of the bonded permanent magnet can be rapidly cured under the irradiation of infrared light and ultraviolet light, the preparation time is remarkably shortened, and the prepared bonded permanent magnet has relatively high dimensional precision, excellent non-deformability and relatively good magnetic performance.

The present application relates to the technical field of adhesive tape, in particular to the field of IPC B65H35, further to a high-temperature-resistant cutting adhesive tape and a preparation method thereof.From top to bottom, the high-temperature-resistant cutting adhesive tape comprises a protective layer, an adhesive layer and a substrate layer in sequence.The adhesive of the adhesive layer comprises the following raw materials in parts by mass: 70-90 parts of prepolymer, 20-50 parts of active diluent, 3-10 parts of photoinitiator, 1-4 parts of antioxidant and 3-6 parts of silane coupling agent.The present application selects to introduce bisphenol A epoxy acrylate and phenolic epoxy acrylate, and selects isobornyl acrylate and dipropylene glycol diacrylate to be used as the active diluent together, so that the cross-linking degree of the adhesive system is high, the system has a suitable curing shrinkage, the cohesive strength of the system is large, the high-temperature-resistant cutting adhesive tape has good bonding performance while the high-temperature-resistant performance is improved, and the prepared high-temperature-resistant cutting adhesive tape has excellent bonding performance and high-temperature-resistant performance.

The application provides a low dielectric glue, which comprises the following components in percentage by mass: low dielectric filler 3-15%, flame retardant 15-30%, main body resin 30-60%, curing agent 2-15% and active diluent 3-15%. The low dielectric glue provided in the application has low dielectric constant and dielectric loss after curing, high bending modulus and good flame retardancy.

The utility model belongs to the technical field of conductive material engineering, and particularly relates to an etchable conductive or heat-conducting adhesive film. The utility model discloses a 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three-dimensional) 3D (three- the 3D microstructure layer is solidified or bonded on the surface of the epoxy glue layer, the high-filling-rate protection glue film is attached to the surface of the epoxy glue layer provided with the 3D microstructure layer, and the release protection film is bonded on the surface of the high-filling-rate protection glue film. The utility model has the advantages of simple structure, no need of special tools, simple operation process, low cost, easy secondary development, and unlimited product size.

The invention relates to the technical field of underfill adhesives for flip chips, in particular to an underfill adhesive for improving stability and a preparation method of the underfill adhesive. According to the underfill adhesive provided by the invention, by adding the active copolymer, the cold and hot impact resistance and the damp and heat resistance are improved at the same time, and after high and low temperature circulation at-55 DEG C to 125 DEG C and di-85 damp and heat aging, an electrical property test is still qualified, excellent stability is shown, and the actual use of the underfill adhesive for flip chips is better met. The active copolymer is obtained by copolymerizing a compound A, polyethylene glycol diacrylate, an unsaturated epoxy compound and an alkenyl silane coupling agent according to a mass ratio of (15-20): 100: (20-30): (4-7); the compound (A) has a Si-O-Si cyclic skeleton containing four or more Si atoms, and has at least one polymerizable alkenyl group and at least two epoxy groups.

Provided are: a composition for forming an adhesive layer, which has excellent decomposability by light irradiation when forming an adhesive layer, and which is capable of reducing residues generated when the adhesive layer is decomposed; a method for producing a laminate in which the composition for forming an adhesive layer is used in an adhesive layer; and a method for treating a laminate. A composition for forming an adhesive layer, which is capable of separating a light-transmitting support and an adherend from the laminate by irradiating light from the support side in the laminate comprising an adhesive layer between the support and the adherend, the composition comprising: (A) a polymerizable resin containing an unsaturated group; and (E) a solvent. The absorbance of light having a wavelength of 266 nm of the cured film obtained under predetermined conditions is 0.50 or more. The weight loss rate of the component (A) obtained under predetermined conditions is 50 mass% or more.

The invention relates to an adhesive and a preparation method thereof, a battery string and a photovoltaic module. The adhesive comprises the following components in percentage by mass: 30%-70% of acrylate resin, 10%-30% of a polyfunctional acrylate monomer, 0.5%-3% of a coupling agent, 5%-30% of filler and 3%-8% of an initiator, wherein the acrylate resin comprises epoxy acrylate resin accounting for 30-70% of the mass fraction of the adhesive and other types of acrylate resin accounting for 0-20% of the mass fraction of the adhesive. The adhesive contains the acrylate resin with specific content, the multifunctional acrylate monomer, the coupling agent, the filler and the initiator, can improve the bonding strength of a battery piece and a welding strip and improve the bonding tension, and has good humidity and heat resistance.

To provide a resin composition and a cured material thereof excellent in resistance to impact at falling after curing and excellent also in solvent resistance, an adhesive for electronic component containing the resin composition, a semiconductor device containing a cured material of the resin composition, and an electronic component.SOLUTION: A resin composition comprises (A) an epoxy resin containing a hydrogenated bisphenol A type epoxy resin, (B) a polyfunctional thiol resin, and (C) a curing catalyst, wherein the elastic modulus of the cured product at 50°C is 0.5 GPa or more, and (A) the hydrogenated bisphenol A type epoxy resin is contained by 65 pts.mass or more relative to 100 pts.mass of the epoxy resin in the resin composition.SELECTED DRAWING: None

The invention belongs to the technical field of ultraviolet curing adhesives, and particularly relates to an anti-yellowing UV adhesive and a preparation method thereof. The UV adhesive is prepared from modified acrylate resin, an epoxy modified acrylate monomer, a monomer diluent, a photoinitiator, an antioxidant, an ultraviolet absorbent and optional auxiliaries, the mass ratio of the modified acrylate resin to the epoxy modified acrylate monomer is 1: (0.1-0.3); the modified acrylate resin has a structure as shown in a formula (1); the epoxy modified acrylate monomer has a structure as shown in a formula (3). The key point of the invention lies in that the UV adhesive is synergistically modified by adopting the specific modified acrylate resin containing an alicyclic structure, the epoxy modified acrylate monomer with a castor oil structure, the antioxidant and the ultraviolet absorbent, so that the long-term yellowing resistance and aging resistance of the UV adhesive are remarkably improved; the service life of the adhesive is prolonged.

The invention discloses a high-insulation acrylic acid glue solution, a support membrane and a preparation method thereof, and relates to the technical field of support membranes, the high-insulation acrylic acid glue solution comprises the following components by weight: 30-80 parts of acrylic resin, 10-15 parts of a cross-linking agent, 5-10 parts of modified boron nitride, 0.5-1.5 parts of a silane coupling agent, 1-10 parts of fluorine-containing acrylate, and 48-64 parts of a solvent; wherein the modified boron nitride is subjected to amination or hydroxylation modification treatment, and the particle size of the modified boron nitride is 150-300 nm. According to the present invention, the high temperature resistance, the stripping force and the chemical corrosion resistance are significantly improved.

The invention provides an adhesive for a glass manufacturing process and application of the adhesive, and belongs to the technical field of auxiliary materials for the glass manufacturing process. The adhesive for the glass manufacturing process comprises the following components in parts by mass: 80-120 parts of an acrylic resin polymer, 5-15 parts of epoxy acrylic resin, 2.5-7.5 parts of polyurethane acrylic resin, 1-3 parts of an antistatic agent, 1-2 parts of a curing agent, 1-3 parts of a photoinitiator and 50-135 parts of an organic solvent, wherein the weight-average molecular weight of the acrylic resin polymer is 70-80 million. According to the invention, an acrylic resin polymer with a weight-average molecular weight of 70,000-800,000 is adopted, and light-cured resin (including polyurethane acrylic resin and epoxy acrylic resin), an antistatic agent, a curing agent, a photoinitiator and an organic solvent are added; the prepared adhesive for the glass process can effectively solve the problem that the existing acrylic pressure-sensitive adhesive is difficult in film tearing after viscosity reduction in UTG glass etching.

The invention belongs to the technical field of organic synthesis, and relates to a trifunctional epoxy compound as well as a preparation method and application thereof. The trifunctional epoxy compound has a structure as shown in formula (1). Halogenated epoxypropane, tetraethylene glycol and 2, 6-diformaldehyde-4-hydroxypyridine are used as initial raw materials, all halogenated epoxypropane, tetraethylene glycol and 2, 6-diformaldehyde-4-hydroxypyridine have active reaction types and good structural stability, it can be ensured that the reaction activity is fully exerted, the stability of the reaction process is ensured, and the reaction yield is improved. The total yield is favorably improved, so that the efficient synthesis of the trifunctional epoxy compound is realized. In addition, the preparation system of the trifunctional epoxy compound provided by the invention is simple, easy to operate and mild in reaction condition, and the whole reaction system is economical, environment-friendly and efficient. In addition, the trifunctional epoxy compound provided by the invention has unique electron conjugation characteristics and chemical activity, and when the trifunctional epoxy compound is applied to an epoxy adhesive, the epoxy adhesive can be endowed with good toughness. Formula (1)

Provided is a primer composition capable of improving adhesion between a substrate and a cured product layer formed of a cured product of a photosensitive composition regardless of a type of the substrate, a laminate including a primer layer derived from the primer composition, and a method for producing the laminate. The primer composition contains a base material component (A), a compound (B), and a solvent (S), the base material component (A) contains a resin (A1) and / or a polymerizable compound (A2), the polymerizable compound (A2) is a compound polymerizable by a polymerization mechanism other than radical polymerization, and the compound (B) has a functional group capable of forming a covalent bond by a reaction with an ethylenic unsaturated double bond-containing group in a photocurable compound (a) in a photosensitive composition.

This invention relates to the field of decorative material manufacturing technology, particularly to equipment and methods for manufacturing PET and PVC 3D refracting decorative films. The equipment includes a PET film unwinding roller, a PVC film unwinding roller, a mirror steel roller, a glue roller, a first guide roller, a second guide roller, a third guide roller, a finished film take-up roller, a glue dispensing component, a UV lamp, and a frame. The PET film unwinding roller is rotatably mounted on the right side of the frame, the PVC film unwinding roller is rotatably mounted on the upper left side of the frame, and the finished film take-up roller is rotatably mounted on the lower left side of the frame. The mirror steel roller, glue roller, and first guide roller are horizontally movable and mounted on the upper middle part of the frame. The glue dispensing component is installed above the mirror steel roller and the glue roller, and is used to apply UV glue to the surface where the PET and PVC films are bonded. The second guide roller is located directly below the glue roller, and the length of the UV lamp is the same as the length of the mirror steel roller. A first driving component drives the finished film take-up roller to rotate, ensuring that the 3D refracting decorative film achieves a smooth, flat surface free of orange peel texture and interlayer bubbles.

The present disclosure generally relates to a one-component adhesive composition comprising a radically polymerizable component, an impact modifier, an adhesion promoter, a flexibilizer, a cure accelerator, an encapsulated radical-forming compound, and optionally a thixotropic modifier, and to the use of the one-component adhesive composition in bonding substrates to each other.

This invention provides a high-reliability UV adhesive for polarizing films, composed of the following raw materials by weight percentage: 25-55% alicyclic epoxy resin, 3-15% dicyclopentadiene acrylate monomer, 10-30% acrylic acid-modified castor oil epoxy resin, 10-30% glycidyl ether type epoxy compound, 1-10% adhesion promoter, 0.3-3% sensitizer, and 0.5-8% photoacid generator. The UV adhesive of this invention exhibits high adhesion strength to COP films, maintains adhesion over time, and is resistant to yellowing, overcoming the shortcomings of conventional UV adhesives, such as low adhesion and degradation over time.

The invention discloses an LCOS (Liquid Crystal On Silicon) liquid crystal display box and a low-box-thickness high-toughness frame sealing adhesive, and the frame sealing adhesive comprises the following raw material components: modified acrylate, epoxy resin A, epoxy resin B, a silane coupling agent, an organic filler, a photoinitiator and a thermal curing agent, the epoxy resin A and the epoxy resin B are epoxy resins with different functionalities or different molecular skeletons respectively, and the thermal curing agent is a liquid latent curing agent and a hyperbranched polymer structure with a terminal tertiary amine group. According to the frame sealing glue disclosed by the invention, the box thickness can be less than 1 mu m, and a cured product has excellent toughness and good high-temperature and high-humidity resistance; and the frame sealing glue is particularly used for solving the problems of weak adhesion and low reliability of an LCOS liquid crystal display box in AR / VR equipment during ultrathin packaging.

The invention discloses a high-reliability chip bonding film, a preparation method thereof and application of the high-reliability chip bonding film in storage packaging, and relates to the technical field of electronic packaging materials. The chip bonding film is prepared from the following components in parts by mass: 30 to 40 parts of spherical silicon dioxide, 10 to 20 parts of phenoxy resin, 10 to 20 parts of acrylic epoxy resin, 10 to 15 parts of polyurethane modified epoxy resin, 3 to 6 parts of active epoxy diluent, 8 to 16 parts of phenolic aldehyde curing agent and 0.8 to 1.2 parts of accelerant, by adjusting the proportion of all the components and the synergistic effect of all the components, the strain capacity and moisture absorption resistance at high temperature are remarkably improved while excellent heat resistance is successfully maintained, so that high interface bonding strength can still be maintained after a harsh temperature cycle test; and the problem of packaging failure caused by brittle rupture and moisture absorption of the material is effectively solved.