High purity photo-thermal curing adhesive and preparation method thereof

A dual-curing, high-purity technology, applied in the direction of modified epoxy resin adhesives, optics, nonlinear optics, etc., can solve the problems of long curing time and low purity of adhesive liquid, and achieve long curing time and orientation Excellent performance and the effect of reducing product cost

Inactive Publication Date: 2010-02-24
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented inventor describes an improved type of material called photothermal-dihydroxy compound (PDC) which was developed by Dr. Yoshikawa et al., who discovered during research on photosensitive resin compositions used for manufacturing electronic devices such as LCD displays. These new types were more stable at higher temperatures compared to previous versions but they had better electrical properties over longer periods due to their low content of soluble impurities or other factors like moisture from condensed vapor generated when heated up. Overall, these technical improvements made PDCs stronger and last longer without containing any harmful substances found inside them.

Problems solved by technology

Technically speaking, current methods of manufacturing liquid display devices involve connecting multiple parts together with a special material called sealed glue or thermal insulation tape. These processes are slow due to their lengthy process times and require expensive materials like solvents. Additionally, these techniques have issues such as low purities (liquids) causing unwanted residues during production), difficulty controlling alignment when attaching layers, lack of stability over prolonged periods of use, potential damage from environmental factors, etc., making them difficult to maintain consistently.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Example 1, weigh 30g of pure resin A1 prepared above, 6g of dicyclopentene acrylate FA-511AS, 6g of bisphenol A dimethacrylate, 15g of epoxy resin 850S, I-184 (1-hydroxycyclohexyl Phenyl ketone) 1.5g, VDH 14g, synthetic silicon filler Nippon Steel M-2010 25g, KH-560 (γ-glycidyl etheroxypropyltrimethoxysilane) 2.5g, purified and mixed according to the above method Adhesives of the present invention.

[0029] Determination of purity: Purity is the main index to measure the performance of adhesives. at 100mw / cm 2 The high-pressure mercury lamp was used for curing for 30 seconds, and then cured for 1 hour at 120 ° C to make it completely cured. Say the product of embodiment 1 is about 1g, in N 2 Crushed under the protection of the environment, dissolved in 100g of ultrapure water, and pressurized at 121°C for 24 hours, the ion conductivity was only 8.9μs / cm.

[0030] The commercially available light-curing adhesive: frame sealant Co-effort 815 has an ionic conductivity ...

Embodiment 2

[0034] Embodiment 2, with embodiment 1, difference is that pure resin adopts A2.

Embodiment 3

[0035] Example 3, weigh 100g of pure resin A1 prepared above, 40g of 2-hydroxyethyl acrylate, 50g of epoxy diluent 830S, 4g of 2-hydroxy-methyl-1-phenyl-1-acetone, latent 44g of epoxy resin curing agent VDH, 80g of talc, and 5g of vinyl silane were purified according to the above method and mixed to obtain the adhesive of the present invention.

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Abstract

The invention discloses a high purity photo-thermal curing adhesive and a preparation method thereof. The curing adhesive is characterized in that the curing adhesive is prepared by purifying and mixing the following raw materials according to the parts by weight: 100 parts of acrylic acid or methacrylic acid modified epoxy resin, 30-70 parts of acrylate or methylpropionate, 20-80 parts of epoxy diluent, 0.5-5 parts of photoinitiator, 3-50 parts of latent epoxy resin curing agent, 0-100 parts of inorganic packing and 1-10 parts of additive. The curing adhesive of the invention is an adhesive for electronic packaging with short curing time and high purity.

Description

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Claims

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Application Information

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Owner YANTAI DARBOND TECH
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