Preparation method for high strength solventless epoxy adhesive

An epoxy adhesive, solvent-free technology, applied in the direction of modified epoxy resin adhesive, etc., can solve the problems of not meeting high temperature conditions, endangering human health, poor processability, etc., achieving low cost and convenient operation , Excellent bonding performance

Inactive Publication Date: 2009-09-30
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there are also some problems in the epoxy resin adhesive system: (1) solvent type: the volatilization of the solvent pollutes the environment and endangers human h...

Method used

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  • Preparation method for high strength solventless epoxy adhesive
  • Preparation method for high strength solventless epoxy adhesive
  • Preparation method for high strength solventless epoxy adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] 22.6 grams (0.1 moles) of 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 24.8 grams (0.1 moles) of 4,4'-diaminodiphenylsulfone, 400 grams of E-44 ring Add the epoxy resin into the reaction bottle, react at 60°C for 0.5 hours, add 32 grams of carboxy-terminated nitrile rubber (active toughening agent), and react at 80°C to 110°C for 3 hours to obtain a viscous modified ring Oxygen resin system. Add 40 grams of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexyl carbonate reactive diluent, 10 grams of dicyandiamide and 30 grams of methyltetrahydrophthalic anhydride two curing agents, stir well , obtained a high-strength solvent-free epoxy adhesive.

[0033] Take an appropriate amount of the adhesive obtained above, and evenly spread it on the standard iron test piece. Cool to room temperature.

[0034] The adhesive system has good viscosity controllability, can be adjusted in a wide range, has good manufacturability, and has excellent adhesion to metal substrates (including ir...

Embodiment 2

[0036]20 grams (0.1 mol) of 4,4'-diaminodiphenyl ether, 24.8 grams (0.1 mol) of 4,4'-diaminodiphenylsulfone, 50 grams of E-51 epoxy resin, 180 grams of N,N, Add N', N',-tetraglycidyl-4,4'-diaminodiphenylmethane into the reaction flask, react at 60°C for 0.5 hours, at 80°C for 0.5 hours, and at 100°C for 0.5 hours, add 46 g Carboxyl-terminated nitrile rubber (active toughening agent), react at a temperature of 80°C to 110°C for 1 hour to obtain a viscous modified epoxy resin system. Add 2300 grams of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexyl carbonate reactive diluent, 30 grams of dicyandiamide and 200 grams of 3,3',4,4'-tetracarboxylic acid Diphenyl ether dianhydride powder and two curing agents are stirred evenly to obtain a high-strength solvent-free epoxy adhesive.

[0037] Take an appropriate amount of the adhesive obtained above, and evenly spread it on the standard iron test piece. Cool to room temperature.

[0038] The adhesive system has good viscosity control...

Embodiment 3

[0040] Add 24.8 grams (0.1 moles) of 4,4'-diaminodiphenyl sulfone and 160 grams of E-51 epoxy resin into the reaction flask, and react at a temperature of 60°C to 100°C for 2 hours, then add 10 grams of carboxy-terminated butyl Nitrile rubber (active toughening agent) and 10 grams of phenolic hydroxyl-containing polyimide powder (active toughening agent: Shanghai EMST Electronic Materials Co., Ltd.) were reacted at a temperature of 80°C to 110°C for 2 hours to obtain viscous Modified epoxy resin system. Add 800 grams of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexyl carbonate reactive diluent, 30 grams of dicyandiamide curing agent, stir evenly, and obtain a high-strength solvent-free epoxy adhesive mixture.

[0041] Take an appropriate amount of the adhesive obtained above, and evenly spread it on the standard iron test piece. Cool to room temperature.

[0042] The adhesive system has good viscosity controllability, can be adjusted in a wide range, has good manufacturabil...

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Abstract

The invention relates to a preparation method for a high strength solventless epoxy adhesive. The preparation method comprises the following steps: carrying out reaction on an aromatic primary diamine and an epoxy resin for 0.5 to 2 hours at 60 to 100 DEG C, adding an active flexibilizer, and carrying out reaction for 1 to 3 hours at 80 to 110 DEG C to obtain a modified sticky epoxy resin system; and adding an active diluent and a curing agent in the modified epoxy resin system, and stirring the mixture evenly to obtain the high strength solventless epoxy adhesive. The preparation method has a simple process, low cost, convenient operation and convenient reaction raw material sources, and is capable of completing the preparation process in a general device and facilitates realization of the industrialized production. In addition, the viscosity of the high strength solventless epoxy adhesive reaches 15 to 1,000 Pa.s at 25 DEG C; the bond strength maximally reaches 35 MPa; and the high strength solventless epoxy adhesive has bright application prospect.

Description

technical field [0001] The invention belongs to the field of preparation of epoxy adhesives, in particular to a preparation method of high-strength solvent-free epoxy adhesives. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts and is the main component of structural adhesives One; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: the curing of epoxy resin is mainly It relies on the ring-open...

Claims

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Application Information

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IPC IPC(8): C09J163/10C08G59/14
Inventor 虞鑫海陈洪江吴敏徐永芬
Owner DONGHUA UNIV
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