53results about How to "Good viscosity controllability" patented technology

The invention relates to high-temperature resistant copper foil glue containing the following components: 5-15wt percent of trifluoromethyl-contained maleimide resin, 10-30wt percent of polyfunctional ethoxyline resin, 10-40wt percent of bisphenol A epoxy resin, 5-15wt percent of ethylene-contained polyetherimide, 5-10wt percent of curing agent and 25-45wt percent of organic solvent; the preparation comprises the following steps of: adding the trifluoromethyl-contained maleimide resin and the ethylene-contained polyetherimide to the mixture of the polyfunctional ethoxyline resin and the bisphenol A epoxy resin, stirring while heating for reacting, and then cooling to 30-50 DEG C; adding the organic solvent and the curing agent; evenly stirring to obtain the high-temperature resistant copper foil glue the homogeneous phase of which is transparent and clear. The high-temperature resistant copper foil glue has Tonset temperature reaching up to 415 DEG C and excellent comprehensive performance, can be applied to the high-tech fields of electronics and microelectronics, automobiles, electrical machines, aerospace and the like; moreover, the invention has simple preparation process, low cost, convenient operation and available reaction raw materials, thereby being beneficial to realizing industrial production.

The invention relates to a heat-resistant solvent-free immersion paint which comprises the following components in percentage by weight: 10%-15% of organosilicon polyfunctional epoxy resin, 15%-35% of silicon-free polyfunctional epoxy resin, 5%-10% of curing agent and 45%-65% of reactive diluent. The preparation method thereof comprises the following steps: adding the organosilicon polyfunctionalepoxy resin, the reactive diluent and the silicon-free polyfunctional epoxy resin into a kettle, reacting for 0.5h at the temperature of 100 DEG C, cooling, adding the curing agent, and evenly stirring at room temperature, thus obtaining sticky liquid, i.e. the heat-resistant solvent-free immersion paint. The preparation process is simple, the cost is low, and the industrialized production can beeasily realized; the room-temperature longitudinal shear strength of the heat-resistant solvent-free immersion paint is high; and the heat-resistant solvent-free immersion paint has excellent heat resistance, strong hydrophobic property and wide application prospects in the fields of high-power traction electric machines, high-power generators, drilling motors, mining motors and the like.

The invention relates to DAHTM type silicon-containing epoxy imide matrix resin and a preparing method thereof. The matrix resin is prepared from 4,4'-diamido-4''-hydroxy triphenylmethane (DAHTM), epoxy resin, 3-aminopropyl trialkoxysilane, an imide oligomer and a curing agent. The preparing method includes the following steps that 1, the imide oligomer is prepared; 2, DAHTM and epoxy resin are put into a reaction kettle, stirred and mixed for reaction, then the imide oligomer is added, the mixture continues to be stirred for reaction, then 3-aminopropyl trialkoxysilane is added and stirred for reaction, the curing agent is added and stirred to be mixed uniformly to obtain the matrix resin. The matrix resin can be widely applied to adhesion between metal such as steel, copper and aluminum and a base material such as ceramic, glass and a resin-based composite material and used for preparing glass fiber, aramid fiber and carbon fiber reinforced composite and has good industrial prospects.

The invention relates to BDABP type silicon containing epoxy imide matrix resin and a preparation method thereof. The matrix resin is prepared from 4,4'-bis(2,4-diamino phenoxy)biphenyl BDABP, epoxy resin, 3-aminopropyl trialkoxysilane, an imide oligomer and a curing agent. The preparation method comprises the following steps that 1, the imide oligomer is prepared; 2, 4,4'-bis(2,4-diamino phenoxy)biphenyl and the epoxy resin are placed in a reaction still, after stirring, mixing and reacting, the imide oligomer is added, the mixture continues to be stirred to react, then 3-aminopropyl trialkoxysilane is added and stirred to react, the curing agent is added, and the mixture is stirred and mixed to be uniform. The BDABP type silicon containing epoxy imide matrix resin can be widely applied to bonding among steel, copper, aluminum and other metal and ceramic, glass, resin-based composites and other base materials and preparation of glass fiber, aramid fiber and carbon fiber reinforced composites, and has good industrial prospects.

The invention relates to a 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and a preparation method thereof. The 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive is composed of a component A and a component B in a mass ratio of 1:(1-2), wherein the component A is a copolymer prepared by reacting 4,4'-bis(2,4-diamido phenoxy)diphenylsulphone and epoxy resin; and the component B is a homogeneous-phase transparent solution with the solid content of 15-30%, which is prepared by reacting 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and diphenylsulphone. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

The invention relates to a preparation method of high temperature resistant single-component solventless epoxy adhesive. The method comprises the following steps: adding aromatic binary primary amine and strongly polar non-proton organic solvent in a reaction tank, stirring at room temperature to dissolve, adding aromatic binary acid anhydride to perform refluxing and water-segregating reaction at 120-150 DEG C for 6-12h, cooling, adding the reaction solution in a stamp tank with precipitant to precipitate solid powder, namely white thermoplastic polyimide powder, adding white thermoplastic polyimide powder and tertiary amine compound or imidazole compound in epoxy resin to react for 1-2h, adding active diluent and latent curing agent to stir evenly and obtaining the product. The production process is easy and the cost is low so as to realize industrialized production; the tensile shear intensions of the epoxy adhesive at room temperature and 120 DEG C are respectively up to 28Mpa and26Mpa and the epoxy adhesive has broad application prospect in fields such as electronics and microelectronics, electrical motors, aviation and aerospace and the like.

The invention relates to 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane form high-temperature epoxy adhesive and a preparation method thereof. The adhesive consists of a component A and a component B in a mass ratio of 1:1-2, wherein the component A is a co-polymer formed by the reaction between 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane and epoxy resin; and the component B is a homogeneous transparent solution which has the solid content being 15-30 percent and formed by the reaction between 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane and binary acid anhydride in strong polar aprotic organic solvent and toluene. The preparation method comprises the following steps of stirring and uniformly mixing the component A and the component B at room temperature in a mass ratio of 1:1-2. The preparation process is simple, and the adhesive is excellent in comprehensive performance, so that the adhesive can be widely applied to adhesion among steel, copper, aluminum and other metals, as well as ceramic, glass, resin-based composite materials and other base materials, and has an excellent industrial prospect.

The invention relates to a 1,3-bis(2,4-diamidophenoxy)benzene high-temperature-resistant epoxy adhesive and a preparation method thereof. The 1,3-bis(2,4-diamidophenoxy)benzene high-temperature-resistant epoxy adhesive is composed of a component A and a component B in a mass ratio of 1:(1-2), wherein the component A is a copolymer prepared by reacting 1,3-bis(2,4-diamido phenoxy)benzene and epoxy resin; and the component B is a homogeneous-phase transparent solution with the solid content of 15-30%, which is prepared by reacting 1,3-bis(2,4-diamidophenoxy)benzene and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

The invention relates to an active phthalimide epoxy solvent-free dripping impregnating varnish and a preparation method thereof. The varnish has the following components: 10wt%-15wt% of active phthalimide, 35wt%-45wt% of epoxy resin, 5wt%-10wt% of active toughening agent, 5wt%-10wt% of curing agent, 20wt%-45wt% of active diluent. The preparation method comprises the preparation of the active phthalimide and the solvent-free dripping impregnating varnish. The preparation features simple process and low cost and contributes to the realization of industrialized production; in addition, the solvent-free dripping impregnating varnish enjoys excellent comprehensive property, fine manufacturability and cohesiveness, excellent heat resistance and hydrophobicity, thus enjoying bright application prospect in fields such as motors of electric tools, small electric machine and the like.

The invention provides a preparation method of high permeability amino silicone oil, which comprises a step of preparing coupling agent hydrolyzate; a step of preparing amino silicone oil, dehydrating octamethylcyclotetrasiloxane; , add the catalyst to dissolve; then add the coupling agent hydrolyzate under reduced pressure to mix; then add the end-capping agent under reduced pressure to react and then heat up to deactivate the catalyst; then heat up to remove low molecular compounds; stand for cooling to obtain high permeability Amino silicone oil. The amino silicone oil prepared by the invention has high transmittance, controllable viscosity, is easily emulsified into a transparent microemulsion and has excellent stability, is suitable for applications such as fabric treatment, additives in personal care products and the like, and has good application effect .