53results about How to "Good viscosity controllability" patented technology

The invention relates to a preparation method of high temperature resistant single-component solventless epoxy adhesive. The method comprises the following steps: adding aromatic binary primary amine and strongly polar non-proton organic solvent in a reaction tank, stirring at room temperature to dissolve, adding aromatic binary acid anhydride to perform refluxing and water-segregating reaction at 120-150 DEG C for 6-12h, cooling, adding the reaction solution in a stamp tank with precipitant to precipitate solid powder, namely white thermoplastic polyimide powder, adding white thermoplastic polyimide powder and tertiary amine compound or imidazole compound in epoxy resin to react for 1-2h, adding active diluent and latent curing agent to stir evenly and obtaining the product. The production process is easy and the cost is low so as to realize industrialized production; the tensile shear intensions of the epoxy adhesive at room temperature and 120 DEG C are respectively up to 28Mpa and26Mpa and the epoxy adhesive has broad application prospect in fields such as electronics and microelectronics, electrical motors, aviation and aerospace and the like.

The invention relates to a 4,4'-bis[4-(2,4-diamidophenoxy)phenyl]biphenyl high-temperature-resistant epoxy adhesive and a preparation method thereof. The 4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive is composed of a component A and a component B, wherein the component A is a copolymer prepared by reacting 4,4'-bis(2,4-diamidophenoxy)biphenyl and epoxy resin; and the component B is a homogeneous transparent solution with the solid content of 15-30%, which is prepared by reacting 4,4'-bis(2,4-diamidophenoxy)biphenyl and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

The invention relates to a high-performance conducting resin, comprising the following components: epoxy, latent curing agent, active toughener and conducting particles. The preparation method comprises the following steps: adding the epoxy and the active toughener in a reaction bulb to react, then adding the latent curing agent, uniformly stirring, adding the surface-treated conducting particles, uniformly stirring, and defoaming in vacuum to obtain the high-performance conducting resin. The conducting resin in characterized in that the bonding strength reaches up to 24.1 MPa; the volume resistivity is 4.30*10<-5>-2.12*10<-4> ohm.cm; the Tonset thermal decomposition temperature reaches up to 398.7 DEG C; the water absorption is only 0.2%; and storage life at the room-temperature is as long as more than 3 months. The invention has the advantages of simple preparation process, low cost, convenient operation and convenient reaction material source, can complete the preparation process in universal devices, is beneficial to realizing industrial production, and has wide application prospects in the fields of electronic components, resonators, relays, electronic capacitors and the like.

The invention relates to a 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and a preparation method thereof. The 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive is composed of a component A and a component B, wherein the component A is a copolymer prepared by reacting 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane and epoxy resin; and the component B is a homogeneous transparent solution with the solid content of 15-30%, which is prepared by reacting 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

The invention relates to an alpha-cyanogroup-beta-ethyl ethoxyacrylate modified epoxy resin adhesive and a preparation method thereof. The adhesive comprises the following components: epoxy resin, epoxy ester resin, activity flexibilizer, alpha-cyanogroup-beta-ethyl ethoxyacrylate and a curing agent at a mass ratio of 100:(100-50): (60-30): (5-20): (30-80). The preparation method comprises the following steps that the epoxy resin and the activity flexibilizer are mixed, react at 60-80 DEG C for 15-20min, then are added with the epoxy ester resin and alpha-cyanogroup-beta-ethyl 3-ethoxyacrylate, and stirred and mixed uniformly, and a component A is obtained; the curing agent is a component B; and in a using process, the component A and the component B are mixed uniformly, and the adhesive is obtained. The adhesive is high in bonding strength, excellent in combination property, solvent-free and environment-friendly, can be used for bonding base materials such as metal, glass and ceramic, and has a good application prospect.

The invention relates to high-temperature resistant copper foil glue containing the following components: 5-15wt percent of trifluoromethyl-contained maleimide resin, 10-30wt percent of polyfunctional ethoxyline resin, 10-40wt percent of bisphenol A epoxy resin, 5-15wt percent of ethylene-contained polyetherimide, 5-10wt percent of curing agent and 25-45wt percent of organic solvent; the preparation comprises the following steps of: adding the trifluoromethyl-contained maleimide resin and the ethylene-contained polyetherimide to the mixture of the polyfunctional ethoxyline resin and the bisphenol A epoxy resin, stirring while heating for reacting, and then cooling to 30-50 DEG C; adding the organic solvent and the curing agent; evenly stirring to obtain the high-temperature resistant copper foil glue the homogeneous phase of which is transparent and clear. The high-temperature resistant copper foil glue has Tonset temperature reaching up to 415 DEG C and excellent comprehensive performance, can be applied to the high-tech fields of electronics and microelectronics, automobiles, electrical machines, aerospace and the like; moreover, the invention has simple preparation process, low cost, convenient operation and available reaction raw materials, thereby being beneficial to realizing industrial production.

The invention relates to a polyimide-epoxy resin adhesive and a preparation method and an application thereof; the adhesive comprises the following components: maleimidopolyimide, polyfunctional epoxy resin, curing agent, promoter and organic solvent; the preparation method comprises the following steps: adding maleimidopolyimide powder and polyfunctional epoxy resin in a reaction rank to react for 1-2h, cooling, adding organic solvent, stirring the solution for dissolving, obtaining component A; mixing curing agent, promoter and organic solvent, stirring the solution for dissolving, obtaining component B; mixing the component A and component B, stirring evenly and obtaining the finished product. The adhesive has good adhesive property, the tensile shear strength is up to 30MPa; the preparation process is simple, the cost is low, the operation is simple, the reaction raw materials are accessible so that the method is applicable to industrialized production; and the adhesive can be used in high-tech fields such as electronics and microelectronics, flexible clad-copper laminates, flexible printed wiring boards, hard clad-copper laminates, automobiles, motors, aviation and aerospace and the like, and has broad application prospect.

The invention relates to a heat-resistant solvent-free immersion paint which comprises the following components in percentage by weight: 10%-15% of organosilicon polyfunctional epoxy resin, 15%-35% of silicon-free polyfunctional epoxy resin, 5%-10% of curing agent and 45%-65% of reactive diluent. The preparation method thereof comprises the following steps: adding the organosilicon polyfunctional epoxy resin, the reactive diluent and the silicon-free polyfunctional epoxy resin into a kettle, reacting for 0.5h at the temperature of 100 DEG C, cooling, adding the curing agent, and evenly stirring at room temperature, thus obtaining sticky liquid, i.e. the heat-resistant solvent-free immersion paint. The preparation process is simple, the cost is low, and the industrialized production can be easily realized; the room-temperature longitudinal shear strength of the heat-resistant solvent-free immersion paint is high; and the heat-resistant solvent-free immersion paint has excellent heat resistance, strong hydrophobic property and wide application prospects in the fields of high-power traction electric machines, high-power generators, drilling motors, mining motors and the like.

The invention relates to DAHTM type silicon-containing epoxy imide matrix resin and a preparing method thereof. The matrix resin is prepared from 4,4'-diamido-4''-hydroxy triphenylmethane (DAHTM), epoxy resin, 3-aminopropyl trialkoxysilane, an imide oligomer and a curing agent. The preparing method includes the following steps that 1, the imide oligomer is prepared; 2, DAHTM and epoxy resin are put into a reaction kettle, stirred and mixed for reaction, then the imide oligomer is added, the mixture continues to be stirred for reaction, then 3-aminopropyl trialkoxysilane is added and stirred for reaction, the curing agent is added and stirred to be mixed uniformly to obtain the matrix resin. The matrix resin can be widely applied to adhesion between metal such as steel, copper and aluminum and a base material such as ceramic, glass and a resin-based composite material and used for preparing glass fiber, aramid fiber and carbon fiber reinforced composite and has good industrial prospects.

The invention relates to an active phthalimide epoxy solvent-free dripping impregnating varnish and a preparation method thereof. The varnish has the following components: 10wt%-15wt% of active phthalimide, 35wt%-45wt% of epoxy resin, 5wt%-10wt% of active toughening agent, 5wt%-10wt% of curing agent, 20wt%-45wt% of active diluent. The preparation method comprises the preparation of the active phthalimide and the solvent-free dripping impregnating varnish. The preparation features simple process and low cost and contributes to the realization of industrialized production; in addition, the solvent-free dripping impregnating varnish enjoys excellent comprehensive property, fine manufacturability and cohesiveness, excellent heat resistance and hydrophobicity, thus enjoying bright application prospect in fields such as motors of electric tools, small electric machine and the like.