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A kind of dadhbp type silicon-containing epoxy imide matrix resin and preparation method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of DADHBP type silicon-containing epoxy imide matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, and achieve good industrialization prospects, Simple preparation process and excellent comprehensive performance

Inactive Publication Date: 2018-09-25
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistance is not ideal enough

Method used

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  • A kind of dadhbp type silicon-containing epoxy imide matrix resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 735.0 grams of o-cresol, 52.0 grams (0.1 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 3.8 grams of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitate containing 1500 grams of methanol Stir in the kettle at high speed to precipitate solid matter, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g), with a yield of 98.2%, which is designated as BBMO-1.

Embodiment 2

[0045] 73.2 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 1460 g of o-cresol, 52.0 g (0.1 mol) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, cool to 60°C, pour the reactant into 2000 grams of ethanol and 920 grams of In the settling tank of ethylene glycol monomethyl ether, high-speed stirring, the solid matter was precipitated, filtered, and vacuum-dried at 80°C for 10 hours to obtain 313.4 grams of imide oligomers (theoretical yield: 314.0 grams), with a yield of 99.8%. Denoted as BBMO-2.

Embodiment 3

[0047]1.0 g of 3,3'-diamino-4,4'-dihydroxybiphenyl (DADHBP), 20.0 g of diglycidyl isophthalate epoxy resin, 30.0 g of 4,5-epoxycyclohexane- Diglycidyl 1,2-dicarboxylate epoxy resin, 25.0 g CE793 epoxy resin, and 25.0 g N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-amino Phenoxy) phenyl] propane epoxy resin was put into the reaction kettle, after stirring and mixing reaction at 100 ℃ for 0.5 hour, add 2.0 grams of BBMO-1 imide oligomers and continue to stir and react for 1 hour, then add 3.0 grams of 3 - Aminopropyltrimethoxysilane stirred for 5 minutes, cooled to room temperature, then added 30.0 grams of 1,8-diaza-bicyclo[5.4.0]undecene-7 and 20.0 grams of tung oilic anhydride, stirred and mixed evenly, 156.0 g of DADHBP type silicon-containing epoxyimide matrix resin was obtained, denoted as M-1.

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Abstract

The invention relates DADHBP (dihydroxybiphenyl) type silicon-containing imide epoxy matrix resin and a preparation method thereof. The matrix resin is composed of 3,3'-diamido-4,4'-dihydroxybiphenyl (DADHBP), epoxy resin, 3-aminopropyl trialkoxysilane, imide oligomer and a curing agent. The preparation method includes the steps of 1), preparing the imide oligomer; 2), putting the 3,3'-diamido-4,4'-dihydroxybiphenyl (DADHBP) and the epoxy resin into a reaction kettle, after mixing reaction, adding the imide oligomer for continuous mixing reaction, then adding the 3-aminopropyl trialkoxysilane for mixing action, and then adding the curing agent for even mixing to obtain the matrix resin. The DADHBP (dihydroxybiphenyl) type silicon-containing imide epoxy matrix resin and the preparation method thereof can be widely used in adhesion between metals of steel, copper, aluminum and the like and base materials of ceramics, glass, resin matrix composites and the like as well as preparation of glass fiber, aramid fiber and carbon fiber reinforced composites, and good industrialization prospect is achieved.

Description

technical field [0001] The invention belongs to the field of polymer matrix resin and its preparation, in particular to a DADHBP silicon-containing epoxyimide matrix resin and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: ring The cur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/12
CPCC08G73/125
Inventor 虞鑫海吴倩周志伟
Owner DONGHUA UNIV
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