2,2-di[4-(2,4-diamino phenoxy) phenyl] propane form high-temperature epoxy adhesive and preparation method thereof

A technology of diaminophenoxy and epoxy adhesives, applied in the direction of online phenolic epoxy resin adhesives, adhesives, epoxy resin adhesives, etc., can solve the problem of high price, unfavorable large-scale popularization and application, polyetherimide Resin cost is high, to achieve the effect of convenient operation, good application prospect and strong hydrophobicity

Inactive Publication Date: 2014-07-02
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane form high-temperature epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Preparation of component A

[0046] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 22 g (0.05 mol) of 2,2-bis Put [4-(2,4-diaminophenoxy)phenyl]propane into a reaction kettle, heat up to 50°C, and stir for 2 hours to obtain 122 g of a homogeneous and transparent copolymer, which is designated as A1.

[0047] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 17.6 g (0.04 mol) of 2,2-bis Put [4-(2,4-diaminophenoxy)phenyl]propane into a reaction kettle, heat up to 60° C., and stir for 1 hour to obtain 117.6 g of a homogeneous and transparent copolymer, designated as A2.

[0048] Diglycidyl 100 g of 4,5-epoxycyclohexane-1,2-dicarboxylate epoxy resin (epoxy value 0.85) was mixed with 20.7 g (0.047 mol) of 2,2-bis[4-(2 , 4-diaminophenoxy)phenyl]propane was put into a reaction kettle, heated to 70°C, and stirred for 1 hour to obtain 120.7 g of a homogeneous and transparent ...

Embodiment 2

[0052] Preparation of Component B

[0053] At room temperature, 44 grams (0.1 moles) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane and 728 grams of N,N-dimethylacetamide were added to the reactor, After stirring and dissolving completely, add 52 grams (0.1 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 64.4 grams (0.2 moles) of 3,3',4 ,4'-Tetracarboxybenzophenone dianhydride and 21.8 grams (0.1 moles) of pyromellitic dianhydride were stirred and reacted for 0.5 hours to obtain 902.2 grams of a homogeneous transparent solution. Add 150 grams of toluene and heat to reflux for Reflux water separation reaction, the temperature is 100°C, and the reaction time is 5 hours. After the reaction is completed, part of the organic solvent is separated so that the solid content is within the range of 15%-30%, which is recorded as B1.

[0054] At room temperature, mix 44 g (0.1 mol) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane with 350 g of N,N-dimethylacetamide ...

Embodiment 3

[0057] Preparation of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane type high temperature resistant epoxy adhesive

[0058] At room temperature, stir and mix components A and B according to the mass ratio of 1:1-2 to obtain a series of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane Type high temperature resistant epoxy adhesive, denoted as HTEA-p, p is a natural number, the specific formula is shown in Table 1.

[0059] Table 12, 2-bis[4-(2,4-diaminophenoxy)phenyl]propane type high temperature resistant epoxy adhesive formula unit: g

[0060] Component

[0061] HTEA-4

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Abstract

The invention relates to 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane form high-temperature epoxy adhesive and a preparation method thereof. The adhesive consists of a component A and a component B in a mass ratio of 1:1-2, wherein the component A is a co-polymer formed by the reaction between 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane and epoxy resin; and the component B is a homogeneous transparent solution which has the solid content being 15-30 percent and formed by the reaction between 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane and binary acid anhydride in strong polar aprotic organic solvent and toluene. The preparation method comprises the following steps of stirring and uniformly mixing the component A and the component B at room temperature in a mass ratio of 1:1-2. The preparation process is simple, and the adhesive is excellent in comprehensive performance, so that the adhesive can be widely applied to adhesion among steel, copper, aluminum and other metals, as well as ceramic, glass, resin-based composite materials and other base materials, and has an excellent industrial prospect.

Description

technical field [0001] The invention belongs to the field of epoxy resin adhesives and preparation thereof, in particular to a 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane type high temperature resistant epoxy adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C08G59/50C08G59/20C08G69/32
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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