2,2-di[4-(2,4-diamino phenoxy) phenyl] propane form high-temperature epoxy adhesive and preparation method thereof
A technology of diaminophenoxy and epoxy adhesives, applied in the direction of online phenolic epoxy resin adhesives, adhesives, epoxy resin adhesives, etc., can solve the problem of high price, unfavorable large-scale popularization and application, polyetherimide Resin cost is high, to achieve the effect of convenient operation, good application prospect and strong hydrophobicity
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Embodiment 1
[0045] Preparation of component A
[0046] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 22 g (0.05 mol) of 2,2-bis Put [4-(2,4-diaminophenoxy)phenyl]propane into a reaction kettle, heat up to 50°C, and stir for 2 hours to obtain 122 g of a homogeneous and transparent copolymer, which is designated as A1.
[0047] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 17.6 g (0.04 mol) of 2,2-bis Put [4-(2,4-diaminophenoxy)phenyl]propane into a reaction kettle, heat up to 60° C., and stir for 1 hour to obtain 117.6 g of a homogeneous and transparent copolymer, designated as A2.
[0048] Diglycidyl 100 g of 4,5-epoxycyclohexane-1,2-dicarboxylate epoxy resin (epoxy value 0.85) was mixed with 20.7 g (0.047 mol) of 2,2-bis[4-(2 , 4-diaminophenoxy)phenyl]propane was put into a reaction kettle, heated to 70°C, and stirred for 1 hour to obtain 120.7 g of a homogeneous and transparent ...
Embodiment 2
[0052] Preparation of Component B
[0053] At room temperature, 44 grams (0.1 moles) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane and 728 grams of N,N-dimethylacetamide were added to the reactor, After stirring and dissolving completely, add 52 grams (0.1 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 64.4 grams (0.2 moles) of 3,3',4 ,4'-Tetracarboxybenzophenone dianhydride and 21.8 grams (0.1 moles) of pyromellitic dianhydride were stirred and reacted for 0.5 hours to obtain 902.2 grams of a homogeneous transparent solution. Add 150 grams of toluene and heat to reflux for Reflux water separation reaction, the temperature is 100°C, and the reaction time is 5 hours. After the reaction is completed, part of the organic solvent is separated so that the solid content is within the range of 15%-30%, which is recorded as B1.
[0054] At room temperature, mix 44 g (0.1 mol) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane with 350 g of N,N-dimethylacetamide ...
Embodiment 3
[0057] Preparation of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane type high temperature resistant epoxy adhesive
[0058] At room temperature, stir and mix components A and B according to the mass ratio of 1:1-2 to obtain a series of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane Type high temperature resistant epoxy adhesive, denoted as HTEA-p, p is a natural number, the specific formula is shown in Table 1.
[0059] Table 12, 2-bis[4-(2,4-diaminophenoxy)phenyl]propane type high temperature resistant epoxy adhesive formula unit: g
[0060] Component
[0061] HTEA-4
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