1,3-bis(2,4-diaminophenoxy)benzene type high temperature resistant epoxy adhesive and preparation method thereof

A technology of diaminophenoxy and epoxy adhesives, applied in the direction of online phenolic epoxy resin adhesives, adhesives, epoxy resin adhesives, etc., can solve the problem of high price, unfavorable large-scale promotion and application, polyetherimide High resin cost and other issues, to achieve the effect of convenient operation, good application prospects, and strong hydrophobicity

Inactive Publication Date: 2014-10-15
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0025] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • 1,3-bis(2,4-diaminophenoxy)benzene type high temperature resistant epoxy adhesive and preparation method thereof
  • 1,3-bis(2,4-diaminophenoxy)benzene type high temperature resistant epoxy adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Preparation of component A

[0046] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 16.1 g (0.05 mol) of 1,3-bis Put (2,4-diaminophenoxy)benzene into a reaction kettle, heat up to 50°C, and stir for 2 hours to obtain 116.1 g of a homogeneous and transparent copolymer, which is designated as A1.

[0047] Mix 100 g of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8) with 12.9 g (0.04 mol) of 1,3-bis Put (2,4-diaminophenoxy)benzene into a reaction kettle, heat up to 70°C, and stir for 1 hour to obtain 112.9 g of a homogeneous and transparent copolymer, which is designated as A2.

[0048] Mix 100 grams of 4,5-epoxycyclohexane-1,2-dicarboxylate diglycidyl epoxy resin (epoxy value 0.85) with 15.1 grams (0.047 moles) of 1,3-bis(2,4- Diaminophenoxy)benzene was put into a reaction kettle, heated to 60° C., stirred and reacted for 1 hour to obtain 115.1 grams of a homogeneous and transparent co...

Embodiment 2

[0052] Preparation of Component B

[0053] At room temperature, add 32.2 grams (0.1 moles) of 1,3-bis(2,4-diaminophenoxy)benzene and 600 grams of N,N-dimethylacetamide into the reaction kettle, stir and dissolve completely, then add 208 grams (0.4 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, stirred and reacted for 1 hour to obtain 840.2 grams of homogeneous transparent solution, added 300 grams of toluene, Heat up to reflux, carry out reflux water separation reaction, the temperature range is 130°C, and the reaction time is 2 hours. After the reaction is completed, part of the organic solvent is separated so that the solid content is within the range of 15%-30%, which is recorded as B1 .

[0054] At room temperature, 32.2 grams (0.1 moles) of 1,3-bis(2,4-diaminophenoxy)benzene and 215 grams of N,N-dimethylacetamide and 400 grams of N-methyl-2-pyrrolidone Add to the reaction kettle, stir and dissolve completely, add 104 grams (0.2 moles) of 2,2-bis[4...

Embodiment 3

[0057] Preparation of 1,3-bis(2,4-diaminophenoxy)benzene type high temperature resistant epoxy adhesive

[0058] At room temperature, stir and mix components A and B according to the mass ratio of 1:1-2 to obtain a series of 1,3-bis(2,4-diaminophenoxy)benzene-type high temperature resistant epoxy adhesives , recorded as HTEA-p, p is a natural number, and the specific formula is shown in Table 1.

[0059] Table 1 Unit: Gram

[0060] Component

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Abstract

The invention relates to a 1,3-bis(2,4-diamidophenoxy)benzene high-temperature-resistant epoxy adhesive and a preparation method thereof. The 1,3-bis(2,4-diamidophenoxy)benzene high-temperature-resistant epoxy adhesive is composed of a component A and a component B in a mass ratio of 1:(1-2), wherein the component A is a copolymer prepared by reacting 1,3-bis(2,4-diamido phenoxy)benzene and epoxy resin; and the component B is a homogeneous-phase transparent solution with the solid content of 15-30%, which is prepared by reacting 1,3-bis(2,4-diamidophenoxy)benzene and aromatic dibasic acid anhydride in a strong-polarity non-proton organic solvent and toluene. The preparation method comprises the following step: evenly mixing the component A and the component B in a mass ratio of 1:(1-2) at room temperature. The preparation technique is simple; and the adhesive has excellent comprehensive properties, can be widely used for bonding steel, copper, aluminum or any other metal with ceramic, glass, resin-base composite material or any other substrate, and has favorable industrialization prospects.

Description

technical field [0001] The invention belongs to the field of epoxy resin adhesives and preparation thereof, in particular to a 1,3-bis(2,4-diaminophenoxy)benzene type high temperature resistant epoxy adhesive and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) Good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) Good...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J163/04C09J11/08C08G73/10
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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