The invention discloses a nano-
copper-containing
epoxide resin composite material and a preparation method thereof. The preparation method comprises the following steps: sequentially adding a
copper precursor, a protective agent, polyalcohol and
epoxide resin to a reaction flask, increasing temperature to
reaction temperature, and carrying out an in-situ thermal reduction reaction to obtain nano-
copper /
epoxide composite
slurry; and dispersing the nano-copper / epoxide composite
slurry into a
solvent, adding a solidifying agent, and then solidifying at solidifying temperature to obtain the nano-copper / epoxide
resin composite material. Nano-copper granules obtained by utilizing the method are uniformly dispersed in an
epoxy matrix, the sizes of the nano-copper granules can be controlled between 50 nanometers and 250 nanometers, the
mass fraction of the nano-copper granules can be controlled between 5% and 80%; the prepared
slurry is free of impurities in such a way that appropriate precursor,
reducing agent and protective agent are selected, and meanwhile, the slurry has good
dispersion stability and
oxidation stability in the
organic solvent. The preparation method disclosed by the invention is simple in process and low in production cost, can be applied to the field of
electronic packaging as an embedded type
capacitor dielectric material and is suitable for large-scale industrialized production.