Micron-nano modified epoxy matrix temperature resisting, heat conducting and insulating composite and preparation method thereof

A nano thermal conductive filler and nano modification technology, applied in epoxy resin glue, adhesive type, adhesive additive and other directions, can solve the problems of limiting the application and rise of epoxy resin, and improve the temperature resistance and thermal conductivity. , The effect of ensuring insulation reliability and expanding the scope of application

Inactive Publication Date: 2016-08-17
XIAN SITAN ENVIRONMENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Epoxy resin has excellent electrical and mechanical properties, strong cohesiveness, and is easy to process and produce, making it more and more widely used in electrical insulation. However, epoxy resin itself is relatively brittle. Under the premise, its thermal conductivity is about 0.2W / (m.k), and its glass transition temperature is about 100°C. In the process of high-voltage and high-current power transmission, the current-carrying conductor will generate a lot of heat. If the heat cannot be diffused in time, it will The temperature of the conductor rises sharply, and the local temperature can reach more than 200°C, which limits the application of epoxy resin in these fields

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The insulating material described in this embodiment includes the following components: 100g E-51 resin, 20gAG-80, 30g aluminum oxide with a particle size of 20 microns, 6g aluminum oxide with a particle size of 30nm, 80g methyltetrahydrophthalic anhydride, 8gDDS , 6g dibutyl phthalate, 3gKH-560.

[0025] The preparation method of the insulating material described in this embodiment is as follows:

[0026] (1) Weigh 30g of aluminum oxide with a particle size of 20 microns and 6g of aluminum oxide with a particle size of 30nm, dehumidify at 120°C for 6 hours, and put them into a desiccator after treatment for use;

[0027] (2) Weigh 100g of E-51 resin, 20g of AG-80 epoxy resin, and 3g of KH-560 to prepare material A, and stir material A in an oil bath at 90°C for 15 minutes before use;

[0028] (3) Add the micron filler in (1) to material A in (2), stir at 2000r / min, 90°C for 10min, then add the nanofiller and stir at 2000r / min, 90°C for 3h;

[0029] (4) Weigh 80g of m...

Embodiment 2

[0035] The insulating material described in this embodiment includes the following components: 100g E-51 resin, 25gAG-80, 40g aluminum oxide with a particle size of 20 microns, 4g aluminum oxide with a particle size of 30nm, 80g methyltetrahydrophthalic anhydride, and 10gDDS , 6g dibutyl phthalate, 3gKH-560.

[0036] The preparation method of the insulating material described in this embodiment is as follows:

[0037] (1) Weigh 40g of aluminum oxide with a particle size of 20 microns and 4g of aluminum oxide with a particle size of 30nm, dehumidify at 120°C for 6 hours, and put them into a drying dish for later use;

[0038] (2) Weigh 100g of E-51 resin, 25g of AG-80 epoxy resin, and 3g of KH-560 to prepare material A, and stir material A in an oil bath at 90°C for 15 minutes before use;

[0039] (3) Add the micron filler in (1) to material A in (2), stir at 2000r / min, 90°C for 10min, then add the nanofiller and stir at 2000r / min, 90°C for 3h;

[0040] (4) Weigh 80g of methy...

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Abstract

The invention provides a micron-nano modified epoxy matrix temperature resisting, heat conducting and insulating composite. The composite is prepared from, by weight, 30% to 60% of epoxy resin, 5% to 30% of polyfunctional group resin, 20% to 50% of epoxy hardener, 2% to 5% of epoxy toughening agent, 0.25% to 0.75% of curing accelerator, 5% to 15% of micron heat conducting filler, 1% to 3% of nano heat conducting filler and 1% to 2.5% of silane type coupling agent. According to the micro-nano modified epoxy matrix temperature resisting, heat conducting and insulating composite and a preparation method thereof, the polyfunctional group resin and the heat conducting filler are adopted for modifying a foundational epoxy system, so that the temperature resisting performance and heat conducting performance of the composite are greatly improved.

Description

technical field [0001] The invention relates to a modified epoxy insulating material and a preparation method thereof, in particular to a micro-nano modified temperature-resistant and heat-conducting insulating material. Background technique [0002] With the rapid development of my country's economy, the demand for electricity in the whole society is increasing day by day, and the voltage level of transmission lines is also increasing, which puts forward higher requirements for insulation methods and insulation materials. [0003] Epoxy resin has excellent electrical and mechanical properties, strong cohesiveness, and is easy to process and produce, making it more and more widely used in electrical insulation. However, epoxy resin itself is relatively brittle. Under the premise, its thermal conductivity is about 0.2W / (m.k), and its glass transition temperature is about 100°C. In the process of high-voltage and high-current power transmission, the current-carrying conductor ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/02C08K3/22C08K5/12C08K5/5435C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08L63/00C08K2201/003C08K2201/011C08K2201/014C08L2201/08C08L2205/025C09J11/04C09J11/06C09J11/08C09J163/00C08K13/02C08K2003/2227C08K5/12C08K5/5435
Inventor 李昭勋王晶弟吕盼盼
Owner XIAN SITAN ENVIRONMENT TECH CO LTD
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