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401results about How to "Eliminate difficulties" patented technology

Film deposition apparatus and film deposition method

The present invention is a film deposition apparatus configured to deposit a film on a substrate that has been loaded into a vacuum container via a transfer opening and placed on a table in the vacuum container, by supplying a process gas to the substrate from a process-gas supply part opposed to the table under a vacuum atmosphere, while heating a table surface of the table, the film deposition apparatus comprising: an elevating mechanism configured to vertically move the table between a process position at which the substrate is subjected to a film deposition process, and a transfer position at which the substrate is transferred to and from an external transfer mechanism that has entered from the transfer opening; a surrounding part configured to surround the table with a gap therebetween, when the table is located at the process position, so that the surrounding part and the table divide an inside of the vacuum container into an upper space, which is located above the table, and a lower space, which is located below the table; a vacuum exhaust conduit in communication with the upper space, through which a process atmosphere in the upper space is discharged to create a vacuum in the upper space; a heating unit configured to heat a gas contact region ranging from the upper space to the vacuum exhaust conduit, to a temperature higher than a temperature allowing adhesion of reactant; and a heat insulation part disposed between the heating unit and a lower part of the vacuum container surrounding the lower space.
Owner:TOKYO ELECTRON LTD

Film deposition apparatus and film deposition method

The present invention is a film deposition apparatus configured to deposit a film on a substrate that has been loaded into a vacuum container via a transfer opening and placed on a table in the vacuum container, by supplying a process gas to the substrate from a process-gas supply part opposed to the table under a vacuum atmosphere, while heating a table surface of the table, the film deposition apparatus comprising: an elevating mechanism configured to vertically move the table between a process position at which the substrate is subjected to a film deposition process, and a transfer position at which the substrate is transferred to and from an external transfer mechanism that has entered from the transfer opening; a surrounding part configured to surround the table with a gap therebetween, when the table is located at the process position, so that the surrounding part and the table divide an inside of the vacuum container into an upper space, which is located above the table, and a lower space, which is located below the table; a vacuum exhaust conduit in communication with the upper space, through which a process atmosphere in the upper space is discharged to create a vacuum in the upper space; a heating unit configured to heat a gas contact region ranging from the upper space to the vacuum exhaust conduit, to a temperature higher than a temperature allowing adhesion of reactant; and a heat insulation part disposed between the heating unit and a lower part of the vacuum container surrounding the lower space.
Owner:TOKYO ELECTRON LTD

Ultra-low temperature steel in great heat input welding and manufacturing method of steel

The invention discloses ultra-low temperature steel in great heat input welding and a manufacturing method of the steel. The steel disclosed by the invention comprises the following components in percent by weight: 0.040-0.090% of C, less than or equal to 0.15% of Si, 1.10-1.50% of Mn, less than or equal to 0.013% of P, less than or equal to 0.0020% of S, 0.10-0.30% of Cu, 0.05-0.20% of Ni, 0.008-0.020% of Nb, less than or equal to 0.010% of Als, 0.008-0.013% of Ti, 0.0035-0.0065% of N, 0.001-0.004% of Ca, 0.0008-0.0020% of B and the balance of Fe and inevitable impurities. By adopting the simple combined design of alloy elements in the steel disclosed by the invention, the TMCP (Thermal Mechanical Control Processing) technology is optimized without the requirement of adding a great number of noble elements such as Ni and Cu, the excellent patent steel plate low-temperature tenacity is acquired and simultaneously the low-temperature tenacity of the HAZ (Heat Affected Zone) during large line energy welding is also excellent; and the uniform and excellent mechanical property, good welding property and marine atmosphere corrosion resistance are acquired, so that the steel disclosed by the invention is specially applicable to wind tower structures on the sea, low-temperature pressure vessels, ocean platforms and bridges.
Owner:BAOSHAN IRON & STEEL CO LTD
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