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Preparation method of modified compound filler filled breakdown-resisting epoxy composite

A composite material and breakdown-resistant technology, which is applied in the field of preparation of modified compound filler-filled breakdown-resistant epoxy composite materials, can solve the problems of decreasing breakdown strength, limiting the insulation performance of composite materials, increasing costs, etc., and achieving complete Filler network, shortened mean free path, good dispersion effect

Active Publication Date: 2013-12-25
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there are currently two problems that restrict the further development of breakdown-resistant composites
First of all, although ceramic fillers have high intrinsic breakdown resistance, due to their weak compatibility and affinity with the matrix, the addition of ceramic fillers to the system also introduces holes and defects, which limits the composite The improvement of the insulation performance of the material is more obvious, especially at high filler content, and the breakdown strength even shows a downward trend; secondly, in order to further improve the insulation performance of the material, it is often necessary to increase the filler content, which not only increases the cost, but more importantly, deteriorates Mechanical and Processing Properties

Method used

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  • Preparation method of modified compound filler filled breakdown-resisting epoxy composite
  • Preparation method of modified compound filler filled breakdown-resisting epoxy composite
  • Preparation method of modified compound filler filled breakdown-resisting epoxy composite

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Embodiment 1

[0033] This embodiment relates to a method for preparing a modified composite filler-filled, breakdown-resistant ternary conductive polymer composite material, which includes the following steps:

[0034] Step (1), Al 2 o 3 , BN surface grafted γ-aminopropyltriethoxysilane (γ-APS)

[0035] Weigh 2g Al 2 o 3 , fully dispersed in 100mL xylene, then added 1wt% γ-APS and stirred and refluxed for 1h; after the reaction was completed, it was centrifuged at high speed, and the product was washed with xylene for 3 times and vacuum-dried at 50°C for 1d to obtain Al 2 o 3 -APS; BN undergoes two-step pretreatment before grafting silane coupling agent: first, weigh 2g of BN, stir and disperse in 100mL30wt% hydrochloric acid solution, react at 50°C for 1h, filter and wash 3 times with deionized water; Next, add pre-acidified BN to 50mL of 30wt% hydrogen peroxide, react at 50°C for 1h, continue to heat up to 75°C for 1h, and centrifuge the product and dry it in vacuum at 50°C for 1d; ...

Embodiment 2

[0041] This embodiment relates to a method for preparing a modified composite filler-filled, breakdown-resistant ternary conductive polymer composite material, which includes the following steps:

[0042] Step (1), Al 2 o 3 , BN surface grafted γ-aminopropyltriethoxysilane (γ-APS)

[0043] Weigh 5g Al 2 o 3 , fully dispersed in 200mL xylene, then added 2wt% γ-APS and stirred and refluxed for 2h; after the reaction was completed, it was centrifuged at high speed, and the product was washed with xylene for 3 times and vacuum-dried at 50°C for 1d to obtain Al 2 o 3 -APS; BN undergoes two-step pretreatment before grafting silane coupling agent: first, weigh 5g of BN, stir and disperse in 200mL30wt% hydrochloric acid solution, react at 50°C for 1h, filter and wash with deionized water for 3 times; Next, add pre-acidified BN to 100mL of 30wt% hydrogen peroxide, react at 50°C for 1h, continue to heat up to 75°C for 1h, and centrifuge the product and dry it in vacuum at 50°C for ...

Embodiment 3

[0049] This embodiment relates to a method for preparing a modified composite filler-filled, breakdown-resistant ternary conductive polymer composite material, which includes the following steps:

[0050] Step (1), Al 2 o 3 , BN surface grafted γ-aminopropyltriethoxysilane (γ-APS)

[0051] Weigh 2g Al 2 o 3 , fully dispersed in 100mL xylene, then added 1wt% γ-APS and stirred and refluxed for 1h; after the reaction was completed, it was centrifuged at high speed, and the product was washed with xylene for 3 times and vacuum-dried at 50°C for 1d to obtain Al 2 o 3 -APS; BN undergoes two-step pretreatment before grafting silane coupling agent: first, weigh 2g of BN, stir and disperse in 100mL30wt% hydrochloric acid solution, react at 50°C for 1h, filter and wash 3 times with deionized water; Next, add pre-acidified BN to 50mL of 30wt% hydrogen peroxide, react at 50°C for 1h, continue to heat up to 75°C for 1h, and centrifuge the product and dry it in vacuum at 50°C for 1d; ...

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Abstract

The invention relates to a preparation method of a modified compound filler filled breakdown-resisting epoxy composite. The preparation method comprises the following steps: through the modification of a silane coupling agent gamma-APS, amino groups are introduced on the surfaces of Al2O3 and h-BN; hyperwheworries branched polymers (HBP) are grafted on the surfaces of the primarily modified fillers through taking the grafted amino groups as active sites to obtain a modified filler Al2O3-HBP and a modified filler BN-HBP; the two modified fillers are fully mixed with an epoxy resin matrix in different proportions; the epoxy composite is prepared through a two-step stepped heating and curing method. The alternating-current breakdown strength of the prepared epoxy composite shows the obvious cooperative behavior, the system breakdown strength can be regulated through changing the proportion of the fillers; when the BN-HBP accounts for 80 wt% of the compound filler, the performance of the BN-HBP is optimized, only 10 wt% of compound filler is added, and the alternating current strength of the epoxy composite can be improved by 15.7% as compared with that of the epoxy matrix.

Description

technical field [0001] The invention relates to a preparation method of an epoxy composite material, in particular to a preparation method of a modified composite filler filled breakdown-resistant epoxy composite material. Background technique [0002] Epoxy resin has excellent insulation, bonding and mechanical properties, and is low in cost. It has been widely used in many manufacturing and high-tech fields such as electrical appliances, adhesives, electronic packaging, and military equipment. Especially in terms of electrical equipment, with the continuous increase of rated voltage and installed capacity, higher and higher requirements are put forward for the breakdown resistance of epoxy resin. Insulating fillers (especially ceramics, such as BN, AlN, Si 3 N 4 , SiC, MgO, ZnO, Al 2 o 3 , SiO 2 etc.) and the polymer matrix through dispersion compounding, layering compounding, and forming a surface isolation film. The filled polymer composite material can effectively ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K9/04C08K3/22C08K3/38
Inventor 方立骏钱荣谢礼源杨科侯世杰朱铭江平开
Owner SHANGHAI JIAO TONG UNIV
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