The invention provides a thermosetting resin composition, a prepreg containing same, a laminated board and a
printed circuit board. The thermosetting resin composition comprises the following components in percentage by
mass: thermosetting resin, curing agent, 15 to 60 percent of
boron nitride and 0.01 to 1 percent of nano-
diamond. By adding a very small amount of nano-
diamond in the thermosetting resin, compounding nano-
diamond with
boron nitride and uniformly dispersing nano-diamond in resin solution, a nanometer effect of nano-diamond particles and a synergistic effect with
boron nitride will facilitate the formation of a
heat conducting passage, in addition, the nano-diamond particles can fill gaps between
boron nitride sheets to play a bridging role, the contact area of the
heat conducting passage is increased, the heat
conductivity of the board is remarkably improved, the problem that the heat
conductivity between the
boron nitride sheets is poor is remarkably improved, the heat
conductivity coefficient of the prepared
copper-clad board is enabled to be 2.22 to 3.52w / m.k, and the heat conductivity is good.