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Insulating copolyamide 6T composite material with high thermal conductivity and preparation method thereof

A technology of copolyamide and composite materials, which is applied in the field of materials, can solve the problems of limited application, low thermal conductivity of high temperature resistant polyamide, etc., and achieve the effect of low price, good insulation performance and high hardness

Active Publication Date: 2017-05-31
SINOPLAST NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of high-temperature resistant polyamide is small, which limits its application in some fields, such as connectors, motors, transformers, solenoids, wound coil systems, LED lighting heat dissipation and other applications

Method used

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  • Insulating copolyamide 6T composite material with high thermal conductivity and preparation method thereof
  • Insulating copolyamide 6T composite material with high thermal conductivity and preparation method thereof
  • Insulating copolyamide 6T composite material with high thermal conductivity and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0073] The copolyamide 6T resin used in the present embodiment is polyamide 6T / 610 resin (PA6T / 610), and its raw material composition and synthesis steps are as follows:

[0074] (1) Vacuum-dried monomer 1: 1mol hexamethylenediamine, 0.6mol terephthalic acid, 0.4mol sebacic acid are added to the stirred polymerization reactor, and 4% of the total weight of monomer 1 is added simultaneously. Esteramide, 1.5% benzoic acid, 0.2% N,N'-di(2,2,6,6-tetramethyl-4-piperidinyl)-1,3-phthalamide, add 100mL water as The medium for mass transfer and heat transfer; then evacuate for 5 minutes, pass nitrogen for 5 minutes, and circulate like this for 6 times, so that the reactant exists in the environment under nitrogen protection, and the system pressure in the stirred polymerization reactor is controlled to be 0.3MPa;

[0075](2) within 3 hours, heat the stirred polymerization reactor airtight to 275°C at a uniform speed, adjust the stirring speed of the stirred polymerization reactor to 40...

Embodiment 2

[0086] The copolyamide 6T resin used in the present embodiment is polyamide 6T / 612 resin (PA6T / 612), and its raw material composition and synthesis steps are as follows:

[0087] (1) Add monomer 1 after vacuum drying: 1mol hexamethylenediamine, 0.6mol terephthalic acid, 0.4mol dodecanedioic acid into the stirred polymerization reactor, and add 4% of the total weight of monomer 1 at the same time Polyesteramide, 1.5% benzoic acid, 0.2% N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,3-phthalamide, add 100mL Water is used as the medium for mass transfer and heat transfer; then vacuumize for 5 minutes, and pass nitrogen for 5 minutes, and circulate like this 6 times, so that the reactant exists in the environment under nitrogen protection, and the system pressure in the stirred polymerization reactor is controlled to be 0.3MPa;

[0088] (2) within 3 hours, heat the stirred polymerization reactor airtight to 275°C at a uniform speed, adjust the stirring speed of the stirred polymeri...

Embodiment 3

[0098] The copolyamide 6T resin used in the present embodiment is polyamide 6T / 66 resin (PA6T / 66), and its raw material composition and synthesis steps are as follows:

[0099] (1) Vacuum-dried monomer 1: 1mol hexamethylenediamine, 0.6mol terephthalic acid, 0.4mol adipic acid are added to the stirred polymerization reactor, and 4% of the total weight of monomer 1 is added simultaneously. Esteramide, 1.5% benzoic acid, 0.2% N,N'-di(2,2,6,6-tetramethyl-4-piperidinyl)-1,3-phthalamide, add 100mL water as The medium for mass transfer and heat transfer; then evacuate for 5 minutes, pass nitrogen for 5 minutes, and circulate like this for 6 times, so that the reactant exists in the environment under nitrogen protection, and the system pressure in the stirred polymerization reactor is controlled to be 0.3MPa;

[0100] (2) within 3 hours, heat the stirred polymerization reactor airtight to 275°C at a uniform speed, adjust the stirring speed of the stirred polymerization reactor to 40r / ...

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Abstract

The invention relates to a insulating copolyamide 6T composite material with high thermal conductivity and a preparation method thereof. The insulating copolyamide 6T composite material with high thermal conductivity is prepare from the following raw materials: copolyamide 6T, fatty polyamide resin, toluene diisocynate, 2, 2'-(1,3-phenylene)-bisoxazoline, a coupling agent, boron nitride, aluminum oxide, silicon carbide, N, N'-bis (2,2,6,6-tetramethyl-4-piperidyl)-1, 3-phthalic diamide and bis (2,6-ditert butyl-4-methyl phenyl) pentaerythritol phosphodiester. The insulating copolyamide 6T composite material with high thermal conductivity has the characteristics of high heat conductivity coefficient, high tensile strength, high flowability, low water absorption and good insulating property, and can be applied to industrial fields, such as electronic and electrical industry, LED and automobiles.

Description

technical field [0001] The invention relates to the field of materials, in particular to a high thermal conductivity insulating copolyamide 6T composite material and a preparation method thereof. Background technique [0002] With the rapid development of large-scale integration of circuit boards and micro-encapsulation technology, the volume of electronic components is shrinking, the assembly density is getting higher and higher, and the power is increasing, and the heat generation is also increasing. Therefore, heat dissipation has become an important issue in the electronics industry. Metals, ceramics, and carbon materials with excellent thermal conductivity are difficult to meet the needs of current technological development due to poor electrical insulation, processing and molding performance, and high cost. Polymer materials have the advantages of light weight, insulation, corrosion resistance, excellent processing performance, and large design freedom, but their ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08K13/06C08K9/06C08K5/29C08K5/353C08K3/38C08K3/22C08K3/34C08K5/3435C08K5/523C08K7/00C08K7/10C08K5/544
CPCC08L77/06C08L2203/20C08L2205/025C08K13/06C08K9/06C08K5/29C08K5/353C08K2003/385C08K2003/2227C08K3/34C08K5/3435C08K5/523C08K7/00C08K7/10C08K5/544
Inventor 朱怀才王忠强师文博
Owner SINOPLAST NEW MATERIAL
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