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Thermosetting resin composition, prepreg containing same, laminated board and printed circuit board

A technology of resin composition and printed circuit board, which is applied in the field of thermosetting resin composition, prepreg, laminate and printed circuit board, which can solve the problem of thermal conductivity of thermally conductive fillers, difficulty in forming thermal conduction paths, and difficult high Thermal conductivity and other issues to achieve the effect of improving poor thermal conductivity, good thermal conductivity, and improving the thermal conductivity of the plate

Inactive Publication Date: 2016-03-23
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The above-mentioned prior art generally discloses which thermally conductive fillers can be used, but there is no discussion on how specific thermally conductive fillers affect the final heat conduction effect
Moreover, as mentioned above, due to the sheet-like structure of boron nitride, it is distributed in sheets and layers in the sheet, and it is difficult to form a heat conduction path in the vertical direction of the sheet, and it is difficult to effectively exert its high thermal conductivity

Method used

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  • Thermosetting resin composition, prepreg containing same, laminated board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Brominated epoxy resin (55.34wt%), brominated novolak resin (26.63wt%), epoxy resin (2.77wt%), imidazole accelerator (0.11wt%, produced by Shikoku Kasei), nano Dissolve diamond (0.15wt%) and boron nitride (15wt%) in an organic solvent, mechanically stir and emulsify to prepare a 65wt% glue solution, then impregnate glass fiber cloth, and form a prepreg (prepreg) after heating and drying. Copper foil is placed on both sides, pressurized and heated to form a copper foil substrate.

Embodiment 2

[0040] Brominated epoxy resin (45.49wt%), brominated novolac resin (21.83wt%), epoxy resin (2.29wt%), imidazole accelerator (0.09wt%, produced by Japan Shikoku Kasei 2MI), nano Dissolve diamond (0.3wt%) and boron nitride (30wt%) in an organic solvent, mechanically stir and emulsify to prepare a 65wt% glue solution, then impregnate glass fiber cloth, and form a prepreg after heating and drying. Copper foil is placed on both sides, pressurized and heated to form a copper foil substrate.

Embodiment 3

[0042] Brominated epoxy resin (45.59wt%), brominated phenolic novolac resin (21.93wt%), epoxy resin (2.29wt%), imidazole accelerator (0.09wt%, produced by Japan Shikoku Kasei 2MI), nano Dissolve diamond (0.1wt%) and boron nitride (30wt%) in an organic solvent, mechanically stir and emulsify to prepare a 65wt% glue solution, then impregnate glass fiber cloth, and form a prepreg after heating and drying. Copper foil is placed on both sides, pressurized and heated to form a copper foil substrate.

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Abstract

The invention provides a thermosetting resin composition, a prepreg containing same, a laminated board and a printed circuit board. The thermosetting resin composition comprises the following components in percentage by mass: thermosetting resin, curing agent, 15 to 60 percent of boron nitride and 0.01 to 1 percent of nano-diamond. By adding a very small amount of nano-diamond in the thermosetting resin, compounding nano-diamond with boron nitride and uniformly dispersing nano-diamond in resin solution, a nanometer effect of nano-diamond particles and a synergistic effect with boron nitride will facilitate the formation of a heat conducting passage, in addition, the nano-diamond particles can fill gaps between boron nitride sheets to play a bridging role, the contact area of the heat conducting passage is increased, the heat conductivity of the board is remarkably improved, the problem that the heat conductivity between the boron nitride sheets is poor is remarkably improved, the heat conductivity coefficient of the prepared copper-clad board is enabled to be 2.22 to 3.52w / m.k, and the heat conductivity is good.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and relates to a thermosetting resin composition and prepregs, laminates and printed circuit boards containing it. Background technique [0002] With the development of high-density, multi-functional and "light, thin, and small" electronic products, the assembly density and integration of components on the circuit board are getting higher and higher, and the heat emitted by the circuit board per unit area during operation is getting higher and higher. many. If the heat dissipation of the substrate is not good, the temperature of the components on the circuit board will be too high, which will reduce the working stability and reliability of the components. Therefore, the requirements for the heat dissipation of the substrate are becoming more and more urgent, and the substrate is required to have high thermal conductivity and low thermal resistance. [0003] In order to improve the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08K5/3445C08K3/04C08K3/38C08J5/24C08J3/09B32B17/04B32B27/04B32B27/08B32B27/20B32B27/42B32B27/38B32B15/08B32B15/092B32B15/20
CPCB32B15/08B32B15/092B32B15/20B32B27/08B32B27/20B32B27/38B32B27/42B32B2250/24B32B2250/40B32B2260/021B32B2260/046B32B2262/101B32B2264/10B32B2264/108B32B2270/00B32B2307/302B32B2457/08C08J3/09C08J5/24C08J2363/00C08J2461/06C08K2201/011C08L63/00C08L2205/025C08L2205/03C08L61/06C08K5/3445C08K3/04C08K2003/385
Inventor 郝良鹏柴颂刚雷爱华
Owner GUANGDONG SHENGYI SCI TECH
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