2results about How to "Reduce coupling loss" patented technology

This invention provides an optoelectronic co-packaging structure and its packaging method. Utilizing the excellent optical transparency, thermal stability, and electrical insulation of a glass substrate, it combines through-hole electrical interconnects for electrical signal transmission and through-hole optical interconnects for optical signal transmission. Furthermore, it integrates optical components through dual-surface grooves, solving the problems of low optical interconnect efficiency, poor heat dissipation, and limited integration in traditional optoelectronic co-packaging. This significantly improves the optical interconnect efficiency, heat dissipation performance, and integration of the optoelectronic co-packaging structure. The invention also uses grooves to limit the electrical components, achieving precise alignment and transmission of optical signals and reducing optical coupling loss. Simultaneously, the overlapping of the orthographic projections of the two grooves causes partial vertical overlap of the two optical components, optimizing the optical path and thus greatly enhancing signal fidelity.

This invention belongs to the field of laser technology, specifically relating to a common-cathode multi-beam laser, comprising a cathode assembly, multiple anode assemblies, an optical resonant cavity assembly, and a power supply module. The power supply module is electrically connected to both the cathode and anode assemblies, providing operating voltage to them. Multiple anode assemblies are spaced apart above the cathode assembly. The optical resonant cavity assembly, positioned above the anode assemblies, includes multiple mirrors and an output mirror. Each mirror corresponds to one of the anode assemblies, forming multiple independent optical resonant cavities together with the output mirror. The common-cathode design allows multiple anode assemblies to share the same cathode, greatly simplifying the laser structure and significantly reducing the device size and production costs compared to traditional multi-beam lasers with multiple independent laser units.