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Manufacturing method for optical waveguide module

A technology of optical waveguide and manufacturing method, which is applied to the coupling of optical waveguide, optical waveguide light guide, light guide, etc., can solve the problems of insufficient precision, large optical L coupling loss, and easy deviation of cut surface accuracy, etc., to achieve improvement Production efficiency and the effect of reducing the coupling loss of light

Inactive Publication Date: 2009-10-21
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the above-mentioned Patent Documents 1 to 3, in order to form the optical path conversion mirrors (inclined surfaces) 85a, 95a, it is necessary to cut the both ends of the optical waveguide with a rotary cutter or the like, and the production efficiency is poor.
In addition, when the optical path conversion mirrors 85a, 95a are formed by cutting with a rotary cutter, etc., the accuracy of the cutting angle (angle of the inclined surface) and the flatness of the cutting surface (inclined surface) are likely to vary.
If the precision of the optical path conversion mirrors 85a and 95a is insufficient, the optical path cannot be properly converted, and the coupling loss of the light L becomes large.
Furthermore, in Patent Documents 2 and 3, when forming the convex lens portion 96a, positioning accuracy with the optical path conversion mirror 95a is required, and the formation of the convex lens portion 96a is difficult.

Method used

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  • Manufacturing method for optical waveguide module
  • Manufacturing method for optical waveguide module
  • Manufacturing method for optical waveguide module

Examples

Experimental program
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Effect test

Embodiment

[0053] Materials for forming the under cladding layer and the over cladding layer

[0054] Mix 35 parts by weight of bisphenoxyethanol fluorenyl glycidyl ether (component A) represented by the following general formula (1), and 40 parts by weight of alicyclic epoxy resin, that is, 3',4'-epoxy ring Hexylmethyl 3,4-epoxyethylene carboxylate (manufactured by Daicel Chemical Industry Co., Ltd., Celloxide 2021P) (component B), 25 parts by weight of alicyclic epoxy resin (Daicel Manufactured by Chemical Industry Co., Ltd., Celloxide 2081) (component C), 2 parts by weight of 4,4'-bis[bis(β-hydroxyethoxy)phenylsulfite]phenylsulfate-bis-hexafluoroantimonate A 50% propylene carbonate solution (component D) was prepared as a material for forming the under cladding layer and the over cladding layer.

[0055] Chemical 1

[0056]

[0057] (wherein, R1~R6 are hydrogen atoms, n=1)

[0058] core forming material

[0059] 70 parts by weight of the above component A, 30 parts by wei...

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Abstract

A manufacturing method for an optical waveguide module which is capable of forming a light reflecting portion with stabilized accuracy and which is good in production efficiency. The manufacturing method for an optical waveguide module in which an optical element is mounted on the back side of end portions of an optical waveguide is provided. For the production of the above-mentioned optical waveguide, end portions of an over cladding layer (6) corresponding to the end portions of the optical waveguide are formed so as to serve as reflective portions (6a) at the same time that the over cladding layer (6) is formed on the front side by a die-molding process using a molding die (10) so as to cover a core (5).

Description

technical field [0001] The invention relates to a manufacturing method of an optical waveguide assembly widely used in optical communication, optical information processing and other general optics. Background technique [0002] Such as Figure 7 As shown, the optical waveguide assembly includes, for example: a substrate 81; an optical waveguide composed of a lower cladding layer 84, a core 85, and an upper cladding layer 86 formed on the surface of the substrate 81; Element 31 and light receiving element 32. The electrodes 31 a and 31 b of the light-emitting element 31 and the light-receiving element 32 are connected to conductive wiring 83 , respectively. In addition, above the light-emitting element 31 and the light-receiving element 32, a through hole 88 as an optical path is formed on the above-mentioned substrate 81 so that the light (optical signal) L from the light-emitting element 31 can be propagated by means of an optical waveguide. to the light receiving elemen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/13
CPCG02B6/125G02B6/43G02B6/138
Inventor 清水裕介
Owner NITTO DENKO CORP
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