408 results about "Integrated optics" patented technology

The invention relates to an optical engine and a forming method thereof, the optical engine comprises an adapter plate, an electric chip, an optical chip and a packaging substrate, the adapter plate comprises a first surface, a second surface opposite to the first surface, and a first through hole penetrating through the first surface and the second surface, the first surface of the adapter plate and the front surface of the electric chip are mounted on the optical chip and are electrically connected with the optical chip, and the second surface of the adapter plate is mounted on the packaging substrate and is electrically connected with the packaging substrate. According to the 3D fan-out type packaging optical engine integrated with the TSV adapter plate, the problems that an existing 3D fan-out type packaging optical engine is large in module size and cannot support the extremely high number of channels can be solved at the same time, and the problems that an existing 3D integrated optical engine with the TSV is high in cost and chip incoming materials are fixed can be solved at the same time.

Silicon photonics technologies adds integrated optics functionality to CMOS integrated circuits thereby leveraging high volume manufacturing. Independent of geometry or technology these silicon photonic devices require packaging with single mode optical fibers to interface to the optical network and / or co-packaging with active semiconductor devices, discrete microoptoelectromechanical systems (MOEMS) s or monolithically integrated MOEMS. Stringent performance constraints and minimizing manufacturing costs / times are consistent demands on such photonic circuits. Accordingly, there is a demand for low-cost and low-loss optical coupling technologies for packaging that can easily be scaled for mass production that overcome limitations in the prior art. The inventors have established design methodologies, packaging schemes and component designs that leverage automated passive assembly techniques for speed / cost in combination with directly written optical interconnects that allow for offsetting the losses that would arise from the manufacturing tolerances of these passive assembly techniques.

The invention belongs to the technical field of integrated optics and inertial sensing, and particularly relates to a thin-film lithium niobate heterogeneous integrated chip configuration for a fiber-optic gyroscope. The thin-film lithium niobate hybrid photon integrated chip is utilized to realize on-chip heterogeneous integration of functional devices of the fiber-optic gyroscope. The discrete optical path device of the gyroscope is monolithic integrated and integrally packaged, the size and cost of the optical path are greatly reduced, optical fiber interconnection is reduced, the complexity of the assembly process is obviously reduced, and the long-term reliability of the performance of the gyroscope is effectively improved. By means of the CMOS technology with mature silicon photons, low-cost and large-scale batch production of the miniature fiber-optic gyroscope can be achieved, and the requirements for miniaturization and light weight of a future weapon system are met.

The invention provides a coastal wetland ecological corridor identification and optimization method and system, and relates to the technical field of ecological environment monitoring. The method comprises the following steps: integrating optical, radar, terrain, night light and road data on an earth engine cloud platform, and unifying time and space references to form an initial data set; extracting a normalized vegetation index and a vegetation coverage degree, and combining with a water body frequency to identify an ecological source land; generating a comprehensive resistance surface according to the land utilization and coverage type and the road distance; and performing minimum cost path and circuit connectivity analysis in a geographic information system to obtain potential galleries, key nodes and barrier regions, and outputting gallery grades and optimization suggestions in a grading manner according to a cost threshold, thereby realizing high-precision identification and optimization of the coastal wetland ecological network.

High-power, integrated optical amplifiers are described in which gain waveguides of the amplifiers are designed to improve power performance by reducing power saturation effects in the amplifier. The gain waveguides can change, in at least one aspect, along the length of the gain waveguide to reduce gain saturation. Multi-mode optical beams and / or multi-stage amplification can also be employed to reduce gain saturation.

A disclosed semiconductor photodetector includes a first semiconductor layer having a first refractive index and a first band gap; a second semiconductor layer formed on the first semiconductor layer, the second semiconductor layer having a second refractive index and a second band gap; a first electrode; and a second electrode. The second refractive index is greater than the first refractive index, and the second band gap is smaller than the first band gap. The first semiconductor layer includes a p-type first region, an n-type second region, and a non-conductive third region between the first region and the second region. The second semiconductor layer includes a p-type fourth region in ohmic contact with the first electrode, an n-type fifth region in ohmic contact with the second electrode, and a non-conductive sixth region between the fourth region and the fifth region.

The invention discloses a laser design system, a laser design method, electronic equipment and a medium, and belongs to the technical field of integrated optics. The laser design system comprises a first model, input parameters of which comprise set grating parameters of a grating structure of a first to-be-designed laser, and which is used for predicting and outputting a predicted output characteristic curve of the first to-be-designed laser based on the set grating parameters; the input parameters of the second model comprise a set output characteristic curve of a second laser to be designed, and the second model is used for predicting and outputting predicted grating parameters of a grating structure of the second laser to be designed based on the set output characteristic curve; the first model and the second model share the same training data set, the input training data of the first model corresponds to the output training data of the second model, and the output training data of the first model corresponds to the input training data of the second model; the training data set includes pairing data between grating parameters of a grating structure of the sample laser and an output characteristic curve of the sample laser.

The invention relates to the field of performance testing of high-precision fiber-optic gyroscopes, and discloses an automatic testing method and system for the extinction ratio of a high-precision fiber-optic gyroscope, and the method comprises the following steps: constructing a signal light path and a reference light path, and combining the output light of the signal light path and the reference light path into a combined light signal in an orthogonal polarization state; integrally measuring the extinction ratio of the combined optical signal by using an extinction ratio tester to obtain a measured value; the control unit compares the measured value with a target value of 0dB and generates a control instruction based on a difference value; the voltage controller automatically adjusts the voltage of the integrated optical modulator in the signal light path according to the instruction, and iterative optimization is carried out through closed-loop feedback until the actually measured extinction ratio reaches a target value; and finally recording and solidifying the optimal voltage value. According to the invention, single and accurate extinction ratio overall measurement is used for replacing two times of error-prone independent optical power measurement, full-automatic closed-loop control is realized, the precision, efficiency and consistency of optical power balance are remarkably improved, and the skill requirements on operators are reduced.

Aspects of the present disclosure provide a semiconductor structure. For example, the semiconductor structure can include a wafer and luminescent thermometers formed on a surface of the wafer. The luminescent thermometers can be configured to receive incident light and emit light. The emitted light can have an intensity that depends on a temperature of a portion of the surface of the wafer where the luminescent thermometers are formed.

The invention relates to the technical field of material physicochemical property testing and analysis, in particular to a biological tissue anatomy quality evaluation method based on multi-modal data fusion. Comprising the following steps: step 1, synchronously acquiring multi-modal data of spatial registration, and synchronously acquiring data under the same coordinate system through a spatial registration device integrated with an optical path; based on the coordinate mapping relation, resampling the mechanical distribution diagram and the topological model to a spatial grid of the hyperspectral data; step 2, performing pathology-oriented feature fusion; and step 3, generating an anatomical quality index, inputting the fusion feature vector into a pre-trained deep residual network, outputting a quality evaluation index QI, generating an anatomical quality thermodynamic diagram based on a resampling space grid coordinate, and marking a QI value of each region. By realizing accurate and synchronous acquisition of multi-modal data, pathological-oriented feature extraction and fusion and quality evaluation of a deep learning network, the method can more accurately and comprehensively evaluate the anatomical quality of the biological tissue.

The invention relates to the technical field of photoacoustic spectrometry, in particular to a gas detection device and method based on a 3D printing Helmholtz photoacoustic cell, and is suitable for the fields with load requirements such as unmanned aerial vehicle-mounted gas monitoring platforms. In order to overcome the problems of large volume, heavy weight, complex structure and low integration level of a photoacoustic gas sensor in the prior art, the lightweight Helmholtz photoacoustic cell structure manufactured based on 3D printing comprises a sound wave generation cavity, a small-diameter connecting pipe and a detection cavity which are integrally formed, an optical reflection unit is integrated in the sound wave generation cavity, and the optical reflection unit is integrated in the detection cavity. Two concave reflectors are arranged to reflect incident light beams for 160 times, a laser, an optical fiber collimator, a pre-amplifier, a lock-in amplification circuit board, a notebook computer and a current temperature control module are arranged outside, and the concentration of gas to be detected is obtained through analysis and processing of the notebook computer.

The invention discloses an intelligent pressure plate remote monitoring system based on double-confirmation detection synchronization, which comprises a non-contact sensing mechanism, integrates state double confirmation of optical detection and magnetic induction detection, performs double judgment of a pressure plate state and critical position judgment through synchronous boundary dynamic verification, and comprises an intelligent pressure plate assembly, a remote monitoring system and a remote monitoring system, the optical detection assembly controls on-off of an optical path through switching of the transparent area and the shielding area of the light guide column so as to identify the rotation angle of the pressing plate. The guide rail type sensor array detects the induction stroke of the pressing plate through magnetic induction of the magnetic induction piece, and the magnetic induction boundary of the magnetic induction switch is dynamically synchronous with the light path switching boundary of the light guide column; a wireless collector; the pressing plate control device is further in wireless communication with the wireless collector, and the pressing plate control device carries out synchronous boundary logic processing on the double-confirmation signal and outputs a double-confirmation state; provided is a pressing plate management system. Through the arrangement, the problem of asynchronous signal induction of detection of different sources in a pressing plate double-confirmation detection scheme is solved.

The invention provides an on-chip optical element, a preparation method thereof and an integrated optical element. The on-chip optical element comprises a substrate, an input coupling waveguide located on the substrate, an output coupling waveguide located on the substrate and a modulation structure. The modulation structure comprises a phase change material layer located on the substrate, the phase change material layer is a continuous film layer and comprises a plurality of units, and the refractive indexes of at least two units are different; and the input coupling waveguide and the output coupling waveguide are respectively positioned at the side parts of the modulation structure, so that light rays emitted to the modulation structure through the input coupling waveguide are propagated along a direction parallel to the surface of the phase change material layer. The integrated optical element includes the on-chip optical element.

The invention discloses an integrated optical chip, a preparation method and an optical gyroscope, the integrated optical chip comprises a first device layer and a second device layer, the first device layer is provided with a phase modulator, the phase modulator comprises two fourth waveguides used for being connected with an interference ring, the second device layer is provided with a detection unit, and the detection unit comprises two fourth waveguides used for being connected with the interference ring. The detection unit comprises a first coupler and a detector, the first coupler comprises a first waveguide, a second waveguide and a third waveguide, the first waveguide is used for connecting a light source, the first waveguide is connected with the third waveguide, the second waveguide is connected with the third waveguide, and the third waveguide is connected with the phase modulator; the detector is connected with the second waveguide; wherein a light beam is transmitted to the phase modulator through the first waveguide and the third waveguide and is transmitted to the interference ring through the phase modulator, and a test light beam transmitted back by the interference ring is transmitted to the detector through the third waveguide and the second waveguide.

The invention belongs to the field of integrated photonics, and discloses a dynamic configuration device and method of an integrated optical processor chip. The configuration device comprises a signal acquisition module and a feedback configuration module, and the signal acquisition module detects an output signal of the integrated optical processor chip, processes the output signal into an electric signal and transmits the electric signal to the feedback configuration module; and the feedback configuration module processes and analyzes the electric signal based on a hybrid cooperation algorithm to generate a feedback control signal, and the feedback control signal is applied to a regulator of the integrated optical processor chip to influence the state of the regulator so as to realize dynamic configuration of the integrated optical processor chip. Compared with existing manual configuration, offline design and other methods, the method realizes real-time state mapping and dynamic configuration of the integrated optical processor chip, is a key technology for promoting practical application of the integrated optical processor chip, and is worthy of popularization and application.

The invention belongs to the technical field of integrated optics and inertial sensing, and particularly relates to a full-on-chip integrated photon chip gyroscope. The active devices integrated on the silicon-based heterogeneous integrated chip comprise an SLD light source, a thin film lithium niobate modulator and a detector; the passive device integrated on the silicon-based heterogeneous integrated chip comprises an isolator, a one-to-two coupler, a polarizer, a one-to-two coupler and an on-chip waveguide ring; the silicon-based heterogeneous integrated chip is also integrated with a spot size converter, a bending waveguide, a bending waveguide and a spot size converter.

The invention provides a method and a system for realizing a weak measurement enhanced chip-level microcavity gyroscope. The method comprises the following steps of: 1, providing a coherent state input by a system by using a single-frequency laser; 2, the output of the single-frequency laser is switched between a first path and a second path through an optical switch, the laser beam is transmitted to the first path in the first half part of the period, and the laser beam is transmitted to the second path in the second half part of the period; 3, the light transmitted along the first path and the second path respectively passes through an optical resonant cavity to sense the rotation angular speed, and a weak value amplification effect is achieved by setting front and back selection states; and step 4, weak measurement enhanced output results transmitted along the first path and the second path are respectively received by a photoelectric detector, and the value of the rotation angular velocity is demodulated according to the obtained output results. According to the invention, the optical microcavity is used as a sensing unit of the gyroscope, the sensing performance of the integrated optical gyroscope is greatly enhanced through a weak measurement technology, and the whole set of system can realize chip-level integration.

A calibration system and related methods for optical phased array chips. The calibration system includes an adjustable mount module, an infrared microscopic observation module, an arrayed driver module, a two-dimensional laser beam scanning module, a photoelectric conversion module and an upper computer, and utilizes computer-vision-enabled positioning and phase error compensation algorithms as software components. Collimated laser is emitted from the target beamforming angle and aimed at the emission aperture of the chip, and is subsequently sampled by the array elements in a reversed injection manner. Based on the reciprocity of light propagation, by maximizing the power reversely output from the bus waveguide of the optical phased array chip, beamforming at the target angle is achieved supported by software implementations of optimization algorithms. The system and related methods are readily achievable, highly automated, and offers fast and batch calibration with relatively low expenses, good flexibility and long-term compatibility.

The present disclosure relates to integration of integrated photonics-based optical gyroscopes and fiber-based optical gyroscopes into portable apparatuses that may include compass features. Novel small-footprint modularized fully integrated photonics optical gyroscopes are used for non-critical axes. However, for at least one critical axis, a fiber-optic gyroscope can be used to provide bias stability below 0.1° / Hr, which is directly correlated to predicting positional accuracy in the centimeter range. The positional accuracy results from the compassing ability of the gyroscope (referred to as gyrocompass) to calculate direction of heading using the earth's rotation.

A photonic integrated circuit including at least one integrated optical gain section having a peak gain at a first frequency; and at least one nonlinear sub-circuit which is coupled to the optical gain section either evanescently or through edge coupling, wherein the nonlinear sub-circuit further comprises at least one nonlinear component comprising at least one of a waveguide or a resonator comprising second-order nonlinearity enabling generation of frequency components at least one octave below or above the first frequency, and the nonlinear sub-circuit is configured to provide at least one of nonlinear interferometry wherein the interferometer output depends on the input intensity to the nonlinear sub-circuit, or spectral broadening by extending the spectrum outside the gain spectrum of the gain section.

The present invention discloses a reconfigurable integrated optical computing core model, comprising: M×N matrix calculation units; each matrix calculation unit includes two dual-waveguide microring resonators, a straight waveguide, and a phase change material heater, and the straight waveguide is made by covering a phase change material on a silicon waveguide; the phase change material heater is used to heat the phase change material to generate a phase change, thereby changing the light absorption of the straight waveguide; the integrated optical computing core model realizes the multiplication operation of an M×N matrix and an N×1 vector through integrated optical methods, where M and N are natural numbers. The present invention uses a phase change material in the computing core, changes the phase state of the phase change material by heating, changes the light absorption of the straight waveguide, and further changes the matrix elements in the computing core, realizing the reconfigurable characteristics of the computing core model. The present invention can be widely applied to the field of integrated optics.

The invention provides a heterogeneous integrated sub-wavelength structure end face coupler adaptive to a single-mode optical fiber and a preparation method of the heterogeneous integrated sub-wavelength structure end face coupler, and relates to the technical field of integrated optics. The coupler comprises a substrate, an insulating layer, a waveguide layer and a cladding from bottom to top. The waveguide layer comprises an upper lithium niobate ridge waveguide and a lower lithium niobate ridge waveguide, the lower waveguide is wider than the upper waveguide, and the upper waveguide is used for connecting an external waveguide; the heterogeneous integrated coupling region comprises a silicon nitride strip conical waveguide which forms directional coupling with the lower-layer lithium niobate waveguide, so that adiabatic transfer of a light field is realized; the sub-wavelength grating regulation and control region sequentially comprises a silicon nitride tapered waveguide and sub-wavelength grating combination section, a width gradually-changing grating section and an equal-width buffer grating section. The whole structure is symmetrical about the central axis. Through the multi-section adiabatic transformation and heterogeneous integration design, efficient expansion of a mode field is achieved, the coupling efficiency with a single-mode fiber is improved, and the advantages of being insensitive to polarization, good in process compatibility and suitable for high-density integration are achieved.

The invention discloses an integrated optical chip, a preparation method and an optical gyroscope, the integrated optical chip comprises a first device layer and a second device layer, the first device layer is provided with a phase modulator, the phase modulator comprises a fourth waveguide used for connecting an interference ring, and the second device layer is provided with a detection unit. The detection unit comprises a first coupler and a detector, the first coupler comprises a first waveguide, a second waveguide and a third waveguide, the first waveguide is used for connecting a light source, the first waveguide is connected with the third waveguide, the second waveguide is connected with the third waveguide, and the third waveguide is connected with the phase modulator; the detector is connected with the second waveguide; wherein the second device layer comprises a first sub-device layer and a second sub-device layer, the coupling loss of the first sub-device layer is larger than that of the second sub-device layer, at least part of the detector is located on the first sub-device layer, and the first coupler is located on the second sub-device layer.

An electro-optical modulation chip (100) capable of monolithically integrating an active optical device, and a preparation method. The electro-optical modulation chip (100) comprises, from top to bottom, a compound semiconductor active layer (103), a germanium thin film layer (104) and an electro-optical material waveguide layer (105), wherein the electro-optical material waveguide layer (105) forms corresponding waveguide structures (12) by means of photoetching and etching; the germanium thin film layer (104) forms a germanium absorption layer (104-2) and a germanium substrate growth layer (104-1) by means of photoetching and etching; and the germanium thin film layer (104) is prepared by the ion scissors technology. On the one hand, high-speed and high-responsivity O / C waveband optical detection can be achieved, and on the other hand, a growth substrate matching the lattice of a compound semiconductor is provided for the compound semiconductor, achieving simultaneous integration of an optical gain semiconductor device.

The invention relates to the technical field of semiconductor light emitting, and discloses an integrated optical lens and an LED light source device adopting the integrated optical lens. The integrated optical lens includes a lower optical interface for inputting light and an upper optical interface for outputting light. And the upper optical interface is a free-form surface of which the central area is concave towards the direction close to the lower optical interface and the peripheral edge area is convex towards the direction far away from the lower optical interface. And the curvature of the upper optical interface is gradually reduced from the center to the peripheral edge. According to the invention, the surface type of the upper optical interface is set, so that the LED light source device can realize a preset optical shaping effect without additionally arranging a secondary light distribution lens, the system volume is greatly reduced, and the backlight system is simple in structure and smaller and thinner in size. The light emitted by the single LED light source device is uniform, so that the uniformity is improved without depending on the superposition of a plurality of light sources, and the partition control is further realized.

Silicon Photonics is a candidate technology for adding integrated optics functionality, either passive or active optical waveguides) to integrated circuits by leveraging the economies of scale of the CMOS microelectronics industry and using materials for the waveguide core such as silicon nitride (SiXNY) and silicon oxynitride (SiOXN1-X) for example. Microelectromechanical systems (MEMS) provide for movable platforms relative to the substrate allowing additional functionality to be added to a silicon circuit but also Silicon Photonics. Accordingly, by combining “fixed” waveguides formed upon the substrate with “movable” waveguides formed upon one or more movable platforms the inventors have established a series of Integrated Optics MEMS (IO-MEMS) based on Silicon Photonics. Such IO-MEMS include optical switches, optical attenuators, optical gates, optical switch matrices, configurable wavelength division multiplexer / demultiplexer devices, etc. exploiting both platforms and deformable beams.

The invention provides a terahertz generation chip based on a thin film lithium niobate platform and a preparation method of the terahertz generation chip, and belongs to the field of integrated optics and microwave photons. According to the chip, terahertz waves are generated by utilizing a second-order nonlinear difference frequency effect on thin-film lithium niobate, and phase matching of an optical field and a terahertz field is realized through parameter design of an optical waveguide structure of the lithium niobate layer and a terahertz waveguide structure of the silicon layer. The device comprises a nonlinear action layer, an isolation layer, a terahertz transmission layer and a substrate layer. Firstly, a silicon layer is thinned through a mechanical polishing process, then polytetrafluoroethylene is bonded to the bottom of the thinned silicon layer, finally, waveguide structure etching is carried out, a specific waveguide shape and size are constructed, and efficient generation and transmission of terahertz waves are achieved. The method has strong practical operability, and has wide application prospects in the fields of terahertz communication, spectroscopy, remote sensing and the like.

The invention discloses an integrated optical chip, a preparation method and an optical gyroscop.The integrated optical chip comprises a substrate and an optical device layer arranged on one side of the substrate, the optical device layer comprises a first coupler, N second couplers and N detectors, the first coupler comprises a first waveguide and N second waveguides connected with the first waveguide, and the N second couplers are connected with the N detectors; the first waveguide is connected with a light source; the N second couplers and the N second waveguides are arranged in a one-to-one correspondence mode, each second coupler comprises a third waveguide and a fourth waveguide, the third waveguides are used for being connected with the interference units, the second waveguides are connected with the third waveguides, and the fourth waveguides are connected with the third waveguides; the N detectors are connected with the N fourth waveguides in a one-to-one correspondence mode, the N detectors are distributed at intervals in at least one of the first direction and the second direction, and the first direction intersects with the second direction.

This invention relates to the production of integrated optical waveguides on the surface of planar polymer substrates (polymer chips) using UV laser lithography. The resulting optical waveguides are multilayer optical waveguides that, when light is guided in the lower part of the optical waveguide, form radiation modes. As a result, light energy is radiated from the underside of the optical waveguide into the volume of the polymer substrate, so that it is lost to the actual light guide.Since the associated attenuation losses are usually undesirable, two different partial solutions are presented, which can then be combined to suppress the unwanted radiation modes as completely as possible. A parameter window for the UV laser lithographic production of polymeric, integrated-optical (planar) optical waveguides is presented, which is located shortly before the UV photon-induced carbonization (discoloration) of the irradiated zone of the optical waveguides to be produced. Due to the thermal effect of the incident high-energy UV excimer laser radiation, a change in the refractive index depth profile within the irradiated zone occurs above a certain radiation dose, so that no more radiation modes can form there.As a further solution, polyacrylate layers are produced by spin-coating and subsequently curing acrylate layers on a carrier substrate. These layers are too thin for radiation modes to form on the underside of the optical waveguides produced by subsequent UV exposure.

An optical waveguide structure for an optical gyroscope, the structure including a substrate; at least a first silicon nitride waveguide loop and a second silicon nitride waveguide loop connected to the substrate, the first silicon nitride waveguide loop and the second silicon nitride waveguide being disposed at different vertical distances from the substrate; at least one vertical coupler optically coupling the first silicon nitride waveguide loop to the second silicon nitride waveguide; and a plurality of air cavities defined in material below the first and second silicon nitride waveguide loops, no air cavities being defined in regions immediately below a coupling region defined around the at least one vertical coupler.