Low dielectric-epoxy resin/mesoporous molecular sieve hybrid material and preparation method thereof

A technology of mesoporous molecular sieve and epoxy resin, applied in plastic/resin/wax insulators, organic insulators, etc., can solve the problems of lower dielectric constant, lack of environmental protection in preparation process, and poor comprehensive performance.

Inactive Publication Date: 2010-02-03
TORAY FIBER RES INST(CHINA) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] In terms of candidate resins, although polytetrafluoroethylene has excellent dielectric properties, it has the following disadvantages: poor processability, poor overall performance, and high cost
The dielectric constant of the obtained substrate is reduced, but the use of a large amo

Method used

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  • Low dielectric-epoxy resin/mesoporous molecular sieve hybrid material and preparation method thereof
  • Low dielectric-epoxy resin/mesoporous molecular sieve hybrid material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] 1. Composite of mesoporous molecular sieve and epoxy resin

[0064] a) Drying of mesoporous molecular sieves: at 250°C, dry 0.50g of MCM-41 for 2 hours under the condition of an absolute vacuum higher than 0.1MPa to exclude moisture and small air molecules in the pores of the molecular sieve;

[0065] b) Pretreatment of epoxy resin prepolymer: put 8.34g of EP-828 in a vacuum oven, heat at 80°C to reduce its viscosity, and then remove air bubbles under the condition that the absolute vacuum degree is higher than 0.1MPa.

[0066] c) Mixing of mesoporous molecular sieve and epoxy resin prepolymer: Mix 8.34g of EP-828 obtained in b) with 0.5g of fully dried MCM-41, and disperse with magnetic stirring at 80°C for 8h, so that the mesoporous molecular sieve Disperse evenly in epoxy resin to obtain EP-828 prepolymer containing MCM-41.

[0067] 2. Curing molding

[0068] Heat and melt 1.16g m-phenylenediamine at 80°C, mix evenly with the EP-828 prepolymer containing MCM-41, an...

Embodiment 2

[0079] According to the same process as in Example 1, 0.3g MCM-41 was vacuum-dried at 250°C for 2 hours; 8.52g of pretreated EP-828 was mixed with 0.3g of dried MCM-41, and then ultrasonicated at 80°C Disperse for 8 hours, then mix evenly with 1.18g of molten m-phenylenediamine, heat cure and form, and obtain 828 type epoxy resin hybrid material containing 3% MCM-41.

[0080] Adopt the method identical with embodiment 1, record glass transition temperature and be: 202.1 ℃; Test frequency range: 100Hz~10MHz, record the dielectric constant of the 828 type epoxy resin hybrid material containing 3%MCM-41 at 100kHz The lower is 4.20, which is 0.13 lower than the dielectric constant of pure 828 epoxy resin.

Embodiment 3

[0082] According to the same process as in Example 1, 0.30g of SBA-15 was vacuum-dried at 250°C for 2 hours; 8.05g of pretreated E-51 was mixed with 0.30g of dried SBA-15, and then dispersed by magnetic stirring at 80°C 8h, and then mixed with molten 1.65g of anhydrous piperazine, heat-cured and molded to obtain a type 51 epoxy resin hybrid material containing 3% SBA-15.

[0083] Using the same method as in Example 1, the recorded glass transition temperature is: 129.7°C; the test frequency range: 100Hz to 10MHz, and the dielectric constant of the 51 type epoxy resin hybrid material containing 3% SBA-15 is recorded at 100kHz The lower is 4.21, which is 0.30 lower than the dielectric constant of pure 51 type epoxy resin.

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Abstract

The invention belongs to the field of organic/inorganic hybrid materials and discloses a low dielectric-epoxy resin/mesoporous molecular sieve hybrid material and a preparation method thereof. The hybrid material comprises the following components in portion by weight: epoxy resin prepolymer 70-91.2, mesoporous molecular sieves 0.1-12 and curing agent 8.8-25. The epoxy resin hybrid material containing mesoporous molecular sieves of the invention has a dielectric constant which is reduced by 0.1 to 0.9 at 100kHz compared with that of pure epoxy resin at 100kHz and retains the original excellentperformance of epoxy matrix resin at the same time. According to the preparation method of the invention, the mesoporous molecular sieves uniformly disperse in the resin and form an excellent boundary structure, and the obtained hybrid material has a low dielectric constant and an excellent thermal mechanical property and can be used in the fields of printed circuit boards, electronic package andthe like.

Description

technical field [0001] The invention belongs to the field of organic / inorganic hybrid materials, in particular to a class of low-dielectric epoxy resin / mesoporous molecular sieve hybrid materials and a preparation method thereof. Background technique [0002] With the informatization of society, the high speed of information processing and information dissemination, electronic products are developing in the direction of light, thin, short, small and multi-functional. In order to achieve high-speed signal propagation in the case of high-density components, it is urgent to use low-dielectric constant substrate materials. In the line, the signal propagation speed is related to the dielectric constant of the substrate. The lower the dielectric constant of the substrate, the faster the signal propagation speed. The relationship is as follows: [0003] V=K·C / ε r 1 / 2 [0004] In the formula, V-signal propagation speed; [0005] K-constant; [0006] C - the speed of light; ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K7/26C08K5/18C08K5/3462C08K9/06C08J3/20H01B3/40
Inventor 黄勇杨扬王惠陈桥吴刚
Owner TORAY FIBER RES INST(CHINA) CO LTD
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