Benzimidazole-epoxy matrix resin and preparation method thereof

A technology of epoxy matrix and benzimidazole, which is applied in the field of organic polymer resin and its preparation, can solve the problems of unsatisfactory heat resistance and achieve excellent dimensional stability, mild reaction conditions and simple operation

Inactive Publication Date: 2013-04-10
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But its heat resis...

Method used

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  • Benzimidazole-epoxy matrix resin and preparation method thereof
  • Benzimidazole-epoxy matrix resin and preparation method thereof
  • Benzimidazole-epoxy matrix resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030]Mix 100.0 g of N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane (TGBAPP) with 5.0 g of 2-(4-amino Phenyl)-5-aminobenzimidazole (APABI) was put into the reaction kettle, heated to 70°C and stirred for 15 minutes, then added 21.5 grams of resorcinol diglycidyl ether, 100.0 grams of methyl ethyl ketone and 40.0 grams of 1,4 -Dioxane, stir evenly, obtain 266.5 grams of A component, be denoted as A1, resin mass percent content is 47.5%;

[0031] Mix 100.0 g of N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane (TGBAPP) with 8.0 g of 2-(4-amino Phenyl)-5-aminobenzimidazole (APABI) was put into the reaction kettle, heated to 80°C and stirred for 30 minutes, then added 5.0 grams of resorcinol diglycidyl ether and 15.0 grams of 3,4-epoxy Cyclohexanecarboxylic acid-3',4'-epoxycyclohexylmethyl ester, 120.0 g of methyl ethyl ketone and 60.0 g of chloroform were stirred evenly to obtain 308.0 g of component A, denoted as A2, and the resin mass percentag...

Embodiment 2

[0037] The A component of Example 1, i.e. A1, A2, A3 and B component, i.e. B1, B2, B3, were mixed in proportion and stirred evenly to obtain a series of benzimidazole-epoxy matrix resins, denoted as BIE-1~BIE-9, as shown in Table 1.

[0038] Table 1 series of benzimidazole-epoxy base resin (BIE) formulations

[0039] BIE

Embodiment 3

[0041] Take an appropriate amount of benzimidazole-epoxy matrix resin (BIE), that is, BIE-1~BIE-9, and apply them evenly on standard stainless steel test pieces, and after airing at room temperature for 0.5 hours, stack and clamp Put it into a blast oven for curing: start from room temperature to 70°C, heat for 1 hour, continue to heat up to 100°C, heat for 1 hour, and cool to room temperature naturally. The tensile shear strength (σ) test was carried out at room temperature (25°C) and high temperature (150°C) using an electronic tensile machine, and the results are shown in Table 2.

[0042] Take an appropriate amount of benzimidazole-epoxy matrix resin (BIE), that is, BIE-1~BIE-9, push the film on the polytetrafluoroethylene film, put it in a vacuum drying oven, and make it into a size of 5mm× For a square sample of 5mm x 1mm, the curing process is as follows: start from room temperature to 70°C, heat for 1 hour, continue to heat up to 100°C, heat for 1 hour, and naturally c...

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Abstract

The invention relates to benzimidazole-epoxy matrix resin and a preparation method thereof. The resin consists of an A component and a B component. The preparation method comprises the following steps of (1) putting N,N,N',N'-tetraglycidyl-2,2-di-[4-(4-amino phenoxyl) phenyl] propane and 2-(4-amino phenyl)-5-amino benzimidazole into a reaction kettle, heating and raising the temperature to 70-80 DEG C, stirring and reacting for 15min-30min, adding a reactive diluent and an organic solvent, stirring uniformly, obtaining the A component, (2) mixing a curing agent with the organic solvent, stirring and dissolving uniformly, obtaining the B component, and (3) mixing the A component with the B component and stirring uniformly in a use process. The preparation method is simple; and the obtained matrix resin is excellent in comprehensive performance, can be applied to glass fiber or carbon fiber reinforced advanced composites, and can also be applied to adhesive agents of substrates such as metal, glass and ceramics.

Description

technical field [0001] The invention belongs to the field of organic polymer resin and its preparation, in particular to a benzimidazole-epoxy matrix resin and its preparation method. Background technique [0002] Polybenzimidazole is a class of polymers with excellent comprehensive properties. It has excellent heat resistance, low temperature resistance, solvent resistance, self-lubrication and flame retardancy. At the same time, it also has very good mechanical properties and Dielectric properties. Therefore, it is widely used in high-temperature-resistant fiber materials and high-temperature-resistant materials for spacecraft, satellites or space vehicles; advanced structural composite materials in aerospace, automotive, electromechanical, etc., C-level or 200-level electrical insulation materials, High-temperature resistant adhesives, etc.; and FPC or PCB substrate materials in the field of electronic and microelectronics, interlayer insulation materials for ICs, VLSI p...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08G59/38
Inventor 虞鑫海顾涛辛洪南钟凤王朝栋姜建洲
Owner DONGHUA UNIV
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