Microcapsule with damage hinting and repairing functions and application thereof in epoxy coating

A technology of microcapsules and epoxy, applied in the direction of microcapsule preparations, epoxy resin coatings, coatings, etc., can solve the problems that the repair effect of epoxy coatings is difficult to be effectively exerted, microcapsules have poor toughness, and are easy to break.

Inactive Publication Date: 2016-11-16
MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, whether this method is applicable to epoxy coatings remains to be studied
[0004] There are also some relevant reports on the production of microcapsules in the prior art. However, on the one hand, the existing microcapsules do not have the function of indicating damage. The repair effect in the coating i

Method used

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  • Microcapsule with damage hinting and repairing functions and application thereof in epoxy coating
  • Microcapsule with damage hinting and repairing functions and application thereof in epoxy coating
  • Microcapsule with damage hinting and repairing functions and application thereof in epoxy coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Dissolve 0.06 g of 2,7-dichlorofluorescein and 4 g of Desmodur L 75 polyurethane prepolymer in 60 ml of glycidyl methacrylate, and ultrasonically disperse for 30 minutes to make a nuclear solution; add 125 ml of deionized In the three-necked flask of water, add 0.625 gram Zemac E400 vinyl maleic anhydride copolymer reactive emulsifier, 3.75 gram urea, 0.25 gram ammonium chloride, 0.375 gram phenol, stir 10 minutes, stirring speed is 400 revolutions per minute, adopt 20wt% sodium hydroxide solution to adjust the pH value to 3.5; then slowly drop the nuclear solution into the three-necked flask, and continue to stir for 10 minutes to complete the pre-emulsification and inner core coating; then slowly raise the temperature to 55±5°C, and slowly add 9.50 Gram 37wt% formaldehyde solution (formalin), insulation reaction 4 hours. The microcapsules are then filtered and rinsed with copious amounts of deionized water to remove excess emulsifier. Finally, dry in an oven at 40±5°...

Embodiment 2

[0057] Dissolve 0.06 g of 2,7-dichlorofluorescein and 2 g of Desmodur L 75 polyurethane prepolymer in 60 ml of ethyl phenylacetate, and ultrasonically disperse for 30 minutes to prepare a nuclear solution; add 125 ml of deionized water to the Add 0.625 gram Zemac E400 vinyl maleic anhydride copolymer reactive emulsifier in the three-necked flask, 2.5 gram urea, 0.25 gram ammonium chloride, 0.25 gram phenol, stir 10 minutes, stirring speed is 400 revolutions per minute, adopt the hydrogen of 20wt% The sodium oxide solution adjusted the pH value to 3.5; then slowly added the nuclear solution dropwise into the three-necked flask, and continued to stir for 10 minutes to complete the pre-emulsification and inner core coating; then slowly raised the temperature to 55±5°C, and slowly added 6.33 grams of 37wt % formaldehyde solution (formalin), heat preservation reaction for 4 hours. The microcapsules are then filtered and rinsed with copious amounts of deionized water to remove exces...

Embodiment 3

[0060] Weigh a certain amount of epoxy resin, diluent, and additives according to the formula and stir it for 10 minutes at a speed of 1000 rpm in the RN-500 revolution and rotation mixing and defoaming machine; then add the curing agent, and then use RN- Stir at a speed of 1000 rpm for 10 minutes in a 500 revolution and self-rotation mixing and degassing machine; Stir at a speed of 1000 rpm for 2 minutes to obtain the epoxy coating premix; finally pour the epoxy coating premix into a vacuum stirring tank and stir for defoaming, the stirring speed is 100 rpm, and the defoaming time For 20 minutes, the vacuum degree is -0.095MPa, and the epoxy coating is obtained.

[0061] Adopt above-mentioned process and method, obtain the epoxy coating product of following 3 formulas (the addition of each component in the formula is in weight fraction) respectively:

[0062] Recipe 1

[0063] Epoxy resin: bisphenol A epoxy resin ADEKA EP-4100HF 100

[0064] Thinner: Polypropylene Glycid...

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Abstract

The invention provides a microcapsule. The microcapsule is of a double-layered structure. The material of an inner capsule wall is polyurethane resin. The material of an outer capsule wall is urea resin. A fluorescent pigment and an epoxy reparation agent are wrapped in the capsule walls. The microcapsule created by the invention has good compatibility with an epoxy matrix. The microcapsule is fractured under the effect of external stress to release reparation monomers for reparation, and meanwhile, the positions and conditions of damage occurring parts can be hinted through colour changes.

Description

technical field [0001] The invention relates to self-healing building materials and the like, in particular to microcapsules with damage indication and repairing functions that can be applied to outer coatings such as bridges, pipes, and fan blades, and their application in epoxy coatings. Background technique [0002] Epoxy resin has the advantages of excellent adhesion, chemical stability, high and low temperature resistance, low shrinkage, and low cost. It is widely used in aerospace, automotive, military, electronics, bridges, pipelines and other fields as a coating or adhesive use. However, since the epoxy substrate forms a three-dimensional network structure after curing, it is prone to damage when subjected to external stress, resulting in the formation of many micro-cracks deep in the coating, which reduces the protective ability of the epoxy coating; these micro-cracks are difficult to detect, resulting in Microcracks eventually develop into macrocracks, causing sa...

Claims

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Application Information

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IPC IPC(8): C09D163/00C09D175/04C09D161/24C09D7/12B01J13/02
CPCB01J13/02C08L2205/03C09D7/41C09D7/65C09D163/00C08L75/04C08L61/24C08K5/1545
Inventor 帅茂兵郭亚昆李晗徐对功赵鹏翔仲敬荣杨晓娇
Owner MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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