279 results about "Dicyclopentadiene" patented technology

To provide an epoxy resin composition that has low volume resistivity and exhibits suitable conductivity when formed as a coating film, and that makes it possible to form a coating film having excellent solder wettability and solder erosion resistance.SOLUTION: An epoxy resin composition contains the following components (A) to (D): (A) one or more epoxy resins selected from the group consisting of triphenylmethane-type epoxy resins, naphthalene-type epoxy resins, and phenol novolac-type epoxy resins; (B) one or more epoxy resins selected from the group consisting of polyether-modified epoxy resins, urethane-modified epoxy resins, mesogen-modified epoxy resins having an -O-CH2CH(OH)CH2-O- skeleton in the molecule thereof, bisphenol-type epoxy resins, and dicyclopentadiene-type epoxy resins; (C) an imidazole-based compound and / or a phenol-based compound; and (D) one or more conductive powders selected from among silver-coated copper powders, silver-based powders, nickel-based powders, conductive carbon powders, copper-based powders, and gold-based powders.SELECTED DRAWING: None

The invention relates to a high-thermal-conductivity low-dielectric epoxy resin composition and a preparation method thereof, and the high-thermal-conductivity low-dielectric epoxy resin composition comprises the following raw materials in parts by weight: 13-16 parts of a thermal conductive filler, 45-50 parts of epoxy resin, 23-27 parts of a curing agent and 0.3-0.7 part of an accelerant, the heat-conducting filler comprises attapulgite, modified boron nitride and aramid fiber in a mass ratio of (0.7-0.9): (6-9): (0.2-0.5). The attapulgite, the modified boron nitride and the aramid fiber are used as heat-conducting fillers, the dicyclopentadiene epoxy resin and the bisphenol A epoxy resin are used as epoxy resin, and the epoxy resin with high heat conductivity and low dielectric property is prepared by means of weakening charge transfer among molecules, reducing polarization effect, forming a three-dimensional heat-conducting network and the like.

The invention relates to the technical field of polymer composite materials, in particular to an explosion-proof and impact-resistant polymer coating material for an aircraft shell. The coating is prepared from aliphatic polyurethane acrylate, cycloaliphatic epoxy resin, nano silicon dioxide, polyethylene glycol, polyurea microcapsules, dicyclopentadiene resin, a Grubb catalyst, graphene oxide, polysulfide rubber and the balance of auxiliary materials. According to the invention, aliphatic polyurethane acrylate is used as a flexible matrix, so that the risk of hydrolysis of aromatic isocyanate is avoided. The dicyclopentadiene resin is subjected to in-situ ring opening polymerization in the presence of a Grubbs catalyst and cooperates with the hydrophobic nano silicon dioxide to block water. The polyurea microcapsules are broken by impact to release silicone oil, and cracks are filled immediately to reduce friction. And a water molecule permeation path is prolonged by the mica powder sheet layer. And the epoxy-polyurethane network realizes micro-crack self-repairing through dynamic ester bond exchange, so that the anti-explosion and anti-impact functions of the coating and the structural stability of an aircraft shell in an extreme environment are guaranteed.

The present invention relates to a matting agent for HAA powder coatings and a preparation method thereof. The matting agent is a matting polymer containing special groups such as hydroxyl and epoxy groups with significantly different activities. The matting polymer is mainly prepared from glycidyl methacrylate, methyl methacrylate, butyl acrylate, 5-norbornene-2-methanol, 2-methyl-3-butene-2-ol, dicyclopentadiene dioxide, a hydroxyl polyester resin, and an accelerator. Due to the presence of hydroxyl and epoxy groups of varying activities in its structure, supplemented by the accelerator and the physical dispersion effect during the preparation process, the product has excellent matting ability and good storage and matting stability. It can reduce the gloss of HAA system powder coatings to 3-10%.

The invention provides dicyclopentadiene phenol resin and a preparation method thereof, dicyclopentadiene phenol epoxy resin and a preparation method and application thereof. Compared with common dicyclopentadiene phenol resin, the dicyclopentadiene phenol resin has unsaturated cycloolefin active functional groups at the tail ends of molecular chains, so that the reactivity of the resin can be improved, and the application field of the dicyclopentadiene phenol resin is expanded.

The invention discloses a packaging material as well as a preparation method and application thereof. The packaging material comprises the following components in parts by mass: 40-85 parts of matrix resin, 5-30 parts of phase change PCM particles, 3-20 parts of self-repairing microcapsules, 1-8 parts of an interface compatilizer and 10-20 parts of a heat-conducting network reinforcing material, the melting point of the phase change PCM particles is not more than 80 DEG C; a core layer of the self-repairing microcapsule comprises dicyclopentadiene and a ruthenium catalyst, and a shell layer of the self-repairing microcapsule comprises polyurea or polyurethane; the PCBA packaging material with the intelligent response function is formed by combining the low-melting-point phase-change PCM particles with the self-repairing microcapsule system, when the PCBA temperature is too high, the low-melting-point phase-change PCM particles are molten, junction temperature suddenly rising is restrained through melting heat absorption, meanwhile, the adjacent microcapsules are triggered to be broken through volume expansion, DCPD monomers are released and subjected to in-situ polymerization under the action of a catalyst, and the PCBA packaging material with the intelligent response function is obtained. Microcracks generated by thermal stress are rapidly repaired, and the heat dissipation stability and the electrical insulation reliability of the material in long-term thermal circulation are remarkably improved.

A method of rapidly forming an elastomer with tunable properties is described herein. The method includes preparing a monomer solution comprising a catalyst and one or more monomers including 1,5-cyclooctadiene (COD). The one or more monomers may further include dicyclopentadiene (DCPD), and each of the COD and the DCPD may be present in the monomer solution at a predetermined volume percentage. A region of the monomer solution is activated to initiate an exothermic polymerization reaction and generate a self-propagating polymerization front, which moves through the monomer solution and polymerizes the one or more monomers. Thus, an elastomer having predetermined properties is rapidly formed.

The invention discloses an epoxy resin material for electronic plastic package of a radio frequency chip and a preparation method of the epoxy resin material. The preparation method comprises the following steps: firstly, carrying out alkylation reaction on dicyclopentadiene and phenol in the presence of a catalyst boron trifluoride diethyl etherate to synthesize dicyclopentadiene phenol resin, and epoxidizing the dicyclopentadiene phenol resin through epoxy chloropropane to obtain dicyclopentadiene epoxy resin DCPDDE; then, synthesizing a poly (dicyclopentadiene) linear polymer PDCPD by taking a Pd / Ag ionic compound as a catalyst, and then reacting the PDCPD with cysteamine sulfydryl to obtain dicyclopentadiene cysteamine PDCPDAm; and finally, mixing the DCPDDE, the PDCPDAm, the filler and the coupling agent, stirring, defoaming and curing to form the thermosetting resin with a three-dimensional network structure. The synthetic process is simple, the cost is low, the mobility and polarizability of molecules are limited due to high rigidity and low polarity of the obtained resin, transmission of a radio frequency chip under a high-frequency high-speed signal is ensured, stable operation in a complex working environment is ensured, reliable packaging protection is provided for the radio frequency chip, and the service life of the radio frequency chip is prolonged. And the thermal stability and the low dielectric property of the radio frequency chip are improved to the greatest extent.

The invention relates to the technical field of electronic materials, in particular to a copper-clad plate resin composition with an ultralow-loss medium and a preparation method of the copper-clad plate resin composition. The composition comprises the following components: modified polyphenyl ether, dicyclopentadiene epoxy resin, trifunctional epoxy resin, active ester, cyanate ester, DMAP, spherical silicon dioxide and a POSS-silicon dioxide compound, the preparation method comprises the following steps: carrying out surface norbornenylation modification on bimodal spherical silicon dioxide, and carrying out click reaction on the bimodal spherical silicon dioxide and octa-aminophenyl polysilsesquioxane with tetrazinyl at the tail end to prepare a POSS-silicon dioxide compound, so as to construct an interface transition layer with gradient modulus. According to the invention, collaborative optimization of dielectric loss, thermal mechanical properties and interface bonding strength is realized, and the material has excellent properties of low dielectric loss, high thermal stability, high peel strength and the like, and is suitable for the fields of 5G communication, high-frequency electronic equipment and the like.

According to the organic silicon modified epoxy self-repairing anti-corrosion coating and the preparation method and application thereof, amino functionalized graphene, nano silicon dioxide and self-repairing microcapsules (dicyclopentadiene) are added into a coating formula in a chemical modification mode, the molecular structure of epoxy resin (bisphenol A type) is optimized, and the self-repairing anti-corrosion coating is prepared. On the basis of enhancing the physical and mechanical properties of the coating, better physical and mechanical properties, corrosion resistance, heat resistance and self-repairing functions of the coating are further realized. The coating can meet protection of parts with high corrosion resistance, high application environment temperature and abrasion and damage problems, is specifically applied to the fields of high-temperature pipeline protection, corrosion resistance of lithium battery shells, engine blades, photovoltaic supports and the like, and can prolong the service life of related parts and equipment.

According to the modified water-based alkyd resin based on dicyclopentadiene and the preparation method of the modified water-based alkyd resin, the water-based alkyd resin is modified by combining diacrylic acid, cyclopentadiene modification and tung oil, and the rigidity of cyclopentadiene modification and the flexibility of tung oil achieve the modification effect of combining rigidity and softness; the problems of poor storage stability, low paint film hardness and insufficient water resistance of traditional water-based alkyd resin are successfully solved, the storage period of the water-based alkyd resin water-based paint is greatly prolonged, the formed paint film is high in drying speed and high in hardness and has good adhesive force, impact resistance, weather resistance and corrosion resistance, the production process is stable and controllable, and the production cost is low. Wide application prospects and economic values are realized.

The invention discloses a high-temperature-resistant resin glue solution for a copper-clad plate and a preparation method of the high-temperature-resistant resin glue solution, and relates to the technical field of copper-clad plates. The high-temperature-resistant resin glue solution is prepared from the following raw materials in parts by mass: 60 to 80 parts of dicyclopentadiene phenol type epoxy resin, 20 to 40 parts of fluorinated benzoxazine, 10 to 30 parts of dicyclopentadiene phenol type phenolic resin, 5 to 10 parts of hyperbranched polysiloxane, 90 to 100 parts of solvent, 5 to 8 parts of additive and 10 to 20 parts of inorganic filler. Wherein trifluoromethyl and naphthalene rings are introduced into the fluorinated benzoxazine, so that the heat-resistant stability and the dielectric property of the resin glue solution are effectively improved; a copper-clad plate sample prepared from the resin glue solution has a good application effect.

The application belongs to the technical field of organic compound synthesis and the field of polymer preparation, and discloses a method for directly preparing a cycloolefin copolymer from dicyclopentadiene and ethylene based on a continuous flow reactor; the continuous flow reactor is used to efficiently prepare norbornene and derivatives thereof from ethylene and dicyclopentadiene, and then the norbornene and derivatives thereof are used to prepare a cycloolefin copolymer from excessive ethylene. The application uses dicyclopentadiene and ethylene as raw materials, realizes a continuous process from the synthesis of a cycloolefin monomer to the preparation of a cycloolefin copolymer, and the cycloolefin monomer does not need to be separated and stored and can directly participate in the polymerization reaction, so that the original complicated process is effectively simplified, energy consumption is reduced, the catalyst in the polymerization stage is not easy to be deactivated even at high temperature, the catalytic efficiency is high, and a high polymer yield can be obtained in a very short time.

The invention discloses a manufacturing method of a composite prepreg with interface and matrix self-repairing capability. Belongs to the technical field of composite material intermediate manufacturing. The preparation method comprises the following steps: mixing dicyclopentadiene and a catalyst thereof, and epoxy resin and a curing agent thereof to obtain a microcapsule active component; adding the mixture into a prepolymer solution used as a shell material, emulsifying, adjusting the pH value, heating and curing to finish the reaction, washing, filtering and drying to obtain microcapsules; mixing the epoxy resin with a catalyst in matrix resin to obtain prepreg resin; and controlling viscosity and curing degree to form a resin film or wet resin, and combining the resin film or wet resin with unidirectional fiber cloth and the like through a solvent or a hot melting method. By combining the characteristics of rapid prototyping and self-repairing of PDCPD and utilizing the interface repairing capability provided by the low-content epoxy resin in the formula, rapid and synchronous high-strength interface and matrix self-repairing which cannot be realized by the existing composite material is realized, and the defect that after a composite material structural part is damaged, the self-repairing performance of the composite material is greatly improved is overcome. And in-situ repair cannot be rapidly carried out.

The invention relates to the technical field of tire rubber manufacturing, and discloses a butyl inner tube rubber composition with an ultralow air permeability coefficient and a preparation method thereof. The superfine washed kaolin and the dicyclopentadiene hydrogenated resin are added into the rubber composition, do not affect the excellent elasticity of traditional butyl rubber and can synergistically improve the air tightness of the butyl inner tube rubber composition, so that the situation that the gas permeability of a butyl inner tube is increased under the conditions of high temperature, complex road conditions and long-term use is avoided, and the service life of the butyl inner tube is prolonged. And the risk of tire burst caused by low tire pressure due to the increase of the gas permeability of the butyl inner tire is reduced. The invention provides a solution for improving the long-acting sealing performance of the butyl inner tube of the heavy-duty vehicle, and has obvious economic benefit and environmental protection value.

The present application relates to the technical field of deep processing of petroleum chemical carbon five fraction oil, and particularly relates to a petroleum cracking carbon five fraction oil hydrofining method, wherein a polar competitive adsorbent is added into raw oil before the raw oil enters a main hydrogenation reaction, so that enrichment and deposition of cyclopentadiene (CPD) / dicyclopentadiene (DCPD) and chain double bond components in the catalyst are reduced; meanwhile, a low-acid hole-expanding Ni catalyst is used to reduce the polymerization deposition risk and maintain an effective hydrogenation rate, so that the problems of colloid deposition and pressure drop increase in the front section of the catalyst bed are relieved, and the problem that a Ni-based catalyst in the prior art cannot effectively inhibit the deposition of CPD components for a long time when hydrofining the CPD-containing carbon five fraction oil is solved.

The present invention belongs to the field of functional resins and specifically relates to a lignin-modified dicyclopentadiene phenol resin and a preparation method thereof. The present invention utilizes phenol to phenolate bamboo lignin under alkaline conditions, and then uses methanesulfonic acid to catalyze the reaction of the phenolated bamboo lignin, phenol, and dicyclopentadiene to prepare the dicyclopentadiene phenol resin. This reduces the amount of phenol used in the dicyclopentadiene phenol resin and improves its heat resistance, corrosion resistance, and other properties, resulting in high bonding strength, friction resistance, and electrical insulation. Furthermore, the preparation method is simple, the reaction conditions are mild, and the production cost is low, meeting the environmental protection needs of modern society while also adhering to the principles of green chemistry and chemical atom economy.

To provide a tire which can improve total performance of anti-wear performance, snow grip performance, and wet grip performance.SOLUTION: A tire has a tread part, wherein the tread part is composed of a rubber composition containing a rubber component, silica, a resin component, and vegetable oil, the rubber component contains 20 mass% or more and 90 mass% or less of styrene-butadiene rubber, the rubber composition contains more than 50 pts.mass and 150 pts.mass or less of silica with respect to 100 pts.mass of the rubber component, the resin component contains at least one selected from the group consisting of a terpene-based resin, a C5C9-based resin, and a dicyclopentadiene-based resin, a glass transition temperature of the rubber composition is -30°C or lower, and when a thickness of a thickest part of the tread part is represented by t (mm), and a styrene content of the styrene butadiene rubber is represented by S (mass%), t×S is less than 300.SELECTED DRAWING: Figure 1

The present invention provides a method for preparing an environmentally friendly coating using a modified polyaspartic acid ester resin and an isocyanate and its application, belonging to the field of coating technology. The environmentally friendly coating includes the following raw materials by mass fraction: component A: 22-27 parts of modified polyaspartic acid ester resin, 6-11 parts of polyaspartic acid ester resin, 13-18 parts of long-chain olefin-modified dicyclopentadiene resin, 2-5 parts of zinc phosphate, 1-3 parts of dispersant, 2-5 parts of adhesion promoter, and 12-18 parts of modified mixed filler; component B: 75-80 parts of toluene diisocyanate, 20-30 parts of HDI trimer, 3-5 parts of defoamer, and 2-3 parts of leveling agent. The environmentally friendly coating prepared by the present invention has excellent corrosion resistance, wear resistance, and bending resistance, and has good adhesion on PE T plastic surfaces.

A preparation method for a urea-formaldehyde microcapsule, comprising: uniformly mixing an emulsifier, urea, ammonium chloride, resorcinol and deionized water, adjusting the pH value, defoaming, adding dicyclopentadiene to form an emulsion, after stabilization, adding a formaldehyde solution and paraffin oil, covering and heating the emulsion for polymerization, and cooling and washing to obtain a urea-formaldehyde microcapsule.

The application relates to a weather-resistant color master batch for modified polypropylene cable protection pipes, which is composed of a carrier resin, a photo-thermal stable color powder, a filler and a grafting compatibility modifier; the photo-thermal stable color powder is composed of zinc dicyclopentadiene dimethylate, orange yellow, bright red, an antioxidant, an ultraviolet absorber and a dispersant; the dicyclopentadiene in the zinc dicyclopentadiene dimethylate has heat-reversible crosslinking properties, is disdimerized during heat processing, has good processing fluidity, is re-cyclized and addition-dimerized to be crosslinked after temperature reduction, so that the decomposition of the orange yellow and the bright red caused by cable heating is reduced; meanwhile, the antioxidant and the ultraviolet absorber have a compound synergistic effect, so that the weather resistance of the color master batch can be better improved; the modified polypropylene cable protection pipe prepared by using the color master batch has the advantages of color stability, reduced processing toxicity, good processing fluidity, low price and the like, and is more suitable for power cable protection pipe use.

The present invention belongs to the field of phenolic resin synthesis, and specifically relates to a method for modifying dicyclopentadiene phenol resin with flavonoid biomass. The present invention uses a heat-resistant strongly acidic cation exchange resin as a catalyst and partially replaces phenol with daidzein to prepare the dicyclopentadiene phenol resin. The daidzein can effectively replace phenol, and the addition of daidzein can also improve the performance of the resin. The addition reaction of the benzopyran ring is conducive to the formation of cross-linking density. The appropriate amount of daidzein substitution can increase the degree of cross-linking. Finally, the resin synthesized by modifying the daidzein has good corrosion resistance, friction resistance, water absorption resistance, and thermal stability.

The present invention provides a photocurable thermosetting resin composition, a dry film, a cured product, and an electronic component. Namely, a photocurable thermosetting resin composition having excellent printability, a dry film having a resin layer formed of the resin composition, which is excellent in crack resistance and adhesion, a cured product formed of the resin composition, which is excellent in crack resistance and adhesion, and an electronic component are provided. The photocurable thermosetting resin composition comprises a carboxyl group-containing resin, a photopolymerization initiator, an epoxy resin comprising an epoxy resin containing a dicyclopentadiene skeleton, a stress relaxing agent, and an inorganic filler, the stress relaxing agent being any one or more of an elastomer having two or more Tgs apart by 50°C or more at 200°C and a rubber particle having a shell layer and a core layer, the content of the stress relaxing agent being 1 to 13% by weight of the solid content of the composition, the inorganic filler comprising talc, the content of the inorganic filler being 5 to 20% by weight of the solid content of the composition.

The invention discloses a preparation method of dicyclopentyl methacrylate, which comprises the following steps: carrying out hydration reaction on dicyclopentadiene serving as a starting raw material to obtain an intermediate I, carrying out hydrogenation reaction to obtain an intermediate II, and carrying out esterification reaction to obtain the dicyclopentyl methacrylate. The reaction temperature is 40-60 DEG C, and the mass ratio of dicyclopentadiene to phosphoric acid is (1.1-1.3): 1; the hydrogenation reaction takes palladium on carbon as a catalyst, the reaction temperature is 38-48 DEG C, and the mass ratio of the intermediate I to the palladium on carbon is 1: (0.001-0.01); the esterification reaction is carried out on the intermediate II and methacryloyl chloride under the catalytic action of an acid-binding agent triethyl diamine, the reaction temperature is-2 DEG C to 5 DEG C, and the molar ratio of the intermediate II to the methacryloyl chloride to the triethyl diamine is 1: (1.2-1.8): (2-3); the product purity reaches 99.80% or above, the total amount of metal impurities is lower than 70 ppb, the quality of the product is far higher than that of commercially available products, and the product meets the quality requirement of a resist raw material for photoresist.

The invention provides a production method and system of tetracyclododecene. The production method comprises the following steps: feeding a norbornene solution of dicyclopentadiene and gasified norbornene into a spray reactor, and reacting in the spray reactor to obtain a reaction product; the molar ratio of the norbornene to the dicyclopentadiene is (5-9): 1; buffering and depressurizing the reaction product to obtain reaction product liquid; and rectifying the reaction product liquid to respectively obtain norbornene and tetracyclododecene. The invention also provides a production system of tetracyclododecene. According to the production method, the spray reactor is used for reaction, so that the rate of converting the DCPD into the TCD can be remarkably improved, and the conversion rate of the DCPD and the selectivity of the TCD are improved.

The utility model relates to an adsorption tower for trapping bicyclic compounds in the technical field of bicyclic compound preparation. A second supporting assembly is mounted in the rectification box, and first supporting assemblies used for being matched with the second supporting assembly to adjust the distance between the tower plates are symmetrically mounted at the upper end and the lower end of the second supporting assembly. When the yield of dicyclopentadiene needs to be improved, a hand wheel is rotated, a second rotating rod is matched with a second bevel gear to enable a first bevel gear to rotate, a first rotating rod synchronously drives a gear to rotate, the gear drives an annular gear to rotate, a rotating ring rotates in the middle of a fixing ring, and when the rotating ring rotates, arc-shaped guide blocks at the upper end and the lower end of the rotating ring are synchronously driven to rotate; according to the technical scheme, sliding rods at the upper end and the lower end of a rotating ring slide from the position of a fourth supporting face to the position of a first supporting face, then the two first supporting assemblies are driven to get close to the rotating ring, the distance between tower plates is reduced, the retention time of materials in the first supporting assemblies and the second supporting assemblies is shortened, and then the dicyclopentadiene yield is increased.

The present invention relates to a resin composition, and a prepreg, a metal-clad laminate, a laminated sheet, and a printed circuit board each using same, wherein the resin composition comprises: (a) an epoxy resin containing a modified dicyclopentadiene (DCPD) epoxy resin; (b) an aliphatic benzoxazine-based resin; and (c) a curing agent.

The invention discloses a high-temperature-resistant epoxy molding compound for electronic packaging and a preparation method thereof, and relates to the field of electronic packaging materials. The invention aims to solve the problem that the epoxy molding compound prepared in the prior art is poor in high temperature resistance and cannot meet the higher working temperature requirement of a new generation of semiconductors. The invention discloses a high-temperature-resistant epoxy molding compound for electronic packaging. The high-temperature-resistant epoxy molding compound is prepared from the following components in percentage by mass: 10%-15% of o-cresol formaldehyde epoxy resin, 12%-18% of dicyclopentadiene cyanate ester, 0.1%-0.5% of copper acetylacetonate, 70%-80% of inorganic filler, 1%-2% of a coupling agent, 0.5%-1% of a release agent and 0.1%-0.5% of carbon black. A triazine ring structure with a high cross-linking characteristic is introduced into a resin matrix, so that the heat resistance is excellent; the prepared high-temperature-resistant epoxy molding compound for electronic packaging has the characteristics of high heat resistance, low dielectric constant, high breakdown field strength, high mechanical strength and the like, and is applied to the field of electronic packaging.

The invention relates to the technical field of diene hydrogenation preparation, in particular to a preparation method of exo-tetrahydrodicyclopentadiene, which comprises the following steps of: performing catalytic hydrogenation on a dicyclopentadiene solution by using a circulating continuous flow bubbling hydrogenation reactor at the normal pressure and the temperature of 70-90 DEG C at the volume space velocity of 5h <-1 > and the hydrogen-oil volume ratio of 750-850 to obtain exo-tetrahydrodicyclopentadiene, automatically separating the hydrogenation catalyst at the tail end of the reactor to obtain a hydrogenation product, stirring and mixing an isomerization catalyst and the hydrogenation product at 90-110 DEG C, and carrying out catalytic isomerization to prepare exo-tetrahydrodicyclopentadiene; and rectifying and separating to obtain hanging tetrahydrodicyclopentadiene. According to the invention, the circulating continuous flow bubbling hydrogenation reactor is adopted for liquid phase hydrogenation, continuous production of exo-tetrahydrodicyclopentadiene is realized by a two-step method, the problem that catalytic hydrogenation and isomerization reaction are not matched is avoided, the conversion rate of exo-tetrahydrodicyclopentadiene is increased, and coking and impurity pollution of non-target products are reduced.

The invention relates to a synthesis method of 2, 5-norbornadiene and a cracking and addition reaction device of the 2, 5-norbornadiene, the device is characterized in that dicyclopentadiene is decomposed into cyclopentadiene at a high temperature, the cyclopentadiene is fully mixed in an acetone solvent and then fully contacted and reacted with diffused acetylene gas under the action of the addition reaction device, and the 2, 5-norbornadiene is obtained. Due to sufficient mixing and rapid reaction under a microscale, addition of dicyclopentadiene and cyclopentadiene, addition of dicyclopentadiene and acetylene and polymerization reaction of 2, 5-norbornadiene can be inhibited to a greater extent; unreacted cyclopentadiene is polymerized into dicyclopentadiene in a later process, so that recycling is facilitated; therefore, dangerous wastes are greatly reduced in the production process. A cracking device and an addition reaction device in the process are respectively formed by connecting four micro-channel assemblies and eight micro-channel assemblies in series. The method has the characteristics of high target product purity, high recovery rate, low reaction by-product content and the like.