The invention discloses a packaging material as well as a preparation method and application thereof. The packaging material comprises the following components in parts by
mass: 40-85 parts of matrix resin, 5-30 parts of
phase change PCM particles, 3-20 parts of self-repairing microcapsules, 1-8 parts of an interface compatilizer and 10-20 parts of a heat-conducting network reinforcing material, the
melting point of the
phase change PCM particles is not more than 80 DEG C; a core layer of the self-repairing microcapsule comprises
dicyclopentadiene and a
ruthenium catalyst, and a shell layer of the self-repairing microcapsule comprises
polyurea or
polyurethane; the PCBA packaging material with the intelligent response function is formed by combining the low-melting-point phase-change PCM particles with the self-repairing microcapsule
system, when the PCBA temperature is too high, the low-melting-point phase-change PCM particles are molten,
junction temperature suddenly rising is restrained through
melting heat absorption, meanwhile, the adjacent microcapsules are triggered to be broken through
volume expansion, DCPD monomers are released and subjected to in-situ
polymerization under the action of a catalyst, and the PCBA packaging material with the intelligent response function is obtained. Microcracks generated by thermal stress are rapidly repaired, and the heat dissipation stability and the electrical insulation reliability of the material in long-term thermal circulation are remarkably improved.