The invention discloses a room temperature curing high-temperature-resistant high-tenacity epoxy adhesive and a preparation method thereof. The room temperature curing high-temperature-resistant high-tenacity epoxy adhesive is prepared from raw materials comprising a component A and a component B based on weight percent, wherein the component A comprises the following raw materials in weight percent: epoxy resin, a flexibilizer, a thinner, a coupling agent, fumed silica, a packing and a defoaming agent; the component B comprises the following raw materials in weight percent: alicyclic amine, polyamide, modified fatty amine, a coupling agent, fumed silica, a packing and a defoaming agent; the flexibilizer in the component A adopts epoxy resin modified by nanometer core-shell particles. According to the room temperature curing high-temperature-resistant high-tenacity epoxy adhesive disclosed by the invention, the excellent tenacity is achieved by using the common epoxy resin, the epoxy flexibilizer modified by the nanometer core-shell particles and the polyamide curing agent; the epoxy resin is cheap in price, accessible and capable of retaining higher shear strength at the high temperature; when alicyclic amine and modified fatty amine are selected and used as curing agents, the Tg can be higher, and the shear strength at the high temperature can be kept excellent.