The invention discloses a method for preparing a high-strength high-modulus organosilicone modified PI / SiO2 hybridization film. The method includes the following steps that firstly, aminosilane
coupling reagents are fully reacted with aromatic anhydride in a
solvent; secondly, the aromatic anhydride is dissolved in the
solvent and made into a solution, the
system, the aromatic anhydride and
tetraethyl orthosilicate in the first step are added into the solution, and a
polymerization reaction is performed to obtain an organosilicone modified
polyamide acid solution; the organosilicone modified
polyamide acid solution obtained in the second step is diluted, arranged on a supporting body in a
coating mode and roasted, and the film is obtained; fourthly, the film undergoes temperature rising,
dehydration and crosslinking, and a product is obtained. According to the method for preparing the high-strength high-modulus organosilicone modified PI / SiO2 hybridization film, the prepared hybridization film is high in stretching strength and modulus of elasticity, and the defect that a large amount of water is brought to the
system by conventionally adding
sol-
gel state silicon dioxide is overcome. The method for preparing the high-strength high-modulus organosilicone modified PI / SiO2 hybridization film can
well control the reaction evenness and the reaction accuracy and is short in experimental period, simple in technology and suitable for industrial production.