The invention relates to a production method of a 
silicon wafer cutting blade material. The production method of the 
silicon wafer cutting blade material uses high-purity green 
silicon carbide as the 
raw material and comprises the following steps: performing jaw crushing, screening, performing automatic circulation type wet ball milling and hydraulic 
cyclone classification, performing automatic overflow carbon removal, performing 
magnetic separation to automatically remove iron, performing alkali washing, cleaning, performing overflow classification under 
automatic control of a 
programmable logic controller (PLC), centrifuging to dewater, 
drying, mixing, performing fine screening and the like. The 
silicon carbide blade material prepared by the method has equiareal shape, sharp edges and high 
cutting capability; the blade material particles have large specific surface area and 
clean appearance and high suitability to 
cutting fluid such as 
polyethylene glycol; the product ground by automatic circulation type wet ball milling and 
cyclone classification has more equiareal shapes, good 
grain shape and high yield, and overgrinding can be avoided; and automatic 
magnetic separation is adopted to perform acid-free 
iron removal, thus the method has high efficiency, environmental friendliness and high degree of 
automation and is suitable for large-scale production. The product ground by the method has high particle size concentration degree and good 
grain shape, and better cutting effect can be realized.