The invention relates to a production method of a silicon wafer cutting blade material. The production method of the silicon wafer cutting blade material uses high-purity green silicon carbide as the raw material and comprises the following steps: performing jaw crushing, screening, performing automatic circulation type wet ball milling and hydraulic cyclone classification, performing automatic overflow carbon removal, performing magnetic separation to automatically remove iron, performing alkali washing, cleaning, performing overflow classification under automatic control of a programmable logic controller (PLC), centrifuging to dewater, drying, mixing, performing fine screening and the like. The silicon carbide blade material prepared by the method has equiareal shape, sharp edges and high cutting capability; the blade material particles have large specific surface area and clean appearance and high suitability to cutting fluid such as polyethylene glycol; the product ground by automatic circulation type wet ball milling and cyclone classification has more equiareal shapes, good grain shape and high yield, and overgrinding can be avoided; and automatic magnetic separation is adopted to perform acid-free iron removal, thus the method has high efficiency, environmental friendliness and high degree of automation and is suitable for large-scale production. The product ground by the method has high particle size concentration degree and good grain shape, and better cutting effect can be realized.