The invention relates to the technical field of
electronic equipment thermal management, in particular to an
electronic equipment thermal buffer device suitable for
missile-borne,
spacecraft and other environments facing extreme high
thermal load and severe temperature fluctuation. Comprising a packaging base body and a phase-change material, a partition plate is fixedly installed in the packaging base body and on one side of the phase-change material, a pressing plate is arranged on one side of the partition plate, and a spring winding type wire pulling device is arranged on the other side of the partition plate; the
clockwork spring winding type wire pulling device comprises a reel for winding a pulling wire, a first
bevel gear fixedly mounted on the reel, and a
clockwork spring in transmission connection with the first
bevel gear; a through hole is formed in the center of the
phase change material, and a
pulley is arranged on the inner wall of the packaging substrate corresponding to one end, far away from the pressing plate, of the through hole; the pull wire penetrates through the partition plate, the pressing plate and the through hole and bypasses the
pulley, and the
tail end of the pull wire is fixedly connected to the pressing plate. The device operates completely based on the
mechanical energy storage principle, the transmission mechanism is efficient and stable, the heat conduction efficiency and the interface heat exchange capacity are high, and the heat dissipation performance consistency is good.