The invention provides a glass substrate through hole
machining method, and belongs to the technical field of glass substrates. Comprising the following steps: S1, carrying out ultrasonic cleaning on a glass substrate by using a cleaning solution, and
drying; s2, dissolving
ammonium tungstate in water, dipping the glass substrate in the solution, dropwise adding concentrated
nitric acid for reaction, taking out the glass substrate, calcining, carrying out reverse
hydrogen heating reduction, scattering carbon
powder on the surface for
carbonization, taking out, washing and
drying; s3, dissolving an organic
zinc salt and an organic aluminum salt in water, adding
citric acid and
ethylene glycol, adjusting the pH value of the solution, dipping the glass substrate, carrying out a heating reaction, taking out the glass substrate, and calcining the glass substrate; s4, irradiating the target area of the glass substrate with
laser to modify the glass in the target area; and S5, carrying out spray
etching on the glass substrate to form a through hole, taking out, washing and
drying. According to the invention, the problems of easy
cracking, crack generation, low adhesion to
metal and the like in the traditional glass substrate
processing are solved, and the method has industrial application prospects.