Method for preparing aluminum nitride ceramic substrate by adopting composite powder grain shape

Abstract

The invention discloses a method for preparing an aluminum nitride ceramic substrate by adopting a composite powder grain shape. The method is innovatively characterized by comprising the following steps: calcining aluminum nitride and aluminum oxide composite powder through plasma activation, adding a sintering aid, an organic mixed solvent and other auxiliary solvents for performing ball-milling, performing vacuum defoaming, performing casting molding, performing pre-sintering and sintering on the casting green bodies to obtain the aluminum nitride ceramic substrate. The composite powder of aluminum oxide and aluminum nitride serves as a raw material, the surface state of the powder is changed through plasma calcining, the activity and diffusing capacity of atoms on the surface of the powder are improved, the sintering process is increased, and the sintering temperature is reduced. The powder is sintered in a reducing atmosphere in the sintering process, and novel ecological atoms are formed through a reduction reaction, so that the sintering process is improved, the production cost is saved, and the method is suitable for industrial production.

Description

technical field [0001] The invention relates to a method for preparing an aluminum nitride ceramic substrate, in particular to a method for preparing an aluminum nitride ceramic substrate by using a composite powder grain type. Background technique [0002] Aluminum nitride is a new type of ceramic material with excellent comprehensive performance. It has a series of excellent properties such as excellent thermal conductivity, reliable electrical insulation, low dielectric constant and dielectric loss, non-toxic and thermal expansion coefficient matching silicon. , is considered to be an ideal material for a new generation of high-density semiconductor substrates and electronic device packaging. Aluminum nitride substrates can be used in the fields of hybrid integrated circuits, semiconductor power devices, power electronic devices, optoelectronic devices, semiconductor refrigeration stacks, microwave devices, etc., as substrates and packaging materials. The aluminum nitrid...

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Problems solved by technology

Due to the complex preparation process of aluminum nitride powder and high equipment requirements, the price of alumina powder is expensive, and the sintering process of aluminum nitride is relatively harsh. These two complex factors lead to difficulties in the preparation of aluminum nitride ceramic materials; and when using organic slurry to prepare, because the organic solvent used is highly volatile, it has adverse effects on the environment and human body, and there is an environmental pollution problem