A kind of production method of silicon wafer cutting blade material

Abstract

The invention relates to a production method of a silicon wafer cutting blade material. The production method of the silicon wafer cutting blade material uses high-purity green silicon carbide as the raw material and comprises the following steps: performing jaw crushing, screening, performing automatic circulation type wet ball milling and hydraulic cyclone classification, performing automatic overflow carbon removal, performing magnetic separation to automatically remove iron, performing alkali washing, cleaning, performing overflow classification under automatic control of a programmable logic controller (PLC), centrifuging to dewater, drying, mixing, performing fine screening and the like. The silicon carbide blade material prepared by the method has equiareal shape, sharp edges and high cutting capability; the blade material particles have large specific surface area and clean appearance and high suitability to cutting fluid such as polyethylene glycol; the product ground by automatic circulation type wet ball milling and cyclone classification has more equiareal shapes, good grain shape and high yield, and overgrinding can be avoided; and automatic magnetic separation is adopted to perform acid-free iron removal, thus the method has high efficiency, environmental friendliness and high degree of automation and is suitable for large-scale production. The product ground by the method has high particle size concentration degree and good grain shape, and better cutting effect can be realized.

Description

technical field [0001] The invention relates to the field of multi-wire cutting, in particular to a method for preparing a blade material silicon carbide for wire cutting of solar photovoltaic silicon wafers. Background technique [0002] With the rapid development of the solar photovoltaic industry, the demand for high-quality silicon wafers is increasing day by day. The processing of silicon wafers is an important link in the manufacture of solar cell groups, and effective silicon wafer cutting technology is the basic guarantee for obtaining high-quality silicon wafers. In recent years, the multi-wire saw (Multi-Wire Saw), which has sprung up suddenly, occupies an absolute market leadership in the field of large-size silicon wafer processing due to its high production efficiency and wafer yield. The mixed cutting agent-mortar used in multi-wire saw, Its role is very important and plays a major role in the cutting process. Silicon carbide micropowder is widely used as a c...

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Problems solved by technology

[0003] At present, the quality of blade materials for photovoltaic wire cutting in China is uneven. Compared with similar foreign products, there are disadvantages such as low purity, uneven particle size, and poor cutting efficiency.

The production equipment and process methods of domestic enterprises are backward, the crushing effect is poor, the particle size distribution of the fine powder is too wide, and the products lack market competitiveness

At present, the production and processing methods of silicon carbide cutting blades in China mainly include the following types: the production process of jet mill crushing, the products produced are more than 90% equal in shape, and the yield is also high, but the overall jet mill The output is low, the shape of the output particles is round, the s

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