Method for preparing crystal silicon wafer cutting edge material
A cutting edge and crystalline silicon wafer technology, applied in the field of cutting and grinding materials, can solve the problems of low output, high water consumption, poor cutting efficiency, etc. strong effect
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[0027] Embodiment 1 A method for preparing a crystalline silicon wafer cutting blade material includes the following steps:
[0028] (1) For raw material crushing, select green silicon carbide blocks with a purity of ≥98%, perform jaw crushing and sieving, and collect silicon carbide sand with a particle size of ≤5mm;
[0029] (2) Dry ball mill classification When dry ball mill classification equipment is used to grind the above-mentioned silicon carbide particle size sand, the amount of steel balls added is 400kg, the ball-to-battery ratio is 3:1, the mill speed is 120rpm, and the first-class air classifier The speed is 800rpm to obtain the main product (silicon carbide powder with the required particle size range of 4.5~18um). The speed of the secondary air classifier is 1800rpm to obtain the by-products. The intake air volume of the induced draft fan is 3000m. 3 / h. Controlling the intake air volume of the induced draft fan enables the fine powder that meets the required particl...
Example Embodiment
[0037] Embodiment 2 A method for preparing a crystalline silicon wafer cutting blade material includes the following steps:
[0038] (1) For raw material crushing, select green silicon carbide blocks with a purity of ≥98%, perform jaw crushing and sieving, and collect silicon carbide sand with a particle size of ≤5mm;
[0039] (2) When dry ball mill classification is operated with dry ball mill classification equipment, the amount of steel balls added is 500kg, the ball-to-battery ratio is 4:1, the speed of the mill is 180rpm, and the speed of the first-stage air classifier is 850rpm, and the result is 4.5~ 18um silicon carbide powder, the speed of the secondary air classifier is 2000rpm, and the by-product is obtained, and the air intake of the induced draft fan is 3500m 3 / h.
[0040] (3) Pickling: Introduce the silicon carbide powder and water obtained in the previous step into the pickling tank with a weight ratio of 1:4, then add sulfuric acid at 8% of the mass of the silicon ca...
Example Embodiment
[0047] Embodiment 3 A method for preparing a crystalline silicon wafer cutting blade material includes the following steps:
[0048] (1) For raw material crushing, select green silicon carbide blocks with a purity of ≥98%, perform jaw crushing and sieving, and collect silicon carbide sand with a particle size of ≤5mm;
[0049] (2) When dry ball mill classification is operated with dry ball mill classification equipment, the amount of steel balls added is 500kg, the ball-to-battery ratio is 3:1, the speed of the mill is 200rpm, and the speed of the first-stage air classifier is 900rpm, and the result is 4.5~ 18um silicon carbide powder, the speed of the secondary air classifier is 1900rpm, and the by-product is obtained. The air intake of the induced draft fan is 4000m 3 / h.
[0050] (3) Pickling Add the primary product and water in the pickling tank with a weight ratio of 1:2.5, then add sulfuric acid at 8% of the mass of the silicon carbide powder, stir and react for 6 hours, and th...
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