This invention discloses an apparatus and method for trapezoidal deoxidation of CCGA device solder pillars. The apparatus comprises a stainless steel mesh, a base, gaskets, pads, a cover plate, fastening screws, and an anti-static stainless steel
brush. The method involves fixing the stainless steel mesh to the base with countersunk screws, then sequentially placing the gaskets, CCGA devices, and pads, securing the pads with fasteners, and finally fixing the cover plate. The length of the solder pillar extending beyond the stainless steel mesh is controlled by adjusting the
gasket thickness. Deoxidation is performed in two steps: first, the solder pillar extends 0.2 mm beyond the stainless steel mesh by adjusting the
gasket thickness, and then is sanded smooth with 400-grit
sandpaper; second, the solder pillar extends 0.5 mm beyond the stainless steel mesh by adjusting the
gasket thickness again, and then the sides of the solder pillar are deoxidized using an anti-static stainless steel
brush. This invention's apparatus and method can remove oxides from the
welding surface of CCGA device solder pillars, improving the
welding pass rate and solder joint quality of CCGA devices.