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9 results about "Thermal instability" patented technology

A dynamic temperature rise diagnosis and alarm method for high-voltage switch cabinet

PendingCN122346671AThermal instabilitySwitchgear
This invention discloses a dynamic temperature rise diagnosis and alarm method for high-voltage switchgear, comprising: collecting operating status data of thermal response structural nodes and constructing a multi-measurement point time-series data sequence; constructing a node association structure based on the multi-measurement point time-series data sequence to form a thermal potential constraint inversion map; constructing an improved SOFTS model that integrates thermal potential constraint weights and outputting baseline prediction and collaborative embedding vectors; stripping normal temperature rise components based on the difference between baseline prediction and actual measurement, and extracting abnormal temperature rise components to determine the number of fault embryos; constructing local candidate regions to extract thermal evolution coupling features, generating local thermal instability judgment indicators, and identifying abnormal temperature rise self-activation threshold kernels; generating dynamic temperature rise diagnosis results and outputting corresponding alarm information based on the execution mechanism and evolution judgment of abnormal temperature rise self-activation threshold kernels. This invention achieves early and accurate diagnosis and forward alarm of abnormal temperature rise in high-voltage switchgear through thermal potential constraint modeling and improved SOFTS fusion analysis.
Owner:FUJIAN YIDAKE ELECTRIC CO LTD

A method for encapsulating and molding inorganic solid-liquid phase change materials

PendingCN122080864AStable formreduce subcoolingSolar heating energySolar heat storageAdhesive cementThermal instability
This invention discloses an encapsulation and molding technology for inorganic solid-liquid phase change materials. It enhances the photothermal conversion capability of inorganic hydrated salts through a two-stage encapsulation and molding process using a porous support material at the micro-pore stage, followed by shaping and a two-stage macro-encapsulation and molding process using commercial sealant and carbon materials. This two-stage encapsulation method plays a crucial role in maintaining the shape stability of the inorganic hydrated salt phase change material, resulting in a composite phase change material with a certain photothermal conversion capability. This multi-stage encapsulation and molding method is very simple, using low-cost porous matrix and commercial adhesives. It is highly effective in solving the problems of liquid leakage and thermal instability in inorganic hydrated salt phase change materials and can be extended to the multi-stage encapsulation and molding of other inorganic hydrated salt phase change materials. This simple, inexpensive, and efficient method will facilitate the application of inorganic hydrated salt phase change materials in practical applications.
Owner:DALIAN INSTITUTE OF CHEMICAL PHYSICS CHINESE ACADEMY OF SCIENCES

A welding positioning tool applied to sheet metal parts of engineering machinery

The application discloses a welding positioning tool applied to sheet metal parts of engineering machinery, and belongs to the technical field of welding, which comprises a measurement comparison module, a prediction and distribution clamping force module, a clamping execution mechanism, a load sensor and a cooperative compensation controller. The tool extracts the spatial posture deviation and the non-rigid deformation force characteristics of the workpiece, combines the thermal expansion and material phase change characteristics, calculates and dynamically distributes the clamping force for constraining the thermal instability of the workpiece. During the welding process, the load sensor is used to monitor the load fluctuation of each clamping point in real time, the cooperative compensation controller synchronously adjusts the output force of the clamping mechanism according to the load fluctuation, and the spatial motion posture of the welding end is corrected, so that the thermal deformation displacement of the workpiece is effectively offset.
Owner:HUZHOU WEIZONG PRECISION ELECTROMECHANICAL TECH CO LTD

A cable conduit burial structure

ActiveCN224438513Uincrease humidityprevent thermal instabilityThermal instabilitySoil science
This utility model relates to a cable conduit burial structure in the field of cable conduit laying. It includes two sets of positioning pipes respectively fitted onto both ends of the cable conduit. Each positioning pipe includes two mounting pipes symmetrically distributed and fixedly connected by bolts. A sealing ring is fixedly connected inside each mounting pipe, and an insert pipe is fixedly connected to the outer surface of each mounting pipe. A collection hopper is fixedly connected to the end of the insert pipe furthest from the mounting pipe, and a filter screen is fixedly connected inside the collection hopper. Two irrigation components are provided between the two sets of positioning pipes. Rainwater is collected during rainy weather via the collection hopper and insert pipe, allowing it to be stored in the mounting pipes and the collection pipe. When the soil around the cable conduit is relatively dry, the collected rainwater can be used for drip irrigation of the surrounding soil, effectively increasing soil moisture, preventing soil thermal instability, and improving the power supply reliability of the power system.
Owner:SUZHOU DINGXIN COLD & HEAT SHRINKABLE MATERIAL CO LTD

A method and apparatus for measuring test conditions of semiconductor devices

PendingCN122085201AAvoid thermal instability electrical stress rangeavoid failureIndividual semiconductor device testingThermal instabilityHeat flow
This invention discloses a method and apparatus for measuring test conditions of semiconductor devices, relating to the field of semiconductor device testing technology. Addressing problems such as understress testing, overstress failure, and fatigue failure in existing technologies, it employs a measurement device capable of independently powering the main circuit and control circuit of the device under test (DUT) and outputting electrical stress over a wide range. Test conditions are accurately extracted by characterizing the thermal properties of the DUT in the same heat flow mode as the specified test items. This avoids interference between the main circuit and control circuit, bypasses the thermal instability electrical stress range of the DUT, and prevents thermal instability failure, thus improving stability and accuracy. It effectively avoids understress testing, overstress failure, and fatigue failure, improving the reliability of semiconductor devices.
Owner:JINAN SHANGTAI OPTOELECTRONICS TECHNOLOGY CO LTD

A method and system for tread rubber heat destabilization wear amplification and crack propagation risk assessment

PendingCN122348018AThermal instabilityThermodynamics
The present application relates to the technical field of tire rubber performance prediction, and particularly relates to a tread rubber thermal instability wear amplification and crack propagation risk assessment method and system. The method collects the tread surface temperature curve under high slip conditions, calculates the temperature rise rate, and combines the high slip friction relative coefficient across the temperature zone, the energy normalized wear coefficient, and the crack propagation rate under the high temperature reference tear energy to construct a coupling risk index, thereby realizing comprehensive evaluation, graded early warning, and dominant failure cause of the tread rubber thermal instability wear amplification and crack propagation risk. The present application can quickly identify the potential abnormal wear and crack propagation risk of the new energy vehicle tire tread rubber under high torque acceleration, braking, and congestion conditions in a short period in the laboratory, and is suitable for formula screening, material substitution, mass production change verification, and failure analysis.
Owner:ZHONGCE RUBBER GRP CO LTD +1

A method for reducing pit defects on the surface of a silicon carbide epitaxial layer

The application discloses a growth method for reducing pit defects on a silicon carbide epitaxial surface, and after epitaxial growth is completed, the flow of gas floating of a base is increased, the temperature in a reaction chamber is increased, the pressure in the reaction chamber is reduced, and the flow of hydrogen is increased, and then an etching stage is entered; in the etching stage, hydrogen chloride gas is continuously fed, including at least one feeding period and a pause period after the feeding period; by using the thermal instability of SiC at high temperature / low pressure, H2 / HCl is used to cooperatively etch the system to realize efficient decomposition, the etching rate is increased, the generation of sub-damage and dislocation is reduced, the thickness of the removed epitaxial layer can be accurately controlled, the pit defects on the surface of the epitaxial layer are reduced, and the crystallization quality of the epitaxial layer is maintained, so that the preparation requirements of subsequent power devices are met.
Owner:EPIWORLD INT

Silica sol and aluminum titanate based castable, preparation method and application thereof

ActiveCN121181341BCarbide siliconThermal instability
The application discloses a functional adjustment type heat shock resistant alkali resistant castable based on silica sol and aluminum titanate and a preparation method and application thereof. The castable comprises 50-60% mullite, 10-13% silicon carbide, 8-10% micro powder of microcline, 0.5-1.5% boron nitride nanosheet, 1-3% rare earth oxide, 10-14% silica sol (dry base), 8-12% functional regulator (containing metakaolin and aluminum titanate) and 0.1-0.3% dispersant. The application breaks through the technical prejudice of "thermal instability" of aluminum titanate, realizes multiphase synergistic reinforcement, and is suitable for high damage areas such as a cement rotary kiln mouth and a coal injection pipe.
Owner:HUZHOU CHANGXING XINGYING NEW TYPE REFRACTORY CONSTR MATERIALS CO LTD

A high-power piezoelectric ceramic, a preparation method and application thereof

PendingCN122355705AThermal instabilityCeramic
This application discloses a high-power piezoelectric ceramic, its preparation method, and its applications, relating to the field of piezoelectric ceramic technology. The high-power piezoelectric ceramic provided in this application achieves advantages such as synergistic control of soft and hard properties, dense and uniform microstructure, and low loss and high stability under strong fields. Simultaneously, it avoids the problems of traditional technologies, such as the mutual constraint between piezoelectric activity and mechanical quality factor, insufficient powder activity leading to poor sintering densification, and thermal instability and rapid performance degradation under strong fields. It can adapt to the application requirements of various fields for high electromechanical conversion efficiency, low energy dissipation, high service reliability, and long-term stable operation under extreme conditions.
Owner:POWERCHINA HUADONG ENG CORP LTD +1