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307results about How to "Reduce temperature changes" patented technology

Power saving automatic zoned dryer apparatus and method

A computer controlled power saving automatic zoned dryer for a printing press has a dryer head facing the substrate travel path, having a multiplicity of IR lamps connected individually or in groups to form a plurality of heating zones running longitudinally and each extending laterally side by side across the substrate travel path. The radiant heat output of each heating zone is controlled separately by means of a control unit connected to a power supply. The control unit individually regulates output of the heating zones. Unneeded zones are turned off to reduce cost of power and conserve energy. A plurality of heat sensors spaced laterally across the substrate path measure the surface temperature of substrate heated areas corresponding to the heating zones being operated and maintain an automatic set point temperature. The temperature of each individual heated area can be regulated automatically by adjusting the output of its heating zone whereby printed substrates having a more even temperature profile are delivered. In an alternate manual mode any zone can be set independently to operate at any percentage of full available power from zero to 100%. Separate high velocity air scrubbers and additional air extraction are used to enhance the total drying effect of the zoned dryer assembly.
Owner:PRINTING RES

Electrically operated viscous fluid dispensing apparatus and method

InactiveUS6318599B2Improved and more consistent dispensingNarrow downTemperatue controlPretreated surfacesEngineeringElectromagnetic field
An electrically operated fluid dispenser for dispensing a pattern of viscous fluid onto a substrate during a run mode. The dispenser is turned off and does not dispense the viscous fluid during a standby mode of operation. The dispenser includes a dispenser body having an outlet and an armature disposed in the dispenser body for movement between an opened position allowing a fluid flow from the outlet and a closed position preventing the fluid flow from the outlet. A coil is mounted adjacent the armature and selectively generates an electromagnetic field for moving the armature between the opened and closed positions. A controller includes different apparatus and methods for using the coil as a heater as well as providing other heat transfer devices on the dispensing valve to maintain a constant temperature either, during only the run mode or, during both, the run and the standby modes. The above dispensing valve heating control facilitates a design of an electrically operated fluid dispenser having a body with a fluid passage intersecting first and second sides of the body and a dispensing outlet in fluid communication with the fluid passage. The dispenser includes a heater and has feed member mounted to the first side of the body with one end of the fluid passage in the feed plate fluidly connecting with one end of the fluid passage in the dispenser body. The dispenser also has an cap mounted to the second side of the dispenser body to terminate the fluid passage on the second side of the dispenser body.
Owner:NORDSON CORP

Cooling system for pulsed power electronics

The invention discloses an apparatus for reducing peak temperatures and thermal excursions, of semiconductor devices, particularly in pulsed power applications. The apparatus comprises thermally coupling Phase Change Material (PCM) to the dissipating semiconductor device. PCM absorbs heat and stays at a constant temperature during its phase change from solid to liquid. The PCM melting point is chosen so that it is just below the temperature the device would otherwise achieve. When the device approaches the maximum temperature, the PCM melts, drawing heat from the device and lowering the device's peak temperature. As the device stops dissipating, after its pulse period, the PCM material solidifies releasing the heat it absorbed. The apparatus lowers the peak temperature by absorbing heat when the device is dissipating. The apparatus also keeps the semiconductor device from cooling off as much as it would cool without the apparatus, as the PCM material releases heat during the part of the cycle when it is re-solidifying, i.e. when the pulse power is off. By lowering the peak temperature the device achieves, and increasing the temperature of the device when it is in the off portion of its pulsed power cycle the temperature excursions of the device during operation are reduced. By reducing the temperature swings, that the device sees during operation, the thermal stress is reduced and the reliability of the device is improved.
Owner:SKYWORKS SOLUTIONS INC
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