309results about How to "Reduce temperature changes" patented technology

The invention relates generally to semiconductor fabrication technology and, more particularly, to chemical vapor deposition (CVD) processing and associated apparatus for addressing temperature non-uniformities on semiconductor wafer surfaces. Embodiments include a wafer carrier for use in a system for growing epitaxial layers on one or more wafers by CVD, the wafer carrier comprising a top plate and base plate which function coordinately to reduce temperature variability caused during CVD processing.

A lamp comprising a solid state light emitter, the lamp being an A lamp and providing a wall plug efficiency of at least 90 lumens per watt. Also, a lamp comprising a solid state light emitter and a power supply, the emitter being mounted on a heat dissipation element, the dissipation element being spaced from the power supply. Also, a lamp, comprising a solid state light emitter and a heat dissipation element that has a heat dissipation chamber, whereby an ambient medium can enter the chamber, pass through the chamber, and exit. Also, a lamp, comprising a light emissive housing at least one solid state lighting emitter and a first heat dissipation element. Also, a lamp comprising a heat sink comprising a heat dissipation chamber. Also, a lamp comprising first and second heat dissipation elements. Also, a lamp comprising means for creating flow of ambient fluid.

A substrate retaining apparatus, a load lock assembly comprising the substrate retaining apparatus, and a system including the substrate retaining apparatus are disclosed. The substrate retaining apparatus can include at least one sidewall and one or more heat shields. One or more of the at least one sidewall can include a cooling fluid conduit to facilitate cooling of substrates retained by the substrate retaining apparatus. Additionally or alternatively, one or more of the at least one sidewall can include a gas conduit to provide gas to a surface of a retained substrate.

Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, a shielding mesh of at least two reference voltages (e.g., power and ground) is used to reduce both the capacitive coupling and the inductive coupling in routed signal wires in IC chips. In some embodiments, a type of shielding mesh (e.g., a shielding mesh with a window surrounded by a power ring, or a window with a parser set of shielding wires) is selected to make more routing area available in locally congested areas. In other embodiments, the shielding mesh is used to create or add bypass capacitance. Other embodiments are also disclosed.

In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures.

A lamp comprising a solid state light emitter, the lamp being an A lamp and providing a wall plug efficiency of at least 90 lumens per watt. Also, a lamp comprising a solid state light emitter and a power supply, the emitter being mounted on a heat dissipation element, the dissipation element being spaced from the power supply. Also, a lamp, comprising a solid state light emitter and a heat dissipation element that has a heat dissipation chamber, whereby an ambient medium can enter the chamber, pass through the chamber, and exit. Also, a lamp, comprising a light emissive housing at least one solid state lighting emitter and a first heat dissipation element.

Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air.

A lighting device comprising at least a first light emitter, at least a first heat transfer element, and a plurality of heat dissipation elements. Each heat dissipation element has at least a first region and a second region, the first region being in contact with the first heat transfer element, the second region being closer to the first light emitter than the first region. The first light emitter is thermally coupled to the first heat transfer element.

Disclosed is a polyimide coated shape memory material suitable for thermomechanical treatment to shape-set the material into the desired configuration and activate shape memory properties. The polyimide coating is subjected to a curing regime that imparts higher heat resistance in the polyimide coating to withstand the elevated temperatures required during the shape-setting treatment.

A computer controlled power saving automatic zoned dryer for a printing press has a dryer head facing the substrate travel path, having a multiplicity of IR lamps connected individually or in groups to form a plurality of heating zones running longitudinally and each extending laterally side by side across the substrate travel path. The radiant heat output of each heating zone is controlled separately by means of a control unit connected to a power supply. The control unit individually regulates output of the heating zones. Unneeded zones are turned off to reduce cost of power and conserve energy. A plurality of heat sensors spaced laterally across the substrate path measure the surface temperature of substrate heated areas corresponding to the heating zones being operated and maintain an automatic set point temperature. The temperature of each individual heated area can be regulated automatically by adjusting the output of its heating zone whereby printed substrates having a more even temperature profile are delivered. In an alternate manual mode any zone can be set independently to operate at any percentage of full available power from zero to 100%. Separate high velocity air scrubbers and additional air extraction are used to enhance the total drying effect of the zoned dryer assembly.

An electric motor control apparatus of this invention estimates changes in temperature of a semiconductor device to compute temperature change amplitude 108 based on an output current signal 105 computed from a current flowing through the semiconductor device of a switching circuit 5, an operating frequency signal and a carrier frequency signal by a temperature change estimation part 11, and makes conversion into the number of power cycles 110 corresponding to the temperature change amplitude 108 from power cycle curve data stored in a power cycle curve data storage part 14 and computes a thermal stress signal 111 by a thermal stress computation part 13, and does life estimation of the semiconductor device based on the thermal stress signal 111 and produces an output to a display part 16 as a life estimation result signal 112 by a life estimation part 15a.

In a laser array unit in which a plurality of laser beams emitted from a laser array is received by a lens array, the lens holder for fixedly bonding the lens array is formed such that the length of the surface on which the lens array is bonded in the direction orthogonal to the optical axis direction of the lens is longer than the length of the surface to be bonded to a certain other fixing member in the same direction.

A warming pack includes a container in the form of a pack, pouch, or bag in which reactants for an exothermic chemical reaction are distributed in one or more flexible matrixes that prevent them from shifting. The rate of the reaction is controlled and the reaction is thermally buffered in order that heat be produced at a constant rate.

An electrically operated fluid dispenser for dispensing a pattern of viscous fluid onto a substrate during a run mode. The dispenser is turned off and does not dispense the viscous fluid during a standby mode of operation. The dispenser includes a dispenser body having an outlet and an armature disposed in the dispenser body for movement between an opened position allowing a fluid flow from the outlet and a closed position preventing the fluid flow from the outlet. A coil is mounted adjacent the armature and selectively generates an electromagnetic field for moving the armature between the opened and closed positions. A controller includes different apparatus and methods for using the coil as a heater as well as providing other heat transfer devices on the dispensing valve to maintain a constant temperature either, during only the run mode or, during both, the run and the standby modes. The above dispensing valve heating control facilitates a design of an electrically operated fluid dispenser having a body with a fluid passage intersecting first and second sides of the body and a dispensing outlet in fluid communication with the fluid passage. The dispenser includes a heater and has feed member mounted to the first side of the body with one end of the fluid passage in the feed plate fluidly connecting with one end of the fluid passage in the dispenser body. The dispenser also has an cap mounted to the second side of the dispenser body to terminate the fluid passage on the second side of the dispenser body.

A combination high visibility safety vest and hydration bladder system includes a vest having a pouch along its back side capable or receiving and holding a bladder portion of the hydration bladder system. The pouch includes raised inserts along its exterior to raise portions of the pouch away from the user's back. The vest also includes a background material made of a daytime-visible fluorescent color and nighttime and light reflective material positioned thereon to increase the visibility of the user to others. The vest includes tear-away straps and seams to increase the safety of the user if the vest is entangled. The hydration bladder system includes a bladder that can be filled with fluid in an insulated pouch. The hydration bladder system provides hydration to the user by way of tubing coupled on one end to the bladder and on the other end to a mouthpiece.

In order to give excellent hermeticity in a broad temperature range to an electrochemical device, a sealant comprising a rubber component and a tackifier is used, the rubber component comprising at least one of butyl rubber and polyisobutylene rubber, the tackifier comprising at least one selected from the group consisting of a terpene resin, an aliphatic petroleum resin and an alicyclic petroleum resin.

An ultrasonic probe comprises a transducer part, a heat-receiving part, a refrigeration unit and a cable unit. The cable unit includes a signal line, a refrigerant supply tube, a refrigerant ejection tube and a heat insulator. The heat-receiving part absorbs heat generated from the transducer part. The refrigerant supply tube supplies a refrigerant from the refrigeration unit to the heat-receiving part. The refrigerant ejection tube sends the refrigerant for ejecting heat of the heat-receiving part to the refrigeration unit. The heat insulator is arranged around the refrigerant supply tube. A set of the refrigerant supply tube, the refrigerant ejection tube and the heat insulator is arranged at a center of the cable unit substantially while the signal line is arranged around at least one of the refrigerant supply tube, the refrigerant ejection tube and the heat insulator.

Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

The present invention relates to a closure system including a thermochromic tamper-control means of color that is irreversibly modified in the event of the temperature of the closure system being raised above a threshold temperature, said closure system comprising a polymer matrix having incorporated therein at least one thermochromic pigment of color that is irreversibly modified after said closure system has been exposed to a temperature close to or above a threshold temperature. The invention also relates to a method of preparing a thermochromic closure system, and to receptacles provided with said system.

The invention discloses an apparatus for reducing peak temperatures and thermal excursions, of semiconductor devices, particularly in pulsed power applications. The apparatus comprises thermally coupling Phase Change Material (PCM) to the dissipating semiconductor device. PCM absorbs heat and stays at a constant temperature during its phase change from solid to liquid. The PCM melting point is chosen so that it is just below the temperature the device would otherwise achieve. When the device approaches the maximum temperature, the PCM melts, drawing heat from the device and lowering the device's peak temperature. As the device stops dissipating, after its pulse period, the PCM material solidifies releasing the heat it absorbed. The apparatus lowers the peak temperature by absorbing heat when the device is dissipating. The apparatus also keeps the semiconductor device from cooling off as much as it would cool without the apparatus, as the PCM material releases heat during the part of the cycle when it is re-solidifying, i.e. when the pulse power is off. By lowering the peak temperature the device achieves, and increasing the temperature of the device when it is in the off portion of its pulsed power cycle the temperature excursions of the device during operation are reduced. By reducing the temperature swings, that the device sees during operation, the thermal stress is reduced and the reliability of the device is improved.

A lamp comprising a solid state light emitter, the lamp being an A lamp and providing a wall plug efficiency of at least 90 lumens per watt. Also, a lamp comprising a solid state light emitter and a power supply, the emitter being mounted on a heat dissipation element, the dissipation element being spaced from the power supply. Also, a lamp, comprising a solid state light emitter and a heat dissipation element that has a heat dissipation chamber, whereby an ambient medium can enter the chamber, pass through the chamber, and exit. Also, a lamp, comprising a light emissive housing at least one solid state lighting emitter and a first heat dissipation element.

A cooling system and method that significantly improves spray evaporative cooling by using a mixture of cooling fluids having different boiling points. The cooling fluid mixture is sprayed onto a surface to be cooled. Efficient cooling with reduced cooling fluid volume is provided by both evaporation of the more volatile component of the mixture as well as heating of the less volatile component which remains in contact with the surface being cooled. More uniform temperatures across the surface being cooled and a reduced risk of potentially damaging critical heat flux is achieved.

A gas turbine includes a plurality of combustion chambers; at least one fuel nozzle for each of the combustion chambers; at least one fuel line for each fuel nozzle in each of the combustion chambers; at least one heat exchanger for each fuel line configured to adjust a temperature of a fuel flow to each fuel nozzle; and a controller configured to control each of the heat exchangers to reduce temperature variations amongst the combustion chambers.

A processing block 2 is composed of a base 5, where an upper substrate 6 formed with a metal material M and a lower substrate 7 formed with the metal material M or a ceramic material E are adhered, and cells C . . . supported by this base 5; and the cells C . . . are secured to the upper substrate 6 and / or the lower substrate 7 at least via cell positioners 6s . . . established in the upper substrate 6 for positioning the cells C . . . , respectively. At the same time, at least the thickness Ld of regions Xc . . . situated under the cells C . . . in the lower substrate 7 is selected to be 1.0 [mm] or thinner, and, a thermo-module(s) comes into contact with the lower surface of the base 5.

A salicide process is conducted to a thin film integrated circuit without worrying about damages to a glass substrate, and thus, high-speed operation of a circuit can be achieved. A base metal film, an oxide and a base insulating film are formed over a glass substrate. A TFT having a sidewall is formed over the base insulating film, and a metal film is formed to cover the TFT. Annealing is conducted by RTA or the like at such a temperature that does not cause shrinkage of the substrate, and a high-resistant metal silicide layer is formed in source and drain regions. After removing an unreacted metal film, laser irradiation is conducted for the second annealing; therefore a silicide reaction proceeds and the high-resistant metal silicide layer becomes a low-resistant metal silicide layer. In the second annealing, a base metal film absorbs and accumulates heat of the laser irradiation, and a semiconductor layer is supplied with heat of the base metal film in addition to heat of the laser irradiation, thereby enhancing efficiency of the silicide reaction in the source and drain regions.

A measuring machine having a base (10), a touch signal probe (P), a moving mechanism (20) for retaining the touch signal probe (P) movably in three-dimensional directions, and a controller (60) for controlling a movement of the moving mechanism (20) and for acquiring coordinates value of respective axes based on a contact signal from the touch signal probe (P) to measure a dimension etc. of a workpiece based on the coordinates value is provided. Main structural members structuring the moving mechanism (20), more specifically, a column (21), a supporter (22), a X-beam (23), a Z-axis structure (25) and a Z-axis spindle (26) are made of aluminum or aluminum alloy including aluminum as main component, which has large thermal conductivity, thereby making temperature distribution uniform to improve geometrical accuracy.

The present invention provides an optical device which comprises a light guide incorporating a Bragg grating. The apparatus also comprises a moveable wall portion which is coupled to the Bragg grating so that a movement of the wall portion causes a force that effects a change in strain of the Bragg grating and thereby effects a change in an optical period of the Bragg grating. A temperature related change in the optical period of the Bragg grating is reduced by a temperature related change in the force on the Bragg grating by the moveable wall portion.

In a lens system for focusing a divergent beam in a small spot and comprising a collimator lens and an objective lens, the collimator lens is composed of a positive plastics lens element and a negative glass lens element. This collimator corrects the temperature-dependent spherical aberration of the objective lens. This lens system is very suitable for a scanning device and an apparatus for reading / writing high-density optical discs.