552results about How to "Sharp contrast" patented technology

In a method for manufacturing semiconductor devices and other finely structured parts, a projection objective (5) is used in order to project the image of a pattern arranged in the object plane of the projection objective onto a photosensitive substrate which is arranged in the region of the image plane (12) of the projection objective. In this case, there is set between an exit surface (15), assigned to the projection objective, for exposing light and an incoupling surface (11), assigned to the substrate, for exposing light a small finite working distance (16) which is at least temporarily smaller in size and exposure time interval than a maximum extent of an optical near field of the light emerging from the exit surface. As a result, projection objectives with very high numerical apertures in the region of NA>0.8 or more can be rendered useful for contactless projection lithography.

Prostate-specific membrane antigen (PSMA) binding compounds having radioisotope substituents are described, as well as chemical precursors thereof. Compounds include pyridine containing compounds, compounds having phenylhydrazine structures, and acylated lysine compounds. The compounds allow ready incorporation of radionuclides for single photon emission computed tomography (SPECT) and positron emission tomography (PET) for imaging, for example, prostate cancer cells and angiogenesis.

The present invention relates to an imaging device designed with the intent of visualizing subcutaneous structures within an organism. Visualization of subcutaneous structures will increase the speed and accuracy with which medical treatments requiring insertion of instruments into these structures can be performed. Especially fluid insertions into or extractions from an organism will be facilitated as the device is adapted to be placed upon the organism in a manner giving continued full mobility for the recipient and operator of the device.

For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.