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9504results about "Thermometer applications" patented technology

Time-temperature indicator device and method of manufacture

A time-temperature indicator label for measuring the length of time to which a product has been exposed to a temperature above a pre-determined temperature is provided. The period of time of exposure is integrated with the temperature to which the indicator is exposed. The label is a composite of a plurality of layers adapted to be adhered at its underside to a product container. The label includes a printable surface layer, a longitudinal wicking strip that is adhered underneath the surface layer substantially at the opposite extremities only of the wicking strip and a lower substrate layer forming an envelope with said surface layer. A heat-fusible substance, which melts and flows above a pre-determined temperature, is applied on the surface of the wicking strip contiguous to at least one of the ends of the wicking member. When the heat-fusible substance is exposed to a temperature above the pre-determined temperature, the heat-fusible substance flows along the length of the wicking member. The label has a printable surface layer and is sealed at its peripheral edge to the peripheral edge of the substrate layer. These layers encapsulate the wicking member and the heat-fusible substance. The surface layer is provided with a sight window at an intermediate location over the wicking member through which the progress of flow on the wicking member is observed.
Owner:TEMPTIME CORP

Reactor and method of processing a semiconductor substrate

A reactor for processing a substrate includes a first housing defining a processing chamber and supporting a light source and a second housing rotatably supported in the first housing and adapted to rotatably support the substrate in the processing chamber. A heater for heating the substrate is supported by the first housing and is enclosed in the second housing. The reactor further includes at least one gas injector for injecting at least one gas into the processing chamber onto a discrete area of the substrate and a photon density sensor extending into the first housing for measuring the temperature of the substrate. The photon density sensor is adapted to move between a first position wherein the photon density sensor is directed to the light source and a second position wherein the photon density sensor is positioned for directing toward the substrate. Preferably, the communication cables comprise optical communication cables, for example sapphire or quartz communication cables. A method of processing a semiconductor substrate includes supporting the substrate in a sealed processing chamber. The substrate is rotated and heated in the processing chamber in which at least one reactant gas is injected. A photon density sensor for measuring the temperature of the substrate is positioned in the processing chamber and is first directed to a light, which is provided in the chamber for measuring the incident photon density from the light and then repositioned to direct the photon density sensor to the substrate to measure the reflection of the light off the substrate. The incident photon density is compared to the reflected light to calculate the substrate temperature.
Owner:KOKUSAI SEMICON EQUIP CORP

Apparatus and method for monitoring and displaying power usage

InactiveUS20060123807A1Cost of power consumptionMechanical apparatusTariff metering apparatusPower usageEngineering
A method and system to monitor and determine energy consumption and energy efficiency of devices that use electrical and/or gas power is described. In one embodiment, a power monitoring system is configured to monitor electrical and/or gas power consumption of devices such as refrigerators, air-conditioners, washers, dryers, hot tubs, etc. Power consumption of the device is processed by the power monitoring system to determine the amount of power the device is consuming and the device's energy efficiency. In one embodiment, the power monitoring system transmits data associated with the device's power consumption, such as power efficiency, power cost, power usage, etc., to the device user and/or to a power supplier such as a utility company supplying the gas and/or electricity to the device. In one configuration, when the power efficiency of the device exceeds a predefined threshold, the user and/or power supplier is notified. The power monitoring system may be configured to be integral with and/or attached to the device being measured. The power monitoring system may provide an output on a display apparatus associated with the power monitoring system attached to the device being monitored and/or the output may be part of a graphics display on a computer monitor, for example.
Owner:SULLIVAN C BRET +1
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