Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

145results about "Vacuum gauge using heat conductivity variation" patented technology

Vacuum gauge calibration apparatus capable of calibrating and testing without displacement and operating method thereof

The present invention provides a vacuum gauge calibration apparatus capable of calibrating and testing a vacuum gauge without displacement or separation of the vacuum gauge, the vacuum gauge being attached to a vacuum device under operation together with developing a movable vacuum gauge calibration device, and an operating method thereof. According to the present invention, there is provided an apparatus for calibrating and testing a vacuum gauge to be calibrated without displacement, the vacuum gauge being connected to a vacuum device, the apparatus comprising: a vacuum shut-off valve for opening and closing a piping for connecting the vacuum device to the to-be-calibrated vacuum gauge; and a movable vacuum gauge calibration device connected to the to-be-calibrated vacuum gauge, wherein the movable vacuum gauge calibration device includes: a reference vacuum gauge, a vacuum connection valve, a vacuum chamber, a gate valve, and an exhaust device which are connected to the to-be-calibrated vacuum gauge side in series; a gas supply source connected to the vacuum chamber for generating pressure in the vacuum chamber; a leak valve for controlling gas flow in the gas supply source and supplying the gas the vacuum chamber; and a vacuum gauge for the vacuum chamber for measuring vacuum pressure in the vacuum chamber.
Owner:KOREA RES INST OF STANDARDS & SCI

Three-dimensional vacuum sensor and manufacturing method thereof

ActiveCN102923644AMiniaturizationIncrease the upper limit of pressure measurementDecorative surface effectsSolid-state devicesHeat conductingEngineering
The invention provides a three-dimensional vacuum sensor and a manufacturing method of the three-dimensional vacuum sensor. A thermo-electric pile and a heater manufactured by adopting the method are located on different planes, and the thermo-electric pile is arranged on the heater, thus the miniaturization of the thermo-electric vacuum sensor can be further implemented. The shorter vertical distance between the micro heater to a substrate can be obtained by adopting a dry etching release structure through controlling the etching opening and the etching time, the pressure measurement upper limit of a heat conducting vacuum gauge can be improved, the problem of adhesion of a structural layer and the substrate can be avoided, and the rate of finished production of the devices can be improved. Due to the additional arrangement of a silicon cover plate, the thermal conductivity of the gas can be enhanced, and the sensitivity of the heat conducting vacuum gauge on the higher gas pressure end can be improved. In addition, the materials of the semiconductor substrate, the thermo-electric pile and the micro-heater and the preparation technology adopted in the invention are commonly used in the semiconductor process and can be easily compatible with the existing CMOS (complementary metal oxide semiconductor) process.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Method and apparatus for measuring pressure of a fluid medium and applications thereof

Method and apparatus for measuring the pressure of a fluid medium, by immersing within the fluid medium an electrical resistor having a resistance varying with temperature; applying electrical current through the electrical resistor to heat it to a predetermined temperature above that of the fluid medium; and measuring the rate of change in resistance of the electrical resistor to produce a measurement of the rate of thermal heat dissipation, varying with the density of the fluid medium in which the electrical resistor is immersed, and thereby a measurement of the pressure of the fluid medium. The electrical resistor is a positive temperature coefficient thermistor driven by a constant voltage source and having a resistance which increases sharply at the predetermined temperature, such that the thermistor is automatically self-controlled to substantially maintain the predetermined temperature, whereby the electrical current drawn by the thermistor is a measurement of the thermal load on the thermistor resulting from the thermal heat dissipation therefrom, and thereby a measurement of the pressure of the fluid medium. Many applications of such method and apparatus are described, including a vacuum gauge, a pressure gauge, a barometer, a Pitot tube type speedometer, and a helicopter blade leak detector.
Owner:A T C T ADVANCED THERMAL CHIP TECH

Determination of the gas pressure in an evacuated thermal insulating board (vacuum panel) by using a heat sink and test layer that are intergrated therein

The invention relates to the determination of the gas pressure in an evacuated thermal insulating board (9) having an insulating core (1) covered by a film (2). The inventive device comprises an assembly, which is integrated between the insulating core and the covering film of the thermal insulating board and which has a body that acts as a heat sink (3) (Al, Co, Fe, ceramic), and the body's thermal conductivity and thermal capacity relative to volume are greater than those of the insulating core. Said assembly also comprises a test layer (4) (0.3 mm nonwoven fabric made of plastic and glass fibers), which is arranged between the heat sink and the covering film and has a defined thermal conductivity that changes according to the gas pressure inside the evacuated thermal insulating board. From the exterior, a sensor device is applied to or pressed against the test device, which is placed inside the evacuated thermal insulating board and which is covered by the covering film. Said sensor device comprises a body (5) (coppered steel 78° C., thermoelement (6)) having a distinctly different temperature than that of the test device (heat sink) whereby creating a heat flux, which is influenced by the thermal conductivity of the test layer, said thermal conductivity varying according to the gas pressure inside the thermal insulating board, and the magnitude of this heat flux is metrologically determined. The heat sink (3) can be provided in the form of a bottom part of a container for a getter material.
Owner:VA Q TEC AG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products