Manufacturing all-
silicon force sensors, such as capacitive pressure sensors (100, 200) that have long term stability and good linear sensitivity, and can be built into of a pneumatic tire. The sensors include buried electrical
feedthrough (112b) to provide an
electrical connection into a sealed
silicon cavity (108). The buried
feedthrough consists of a conductor (112b) in a shallow groove (106) in a substrate (102), communicating between the sensing cavity (108) and an external contact area (110). The sensor designs also feature a method for forming a
silicon-to-silicon fusion bond (SFB) wherein at least one of the two surfaces (152, 252) to be has a tough silicon surface unsuitable for good SFB joints because it was bonded heavily
boron-doped by means of
diffusion. The method of this invention includes preparing each doped surface (152, 252) for SFB by
polishing the surface with a Chemical-Mechanical
Polishing (CMP) process. The sensor designs can also include optional reference capacitors (141, 241) on the same
chip (100, 200) as the sensing
capacitor (140, 240). The reference capacitors (141, 241) are insensitive to pressure (force), but respond to ambient temperature changes in the same way as the sensing
capacitor. Suitable
external interface circuits can utilize the reference capacitors (141, 241) to pull out the majority of ambient temperature effects.