1378results about "Non-mechanically variable capacitors" patented technology

A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes fanning channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.

A method and apparatus for use in a digitally tuning a capacitor in an integrated circuit device is described. A Digitally Tuned Capacitor DTC is described which facilitates digitally controlling capacitance applied between a first and second terminal. In some embodiments, the first terminal comprises an FW+ terminal and the second terminal comprises an RF terminal. In accordance with some embodiments, the DTCs comprises a plurality of sub-circuits ordered in significance from least significant bit (LSB) to most significant bit (MSB) sub-circuits, wherein the plurality of significant bit sub-circuits are coupled together in parallel, and wherein each sub-circuit has a first node coupled to the first RF terminal, and a second node coupled to the second FW terminal. The DTCs further include an input means for receiving a digital control word, wherein the digital control word comprises bits that are similarly ordered in significance from an LSB to an MSB.

A fingerprint sensing system includes an image sensor, a rate sensor and a sensor circuit. The image sensor includes a linear array of capacitive sensors for capacitive sensing of ridge peaks and ridge valleys of a fingerprint on a swiped finger. The rate sensor senses the speed of the finger as it is swiped across the image sensor. The sensor circuit supplies image drive signals to the image sensor and detects image signals in response to the drive signals. The sensor circuit supplies rate drive signals to the rate sensor and detects rate signals in response to the rate drive signals. The sensor circuit further coordinates the image signals and the rate signals to provide a fingerprint image. The image sensor may be configured as an image pickup plate and multiple image drive plates formed on a substrate, such as a flexible printed circuit board or other flexible substrate which may conform to the shape of the finger.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

A capacitive touch panel and a display device using the capacitive touch panel are provided. The capacitive touch panel includes a first electrode layer, a second electrode layer, and a dielectric layer disposed between two layers. The first electrode layer has a plurality of first A electrode strings and first B electrode strings extended along a first direction. The first A electrode string and the first B electrode string respectively has a plurality of first direction electrodes. The second electrode layer has a plurality of second direction electrodes connected in series along a second direction. The first A and B electrode strings are disconnected in the first electrode layer while they are simultaneously detected for presence of signal variation.

Concentric tilted double-helix magnets, which embody a simplified design and construction method for production of magnets with very pure field content, are disclosed. The disclosed embodiment of the concentric tilted double-helix dipole magnet has the field quality required for use in accelerator beam steering applications, i.e., higher-order multipoles are reduced to a negligibly small level. Magnets with higher multipole fields can be obtained by using a simple modification of the coil winding procedure. The double-helix coil design is well-suited for winding with superconducting cable or cable-in-conduit conductors and thus is useful for applications that require fields in excess of 2 T. The coil configuration has significant advantages over conventional racetrack coils for accelerators, electrical machinery, and magneto-hydrodynamic thrusting devices.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

The disclosed pressure transducer assembly includes a housing, a pressure sensor disposed within the housing, a coupling establishing a sealed pathway between the housing and an external source of gas or fluid, and a deposition trap disposed in the pathway. The deposition trap provides a plurality of channels, each of the channels being narrower than the pathway.

A high energy density, high power density capacitor having an energy density of at least about 0.5 J/cm3 is provided. The capacitor comprises a plurality of interleaved metal electrode layers separated by a polymer layer. The interleaved metal electrode layers terminate at opposite ends in a solder termination strip. The high energy density aspect of the capacitors of the invention is achieved by at least one of the following features: (a) the dielectric thickness between the interleaved metal electrode layers is a maximum of about 5 mu m; (b) the polymer is designed with a high dielectric constant kappa of at least about 3.5; (c) the metal electrode layers within the polymer layer are recessed along edges orthogonal to the solder termination strips to prevent arcing between the metal electrode layers at the edges; and (d) the resistivity of the metal electrode layers is within the range of about 10 to 500 ohms per square, or a corresponding thickness of about 200 to 30 ANGSTROM .

A microwave tunable filter having some advantages as follows: a) the integration of MEMS tunable filter and MMIC; b) the very low signal transmission loss and low dispersion; and c) the drastic variation and linear characteristic of frequency by means of MEMS capacitor and an external control signal. The microwave tunable MEMS filter includes a plurality of unit resonant cells, each unit resonant cell being formed by various serial and parallel combination of an inductor, a capacitor, a transmission line, and a variable MEMS capacitor, whereby capacitance variation of the variable MEMS capacitor in the unit resonant cell converts a resonant frequency of the unit resonant cell to thereby convert a center frequency of the filter.

A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.

A micromachined sensor and a process for fabrication and vertical integration of a sensor and circuitry at wafer-level. The process entails processing a first wafer to incompletely define a sensing structure in a first surface thereof, processing a second wafer to define circuitry on a surface thereof, bonding the first and second wafers together, and then etching the first wafer to complete the sensing structure, including the release of a member relative to the second wafer. The first wafer is preferably a silicon-on-insulator (SOI) wafer, and the sensing structure preferably includes a member containing conductive and insulator layers of the SOI wafer. Sets of capacitively coupled elements are preferably formed from a first of the conductive layers to define a symmetric capacitive full-bridge structure.

High-temperature, multiple-layer polymer (MLP) capacitors with a stacked electrode arrangement are disclosed. The capacitor electrodes are separated by a polymer dielectric that is stable at high temperatures. In some embodiments, the polymer dielectric also has a high permittivity and is filled with high-permittivity nanoparticles, which enables the capacitor to achieve a very high capacitance density.

Particular aspects provide capacitors, and particularly ultracapacitors, comprising molecules suitable to substantially increasing the capacitance of the capacitor, and methods for making same Particular aspects provide ultracapacitors that include nanoparticles optionally coated with molecules, such as polymer electrolytes. Certain aspects provide an energy storage device or capacitor, comprising at least three layers sealed in a fluid-tight covering, wherein a first layer comprises at least one electrolytic polymer molecule of positive charge and at least one nanoparticle; a second dielectric layer comprising at least one insulative polymer; a third layer comprising at least one electrolytic polymer molecule of negative charge and at least one nanoparticle. In certain aspects, the electrolytic polymer of the first layer comprises at least one high charge density polymer electrolyte of positive charge, and wherein the electrolytic polymer of the third layer comprises at least one high charge density polymer electrolyte of negative charge.

Methodologies and structures are disclosed for providing multilayer electronic devices having low inductance and high ratings, such as for capacitor devices for uses involving faster pulsing and higher currents. Plural layer devices are constructed for relatively lowered inductance by relatively altering typical orientation of capacitors such that their electrodes are placed into a vertical position relative to an associated circuit board. Optionally, individual leads may be formed so that the resulting structure can be used as an array. Internal electrodes may be arranged for reducing current loops for associated circuits on a circuit board, to correspondingly reduce the associated inductance of the circuit board mounted device. Leads associated with such devices may have added tab-like structures which serve to more precisely place the lead, to improve the lead to capacitor strength, and to promote lower resistance and inductance. Disclosed designs for reducing associated inductance may be practiced in conjunction with various electric devices, including capacitors, resistors, inductors, or varistors.