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593results about "Fluid pressure measurement using piezo-electric devices" patented technology

Structure and method for packaging pressure sensor

The invention discloses a structure and method for packaging a pressure sensor, and belongs to the technical field of microelectronic packaging. The structure for packaging the pressure sensor comprises an upper cover board, a lower cover board and a pressure sensor chip. The lower cover board is provided with a first rectangular groove and a second rectangular groove. The bottom of the first rectangular groove is embedded in the second rectangular groove so that the first rectangular groove and the second rectangular groove can be communicated to form a two-stage cavity structure. Through holes penetrating through the lower cover board are formed in the bottom of the first rectangular groove. The upper surfaces and the lower surfaces of the through holes are connected with a bonding pad and a wiring layer respectively. Protrusions of the pressure sensor chip are connected with the through holes of the lower cover board. The upper cover board is provided with a third rectangular groove. The pressure sensor chip is located inside a space formed by connecting the upper cover board and the lower cover board. The invention further discloses the method for packaging the pressure sensor. By means of the system and method for packaging the pressure sensor, the capacity for resisting a severe environment, stress uniformity, the reliability and the accuracy of the pressure sensor chip are improved, and application demands of special environments with high temperature, high humidity and the like can be met.
Owner:NAT CENT FOR ADVANCED PACKAGING

Pressure sensor based on friction power generation and pressure sensing system

The invention discloses a pressure sensor based on friction power generation and a pressure sensing system. The pressure sensor based on friction power generation comprises a pressure bearing component, a first elastic base body, a first structural layer, a base and a second structural layer, wherein the first elastic base body is arranged on a first side surface of the pressure bearing component and is provided with a regular protruding structure, the first structural layer covers the first elastic base body and forms a corresponding structure matched with the protruding structure of the first elastic base body, and the second structural layer is arranged on a first side surface of the base. When pressure is acted on the pressure bearing component, the first elastic base body and the first structural layer deform so as to enable the contacting area of a friction interface to be increased along with the increase of pressure, and a corresponding relation between the contacting area and output signals is utilized to enable the output signals of a signal output end to represent the intensity of pressure. The pressure sensor based on friction power generation overcomes the defect that a traditional pressure sensor is easily interfered by static electricity and electromagnetism, and has the advantages of being high in accuracy, wide in measurement range and wide in application environment.
Owner:NEWNAGY TANGSHAN

Flexible wearable sensor and corresponding wearable device and preparation method thereof

The invention provides a flexible wearable sensor and a corresponding wearable device and preparation method thereof, wherein the flexible wearable sensor is small in size and high in flexible degreeand output capacity. The flexible wearable sensor comprises a first electrode layer, a piezoelectric layer, a second electrode layer, an interval layer, a friction layer and a third electrode layer which are arranged in sequence; a flexible mixed material at least constituted by a piezoelectric material and silicone rubber is contained in the piezoelectric layer, and the piezoelectric layer can generate a piezoelectric signal after being subjected to polarization treatment; a flexible mixed material at least constituted by silicone rubber is contained in the friction layer, a plurality of protrusion parts formed by a plurality of protrusion structures which are configured in an arrayed mode are formed on the opposite areas in the inner surface of the piezoelectric layer and the inner surface of the friction layer correspondingly, and the two inner surfaces are oppositely arranged; the outer surface and the inner surface of the piezoelectric layer are covered with the first electrode layer and the second electrode layer correspondingly; and the interval layer is provided with hollow parts opposite to the protrusion parts on the inner surface of the piezoelectric layer, and the outersurface of the friction layer is covered with the third electrode layer.
Owner:ZHONGBEI UNIV

Piezoelectric film type underwater explosion pressure sensor and measuring method thereof

The invention belongs to the field of underwater explosion measuring equipment, and particularly relates to a piezoelectric film type sensor used for underwater explosion pressure measurement and a measuring method thereof. According to the sensor, a sandwich type piezoelectric film pressure gage is placed in a hose filled with silicone oil, the two ends of the hose are sealed through plastic plugs, an extension leading wire is led out from a thin through hole of the upper plastic plug, and a flexible fine wire is wound on the outer wall face of the hose. The measuring method includes the steps that (1) the sensor is hung in the same horizontal line with an underwater explosion explosive cylinder through a counter weight, a resistor is connected to the sensor in parallel, a piezoelectric film and the resistor form a powered loop through an extension electrode leading wire, and an oscilloscope is arranged on the loop; (2) after explosives are ignited, voltage signals at the two ends of the resistor are recorded; (3) the quantity of electric charges of the piezoelectric film is obtained through calculation according to the voltage signals, and an explosive shock wave pressure numerical value is acquired through conversion. The piezoelectric film type sensor can be used for directly measuring the pressure change rate of underwater explosion, and is wide in pressure measuring range, convenient to process and low in cost.
Owner:UNIV OF SCI & TECH OF CHINA

Sonic surface wave pressure sensor using composite mold

The invention relates to a surface acoustic wave pressure sensor adopting a compound die, which pertains to the technical field of sensors and comprises a mushroom pressurization cap, a hard-core ball shell pressure guiding metal diaphragm, a metal force guiding column, an overvoltage protective device, a metal shell side wall, a force guiding ejector disk, a force guiding cylinder, a quartz cantilever beam sensitive element, a bottom case and an overvoltage protective device, wherein, the hard-core ball shell pressure guiding metal diaphragm, the metal shell side wall and the bottom case form an air-tight container; the upper surface of the hard-core ball shell pressure guiding metal diaphragm is connected with the mushroom pressurization cap by the metal force guiding column, while the lower surface thereof is fixed with the force guiding ejector disk rigidly connected with the force guiding cylinder; the interior of the force guiding cylinder is provided with the quartz cantilever beam sensitive element; one end of the quartz cantilever beam sensitive element is connected with a blind hole end surface of the force guiding cylinder by glass powder, while the other end thereof is connected with a blind hole of the metal shell side wall by utilizing glass powder. The flexibility of the invention is 15 times higher than the conventional surface wave sensor, and the surface acoustic wave pressure sensor of the invention is suitable for the wireless monitoring of the tire pressure of carts.
Owner:SHANGHAI JIAO TONG UNIV

Quartz girder resonant mode micro-pressure sensor chip with silicon substrate single island structure

A quartz girder resonant mode micro-pressure sensor chip with a silicon substrate single island structure comprises a quartz girder which is bonded on the front of the silicon substrate through low stress adhesive glue. Four opposite angles of the quartz girder are directed at four alignment markers on the front of the silicon substrate. The back of the silicon substrate is connected with a glass substrate in a sealing mode. The front of the glass substrate corrodes a groove. A pressure hole is formed at the center of the groove. The pressure hole is communicated with the atmosphere to form a gauge pressure sensor, or is communicated with the other tested atmosphere to form a differential pressure type sensor. The back of the silicon substrate corrodes the groove to form a silicon island. The quartz girder is driven to self-oscillate with an inverse piezoelectric effect of the quartz and when vibration frequency is equal to the inherent frequency of the quartz girder, resonance oscillation occurs. Resonant frequency is tested under a closed-loop feedback control system. Variable quantity of the resonant frequency represents the size of air pressure to be tested, and therefore the measurement of the outside air to be measured can be realized. The quartz girder resonant mode micro-pressure sensor chip with the silicon substrate single island structure has the advantages of being high in sensitivity, high in accuracy and high in resolution ratio.
Owner:陕西麟德惯性电气有限公司
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