The invention discloses a high-frequency low
dielectric loss
benzocyclobutene resin and its preparation method and application. The 1,3-position
diene,
benzocyclobutene group, vinyl compound, initiator and
organic solvent are polymerized under the conditions of 5°C to 78°C and then treated to obtain a high-frequency low
dielectric loss
benzocyclobutene resin. The high-frequency low
dielectric loss benzocyclobutene resin prepared by the present invention has excellent
thermal stability, mechanical properties and dielectric properties after high-temperature curing. At a frequency of 10 GHz, its dielectric constant (Dk) is 2.35-2.60,
dielectric loss (Df) is 0.0004-0.0007, T 5% The
thermal decomposition temperature is 442‑465°C, and the
thermal expansion coefficient of the cured resin is 32‑88ppm / °C@50°C. Therefore, it can be used as high-temperature resistant dielectric materials, high-performance composite materials,
electronic packaging materials, and
aviation materials; it can be used in 5G / 6G high-frequency PCB boards and interlayer packaging of chips, etc.