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Photosensitive polyimide resin, polyimide photocuring coating and preparation method thereof

A technology of polyimide resin and polyimide light, applied in the direction of coating, etc., can solve the problem of inability to prepare high light transmittance and heat resistance photosensitive polyimide

Pending Publication Date: 2021-09-14
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problem in the prior art that it is impossible to prepare a photosensitive polyimide that satisfies both high light transmittance and heat resistance, the present invention provides a photosensitive polyimide resin

Method used

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  • Photosensitive polyimide resin, polyimide photocuring coating and preparation method thereof
  • Photosensitive polyimide resin, polyimide photocuring coating and preparation method thereof
  • Photosensitive polyimide resin, polyimide photocuring coating and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0065] A photosensitive polyimide resin and a polyimide photocurable coating.

[0066] (1) Photosensitive polyimide resin preparation:

[0067] S1: Room temperature is added to 250 ml of four-port round bottom flasks equipped with mechanical stirring and nitrogen, bis (trifluoromethyl) -4,4'-diaminobenzene and 25 g N-methylpyrrolidone , Stir until the clarified solution. Slowly mixed 5.553 g 2, 2'-double (3,4-dicarboxylic acid) hexafluoropropane dianhydride under vigorous stirring, and the last addition amount was less than or equal to half of the previous one. The reaction was at room temperature for 8 h.

[0068] S2: Slowly add 1.8 g of 4-aminobenzoic acid, 12.5 g of dichlorobenzene, 5 g of N-methylpyrrolidone, at room temperature under stirring at room temperature, to obtain a polyamic acid solution having a carboxyl group having a carboxyl group. The thermimidation reaction was 10 h heated to 240 ° C, and the thermimidation reaction was 12 h in the case of solvent reflux.

[0...

Embodiment 2

[0074] A photosensitive polyimide resin and a polyimide photocurable coating.

[0075] (1) Photosensitive polyimide resin preparation:

[0076] S1: Room temperature was added 1.685 g4, 4'-diaminiphenylene ether and 25 g of N-methylpyrrolidone, stirred to a clear solution. Slowly mixed 5.553 g 2, 2'-double (3,4-dicarboxylic acid) hexafluoropropane dianhydride under vigorous stirring, and the last addition amount was less than or equal to half of the previous one. The reaction was at room temperature for 8 h.

[0077] S2: Slowly add 1.8 g of 4-aminobenzoic acid, 12.5 g of dichlorobenzene, 5 g of N-methylpyrrolidone, at room temperature under stirring at room temperature, to obtain a polyamic acid solution having a carboxyl group having a carboxyl group. Thermimidation reaction was heated to 230 ° C, and the thermimidation reaction was 12 h under the case of solvent reflux.

[0078] S3: Cooling to 110 ° C, slowly add 1.4 g of methacrylate, 0.042 g of phenol, 0.042 g of triphenylphosp...

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Abstract

The invention discloses a photosensitive polyimide resin, a polyimide photocuring coating and a preparation method thereof. The structure of the photosensitive polyimide resin is as follows: a main chain structure contains a large number of alicyclic and benzene ring structures, and photosensitive groups are introduced at the tail end of the polyimide resin through benzene ring and carboxyl structures, so that the photosensitive polyimide resin is enabled to have good heat resistance and light sensitivity; and the main chain structure contains fluorine functional groups, so that the solubility of polyimide is improved, and the transparency and hydrophobicity of a polyimide photocuring coating are improved. The polyimide photocuring coating prepared by adopting an ultraviolet curing technology has photosensitivity, high transparency and good heat resistance, the light transmittance of the polyimide photocuring coating can reach 90%, and the polyimide photocuring coating can be widely applied to the fields of space flight and aviation, automobile industry and microelectronics.

Description

Technical field [0001] The present invention belongs to the technical field of photosensitive resin material, and more particularly to a photosensitive polyimide resin, a polyimide photocurable coating and a preparation method thereof. Background technique [0002] Polyimide (PI) is used as a functional material to obtain more and more widely used in the microelectronics industry, but since the usual polyimide does not have photosensitive properties, it is used as a membrane pattern in the microelectronic device, Other photosensitive materials must be used at the same time, so that the entire lithographic process is complex and the production efficiency is low. Therefore, photosensitive polyimide (PSPI) materials are highly valued. [0003] With the development of high-tech industries, light guides, waveguides, and liquid crystal displays such as optically resistant, transparent polyimide, photosensitive polyimide (PSPI) are very far - reaching significance. However, in the prior...

Claims

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Application Information

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IPC IPC(8): C08G73/10C09D179/08
CPCC08G73/1078C08G73/1039C08G73/1017C09D179/085
Inventor 霍延平涂范霖向洪平陈丽芬
Owner GUANGDONG UNIV OF TECH
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